公开(公告)号：US20240286243A1

公开(公告)日：2024-08-29

申请号：US18453322

申请日：2023-08-22

Applicant: KCTECH CO., LTD.

Inventor： Sung Ho SHIN ,  Hee Cheul JUNG ,  Soo Ho KIM

IPC: B24B37/015

CPC classification number: B24B37/015

Abstract: Provided is a substrate polishing apparatus. The substrate polishing apparatus includes a carrier configured to grip a substrate, a polishing pad configured to polish a surface to be polished of the substrate gripped by the carrier while rotating, and a temperature control assembly configured to control a temperature of the polishing pad, and the temperature control assembly includes Deionized water (DIW) spraying module configured to spray DIW toward the polishing pad and a guide vane configured to guide at least a portion of the DIW sprayed from the DIW spraying module to an outside of the polishing pad.