公开(公告)号：US20230271228A1

公开(公告)日：2023-08-31

申请号：US18112398

申请日：2023-02-21

Applicant: KCTECH CO., LTD.

Inventor： Geun Sik YOON

IPC: B08B3/02 ,  B08B1/00 ,  B08B3/10

CPC classification number: B08B3/022 ,  B08B1/002 ,  B08B3/10 ,  H01L21/67051

Abstract: Disclosed are a substrate processing apparatus and a cleaning nozzle for substrate processing included therein. More particularly, a substrate processing apparatus, including: a support for holding a disk-shaped substrate; and a cleaning nozzle for spraying a mixed fluid, in which liquid and gas are mixed, to a surface of the substrate in a slit shape through a slit-shaped discharge port to remove foreign substances remaining on the substrate with the mixed fluid discharged from the discharge port is provided. Accordingly, a substrate processing apparatus capable of improving the mixing uniformity of gas and liquid in a slit-shaped discharge fluid; and a cleaning nozzle for substrate processing used therefor are provided.