公开(公告)号：US20160189583A1

公开(公告)日：2016-06-30

申请号：US14973296

申请日：2015-12-17

Applicant: Kyung-Sang Cho ,  Jae-Wook Lee ,  Chul-Ho Kim ,  Jin-Hyuk Lee

Inventor： Kyung-Sang Cho ,  Jae-Wook Lee ,  Chul-Ho Kim ,  Jin-Hyuk Lee

IPC: G09G3/04

CPC classification number: G09G3/20 ,  G09G2310/0275 ,  G09G2330/021 ,  G09G2360/18

Abstract: Devices that include a logic circuit and first and second buffers are provided. The first buffer is spaced apart from the logic circuit by a first distance (and/or is refreshed in a first cycle), and the second buffer is spaced apart from the logic circuit by a second distance that is shorter than the first distance (and/or is refreshed in a second cycle that is different from the first cycle). Moreover, the logic circuit is configured to output, to the first buffer, first data corresponding to fewer toggles than second data that is output from the logic circuit to the second buffer. Methods of operating the devices are also provided.

Abstract translation: 提供了包括逻辑电路和第一和第二缓冲器的设备。 第一缓冲器与逻辑电路间隔第一距离（和/或在第一周期中刷新），并且第二缓冲器与逻辑电路隔开比第一距离短的第二距离（和 /或在与第一周期不同的第二周期中刷新）。 此外，逻辑电路被配置为向第一缓冲器输出与从逻辑电路输出到第二缓冲器的第二数据相比较少的切换的第一数据。 还提供了操作设备的方法。

公开(公告)号：US08612836B2

公开(公告)日：2013-12-17

申请号：US13025463

申请日：2011-02-11

Applicant: Han Bin Yoon ,  Mi Kyoung Jang ,  Jin-Hyuk Lee

Inventor： Han Bin Yoon ,  Mi Kyoung Jang ,  Jin-Hyuk Lee

IPC: H03M13/00

CPC classification number: G06F12/0246 ,  G06F11/1068 ,  G06F2212/1032 ,  G06F2212/7207 ,  H03M13/05

Abstract: The non-volatile memory system includes a non-volatile memory and a controller. The non-volatile memory includes a data region including a sector region for storing sector data, and an uncorrectable information region for storing uncorrectable sector information on the sector region. The controller includes an information generation unit for generating the uncorrectable sector information that indicates whether the sector region is assigned to an uncorrectable sector region, according to a command output from a host.

Abstract translation: 非易失性存储器系统包括非易失性存储器和控制器。 非易失性存储器包括包括用于存储扇区数据的扇区区域的数据区域和用于在扇区区域上存储不可校正扇区信息的不可校正信息区域。 控制器包括信息生成单元，用于根据从主机输出的命令，生成指示扇区是否分配给不可校正扇区的不可校正扇区信息。

公开(公告)号：US20100287333A1

公开(公告)日：2010-11-11

申请号：US12772452

申请日：2010-05-03

Applicant: Jin-Hyuk LEE ,  Jang hwan KIM ,  Han-Chan JO ,  Yeong-Jae WOO ,  Dong hyun SONG

Inventor： Jin-Hyuk LEE ,  Jang hwan KIM ,  Han-Chan JO ,  Yeong-Jae WOO ,  Dong hyun SONG

IPC: G06F12/00 ,  G06F12/02 ,  G06F12/08

CPC classification number: G06F12/0873 ,  G06F2212/214 ,  G06F2212/261

Abstract: A data storage device comprises a plurality of memory devices, a buffer memory, and a controller. The plurality of memory devices are connected to a plurality of channels and a plurality of ways. The buffer memory temporarily stores data to be written in the memory devices. The controller stores the data in the buffer memory based on channel and way information of the memory devices.

