公开(公告)号：US20220305611A1

公开(公告)日：2022-09-29

申请号：US17697891

申请日：2022-03-17

Applicant: KCTECH CO., LTD.

Inventor： Hee Cheul JUNG ,  Geun Sik YUN ,  Hyung Seob SHIM ,  Sung Ho SHIN

IPC: B24B37/015 ,  B24B37/20 ,  B24B57/02 ,  B24B55/03

Abstract: A substrate polishing method for polishing a substrate through a polishing pad according to an embodiment may comprise: a preheating step of increasing the temperature of the polishing pad by supplying heated pure water to the polishing pad before polishing the substrate; and a temperature control step of controlling the temperature of the polishing pad by adjusting the temperature of the slurry supplied to the polishing pad in a polishing process of the substrate.