摘要:
A semiconductor memory device having an open bitline memory structure from which an edge dummy memory block is removed, the semiconductor memory device includes a memory block, an edge sense amplification block including a first sense amplifier having a first bitline, a first complementary bitline, and a first amplification circuit comprising a first transistor having a first size, a central sense amplification block including a second sense amplifier having a second bitline, a second complementary bitline, and a second amplification circuit comprising a second transistor having a second size different from the first size, a capacitor block electrically connected to the edge sense amplification block.
摘要:
A semiconductor memory device having an open bitline memory structure from which an edge dummy memory block is removed, the semiconductor memory device includes a memory block, an edge sense amplification block including a first sense amplifier having a first bitline, a first complementary bitline, and a first amplification circuit comprising a first transistor having a first size, a central sense amplification block including a second sense amplifier having a second bitline, a second complementary bitline, and a second amplification circuit comprising a second transistor having a second size different from the first size, a capacitor block electrically connected to the edge sense amplification block.
摘要:
A semiconductor memory device includes a memory cell array block including a plurality of memory cells each connected to one of a plurality of bit lines and one of a plurality of word lines, a sense amplifier connected to a half of the plurality of bit lines, the sense amplifier for sensing and amplifying a voltage between each of the half of the bit lines and a corresponding complementary bit line; and a dummy block connected to the half of the plurality of bit lines of the memory cell array block, the dummy block for controlling a load on the memory cell array block to be different from a load on the dummy block according to a dummy load signal.
摘要:
Provided is a semiconductor device for performing charge pumping. The semiconductor device may include a first pumping unit, a second pumping unit, and a controller. The first pumping unit may be configured to output a boosted voltage via an output node by using a first input signal and the initial voltage, where the boosted voltage is greater than an initial voltage. The second pumping unit may be configured to output the boosted voltage via the output node by using a second input signal and the initial voltage. The controller may be configured to control the first and second pumping units. Each of the first and second pumping units may include an initialization unit, a boosting unit, and a transmission unit. The initialization unit may be configured to control a voltage of a boosting node to be equal to the initial voltage during an initialization operation. The boosting unit may be configured to boost the voltage of the boosting node based on the first and second input signals. Also, the transmission unit may be configured to control output of the boosted voltage.
摘要:
Provided is a wave pipelined output circuit of a synchronous memory device. In the wave pipelined output circuit, paths for transferring data in a high frequency mode of the synchronous memory device are separated from paths for transferring the data in a low frequency mode of the synchronous memory device. The number of registers included in data output paths in the high frequency mode is reduced and the number of control signals used for data input/output of the registers is also reduced. Consequently, loads of the data output paths in the high frequency mode are decreased to improve a high frequency operation and reduce the chip area of the output circuit.
摘要:
An address buffer circuit for a semiconductor memory device wherein an address buffer is enabled (to output an internal address signal) in response to a first level of a control signal and, but is disabled in response to a second level of the control signal. An address buffer control unit generates the control signal at the second level in ‘no operation’ state (NOP command) in which the semiconductor memory device does not perform data accessing operations and generates the control signal at the first level while the semiconductor memory device performs data accessing operations, thereby reducing or minimizing the output of an internal address buffered and output by the address buffer at and thus reducing power consumption during no-operation states of the semiconductor memory device.
摘要:
A data output circuit includes a plurality of registers and a plurality of register output selection switches that are respectively connected to the plurality of registers. Pairs of the plurality of register output selection switches are connected by respective common active regions. A first data group selection switch is connected to the common active regions of a first set of the plurality of register output selection switches. A second data group selection switch is connected to the common active regions of a second subset of the plurality of register output selection switches. An output driver is connected to the first and second data group selection switches.
摘要:
A semiconductor device may include a first terminal electrically connected to a first semiconductor chip, a second terminal electrically connected to a second semiconductor chip, which is different from the first semiconductor chip, a first signal line electrically connecting the first terminal and the second terminal and including a first node, a third terminal connected to a tester monitoring a signal transmitted between the first semiconductor chip and the second semiconductor chip, a fourth terminal applied a reference voltage, a second signal line electrically connecting the third terminal and the fourth terminal and including a second node, a first resistor connected between the first node and the second node and a second resistor directly connected to the second node different from the first resistor.
摘要:
A power supply device includes; first/second boost circuits that boost voltages applied to a first/second boost nodes in response to a first/second main signals, and respectively operated first/second transmission unit that control provision of boosted voltages to an output node. The power supply device also includes a bulk voltage controller connected between the boosted nodes and controlling a connection between the output node and a bulk node in response to a bulk control signal. Voltages respectively applied to the first and second transmission units are determined in response to an output node voltage, as well as the first/second main signals.
摘要:
A power supply device includes; first/second boost circuits that boost voltages applied to a first/second boost nodes in response to a first/second main signals, and respectively operated first/second transmission unit that control provision of boosted voltages to an output node. The power supply device also includes a bulk voltage controller connected between the boosted nodes and controlling a connection between the output node and a bulk node in response to a bulk control signal. Voltages respectively applied to the first and second transmission units are determined in response to an output node voltage, as well as the first/second main signals.