Abstract translation: 数据存储装置包括多个存储器件，缓冲存储器和控制器。 多个存储器件连接到多个通道和多个通道。 缓冲存储器临时存储要写入存储器件的数据。 控制器基于存储器件的通道和方式信息将数据存储在缓冲存储器中。

公开(公告)号：US06721831B1

公开(公告)日：2004-04-13

申请号：US09644229

申请日：2000-08-23

Applicant: Jin Hyuk Lee

Inventor： Jin Hyuk Lee

IPC: G06F1342

CPC classification number: H04N21/43632 ,  H04L12/40058 ,  H04L12/40071

Abstract: A method for controlling a bus in a digital interface is disclosed. In the present method, after a self identifying process when a bus reset occurs, a determination is made whether a node which needs to transmit isochronous data is a new node which needs to newly transmit isochronous data or a previously connected node which had been transmitting isochronous data before the bus reset. Thereafter, priority is given to previously connected nodes in allocating channels and bandwidth to previously connected node(s).

Abstract translation: 公开了一种用于在数字接口中控制总线的方法。 在本方法中，在总线复位发生后的自识别处理之后，确定需要发送等时数据的节点是否需要新传送等时数据的新节点或已经发送等时同步的先前连接的节点 总线复位前的数据。 此后，在先前连接的节点分配信道和带宽时，优先考虑先前连接的节点。

公开(公告)号：US06709964B2

公开(公告)日：2004-03-23

申请号：US09944260

申请日：2001-08-30

Applicant: Jin Hyuk Lee

Inventor： Jin Hyuk Lee

IPC: H01L2144

CPC classification number: H01L23/49827 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0191 ,  Y02P70/613 ,  H01L2224/05599

Abstract: A semiconductor device package includes an integrated circuit chip having a plurality of chip pads thereon, and a plurality of ball pads rerouted from the chip pads, and a substrate including a plurality of substrate pads thereon. Solder joints, each physically and electrically connecting a ball pad and a substrate pad, are between the to package and the substrate. A stress-relieving film, which can be a polyimide or other dielectric film, lies away front amend between the package and the substrate. A plurality of via holes or metal regions are in the film at positions corresponding to the solder joints. The solder balls are formed on the package and the substrate or only on the package. The solder joints are through the via holes or attached to the metal regions. The stress-relieving film thus attaches to the solder joints and distributes stress in the solder joints over the stress-relieving film to reduce the probability of cracking the solder joints. The stress-relieving film does not contact the package and the substrate and thereby avoids causing interface delamination.

Abstract translation: 半导体器件封装包括其上具有多个芯片焊盘的集成电路芯片和从芯片焊盘重新布线的多个焊盘，以及在其上包括多个衬底焊盘的衬底。 每个物理上和电气上连接球垫和衬底焊盘的焊接点位于封装和衬底之间。 可以是聚酰亚胺或其它电介质膜的应力消除膜在封装和衬底之间的前面被修改。 多个通孔或金属区域位于对应于焊点的位置处的膜中。 焊料球形成在封装和基板上或仅在封装上。 焊点通过通孔或连接到金属区域。 因此，应力释放膜附着在焊点上，并在应力释放膜上分布焊点中的应力，以减少焊点断裂的可能性。 应力消除膜不接触封装和基板，从而避免引起界面分层。

公开(公告)号：US10366646B2

公开(公告)日：2019-07-30

申请号：US14973296

申请日：2015-12-17

Applicant: Kyung-Sang Cho ,  Jae-Wook Lee ,  Chul-Ho Kim ,  Jin-Hyuk Lee

Inventor： Kyung-Sang Cho ,  Jae-Wook Lee ,  Chul-Ho Kim ,  Jin-Hyuk Lee

IPC: G09G3/20

Abstract: Devices that include a logic circuit and first and second buffers are provided. The first buffer is spaced apart from the logic circuit by a first distance (and/or is refreshed in a first cycle), and the second buffer is spaced apart from the logic circuit by a second distance that is shorter than the first distance (and/or is refreshed in a second cycle that is different from the first cycle). Moreover, the logic circuit is configured to output, to the first buffer, first data corresponding to fewer toggles than second data that is output from the logic circuit to the second buffer. Methods of operating the devices are also provided.

