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公开(公告)号：US12187919B2
公开(公告)日：2025-01-07
申请号：US17552932
申请日：2021-12-16
Applicant: KCTECH CO., LTD.
Inventor： Jin Sook Hwang , Hyun Goo Kong , Yun Su Kim
IPC: C09G1/02 , B82Y40/00 , H01L21/304
Abstract: A polishing slurry composition is provided. The polishing slurry composition includes polishing particles, a first polishing inhibitor containing a hydrophobic amino acid, and a second polishing inhibitor containing a cyclic polymer, and the first polishing inhibitor and the second polishing inhibitor are different.
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