公开(公告)号：US08551899B2

公开(公告)日：2013-10-08

申请号：US13203039

申请日：2010-02-24

Applicant: Yong Yi Kim ,  Si Moo Lee ,  Seon Jin Kim ,  Jin Hyuk Lee

Inventor： Yong Yi Kim ,  Si Moo Lee ,  Seon Jin Kim ,  Jin Hyuk Lee

IPC: C03C3/087 ,  C03C3/095

CPC classification number: C03C4/02 ,  C03C3/091

Abstract: The present invention relates to a dark neutral green gray soda-lime glass composition comprising, as a colorant ingredient per 100 weight parts of a base glass composition, 1.4 to 2.5 weight parts of total Fe2O3, 0.02 to 0.04 weight parts of CoO, 0.0001 to 0.004 weight parts of Se, 0.005 to 0.5 weight parts of MnO2, and 0.05 to 1 weight parts of CeO2. The glass composition of the present invention has a visible light transmittance (LTA) of 15% or less, an ultraviolet ray transmittance (Tuv) of 0 to 1%, and a solar transmittance (Tsol) of 15% or less, measured for a reference thickness of 4 mm. As described above, the glass composition of the present invention is excellent in absorbing ultraviolet rays and solar heat, and therefore can be valuably used in privacy glass or a sunroof of a motor vehicle, or in glass used for construction.

Abstract translation: 本发明涉及一种深色中性绿色灰白色钠钙玻璃组合物，其包含作为着色剂成分的每100重量份的基础玻璃组合物，1.4-2.5重量份的总Fe 2 O 3，0.02-0.04重量份的CoO，0.0001至 Se，0.004重量份，MnO 2 0.005〜0.5重量份，CeO 2 0.05重量份。 本发明的玻璃组合物的可见光透射率（LTA）为15％以下，紫外线透射率（Tuv）为0〜1％，太阳光透射率（T sol）为15％以下， 参考厚度为4 mm。 如上所述，本发明的玻璃组合物吸收紫外线和太阳能热量优异，因此可以有价值地用于隐私玻璃或机动车辆的天窗或建筑用玻璃中。

公开(公告)号：US20120058879A1

公开(公告)日：2012-03-08

申请号：US13203039

申请日：2010-02-24

Applicant: Yong Yi Kim ,  Si Moo Lee ,  Seon Jin Kim ,  Jin Hyuk Lee

Inventor： Yong Yi Kim ,  Si Moo Lee ,  Seon Jin Kim ,  Jin Hyuk Lee

IPC: C03C3/095

CPC classification number: C03C4/02 ,  C03C3/091

Abstract: The present invention relates to a dark neutral green gray soda-lime glass composition comprising, as a colorant ingredient per 100 weight parts of a base glass composition, 1.4 to 2.5 weight parts of total Fe2O3, 0.02 to 0.04 weight parts of CoO, 0.0001 to 0.004 weight parts of Se, 0.005 to 0.5 weight parts of MnO2, and 0.05 to 1 weight parts of CeO2. The glass composition of the present invention has a visible light transmittance (LTA) of 15% or less, an ultraviolet ray transmittance (Tuv) of 0 to 1%, and a solar transmittance (Tsol) of 15% or less, measured for a reference thickness of 4 mm. As described above, the glass composition of the present invention is excellent in absorbing ultraviolet rays and solar heat, and therefore can be valuably used in privacy glass or a sunroof of a motor vehicle, or in glass used for construction.

Abstract translation: 本发明涉及一种深色中性绿色灰白色钠钙玻璃组合物，其包含作为着色剂成分的每100重量份的基础玻璃组合物，1.4-2.5重量份的总Fe 2 O 3，0.02-0.04重量份的CoO，0.0001至 Se，0.004重量份，MnO 2 0.005〜0.5重量份，CeO 2 0.05重量份。 本发明的玻璃组合物的可见光透射率（LTA）为15％以下，紫外线透射率（Tuv）为0〜1％，太阳光透射率（T sol）为15％以下， 参考厚度为4 mm。 如上所述，本发明的玻璃组合物吸收紫外线和太阳能热量优异，因此可以有价值地用于隐私玻璃或机动车辆的天窗或建筑用玻璃中。

公开(公告)号：US20080113857A1

公开(公告)日：2008-05-15

申请号：US11908782

申请日：2006-06-21

Applicant: Jin Hyuk Lee ,  Si Moo Lee ,  Jae Wook Lee

Inventor： Jin Hyuk Lee ,  Si Moo Lee ,  Jae Wook Lee

IPC: C03C3/085 ,  C03C3/087 ,  C03C3/078

CPC classification number: C03C3/087 ,  C03C3/078

Abstract: The present invention relates to a glass substrate composition comprising SiO2 55˜70 wt %, Al2O3 0˜1 wt %, ZrO2 0.1˜5 wt %, Na2O 0.1˜5 wt %, K2O 7˜13 wt %, MgO 7˜14 wt %, CaO 0˜4 wt %, SrO 7˜12 wt % and SO3 0.01˜0.5 wt %. The glass substrate prepared by using the above composition shows less thermal deformation at a baking process under a high temperature since the strain point of the glass is at least 570° C., does not have such disadvantages as increase of fuel cost and short life cycle of refractories resulted from less than 1460° C. of melting point, and has 80˜95×l0−7/° C. of thermal expansion coefficient in the temperature range of 50˜350° C. Therefore, the glass according to the present invention is suitable as a substrate.

Abstract translation: 本发明涉及包含SiO 2 55〜70重量％，Al 2 O 3 0〜1重量％的ZrO 2的玻璃基板组合物， 0.1〜5重量％，Na 2 O 0.1〜5重量％，K 2 O 7〜13重量％，MgO 7〜14 wt％，CaO 0〜4wt％，SrO 7〜12wt％，SO 3 0.01〜0.5wt％。 使用上述组合物制备的玻璃基板在高温下的烘烤过程中显示较少的热变形，因为玻璃的应变点至少为570℃，不具有燃料成本增加和寿命周期短的缺点 的耐火材料由低于1460℃的熔点导致，并且在50〜350℃的温度范围内具有80〜95×10 -3 /℃的热膨胀系数。因此， 根据本发明的玻璃适合作为基材。

公开(公告)号：US07247936B2

公开(公告)日：2007-07-24

申请号：US10739456

申请日：2003-12-17

Applicant: Dae-Woo Son ,  Jin-Hyuk Lee ,  Kwan-Jai Lee

Inventor： Dae-Woo Son ,  Jin-Hyuk Lee ,  Kwan-Jai Lee

IPC: H01L23/48

CPC classification number: H01L24/16 ,  H01L23/49544 ,  H01L23/49551 ,  H01L23/49572 ,  H01L24/50 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05099

Abstract: A semiconductor chip package includes an IC chip and a tape circuit substrate. The tape circuit substrate has a base film and a plurality of beam leads formed on the base film. One end portion of each beam lead extends from the base film, and the extended portion has a widthwise wavy portion. The widthwise wavy portion may be, for example, semicircular shaped, S-shaped or zig-zag shaped. The IC chip has chip pads formed on a top surface thereof.

Abstract translation: 半导体芯片封装包括IC芯片和磁带电路基板。 带状电路基板具有基膜和形成在基膜上的多个光束引线。 每个光束引线的一个端部从基膜延伸，并且延伸部分具有宽度方向的波浪形部分。 横向波状部分可以是例如半圆形，S形或锯齿形。 IC芯片具有形成在其顶表面上的芯片焊盘。