公开(公告)号：US07575344B2

公开(公告)日：2009-08-18

申请号：US11774561

申请日：2007-07-07

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai ,  Jen-Hui Tsai ,  Tung-Chuan Wu

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai ,  Jen-Hui Tsai ,  Tung-Chuan Wu

IPC: F21V5/02

CPC classification number: F21S13/12 ,  F21S6/003 ,  F21V5/04 ,  F21V5/045 ,  F21Y2103/00

Abstract: An improved lamp fixture with anti-glare function is disclosed, which comprises: a lamp; a light source; and a light-control unit, composed of a semi-Fresnel microstructure and a light-control microstructure; wherein the light source and the light-control unit are mounted on the lamp; and the semi-Fresnel microstructure is used for diffusing/collimating light of the light source while the light-control microstructure is used for controlling the resulting lighting angle. With the aforesaid lamp fixture, not only glare can be prevented, but also uniformity of the lamp fixture is improved.

Abstract translation: 公开了一种具有防眩光功能的改进的灯具，其包括：灯; 光源; 以及由半菲涅耳微结构和光控微结构组成的光控单元; 其中所述光源和所述光控制单元安装在所述灯上; 并且半菲涅尔微结构用于扩散/准直光源的光，而光控微结构用于控制所得的照明角度。 利用上述灯具，不仅可以防止眩光，还能提高灯具的均匀性。

公开(公告)号：US08659160B2

公开(公告)日：2014-02-25

申请号：US13186411

申请日：2011-07-19

Applicant: Meng-Chi Huang ,  Han-Ping Yang ,  Min-Chieh Chou ,  Tune-Hune Kao ,  Jung-Kang Peng ,  Cheng-Hsuan Lin ,  Jian-Shian Lin

Inventor： Meng-Chi Huang ,  Han-Ping Yang ,  Min-Chieh Chou ,  Tune-Hune Kao ,  Jung-Kang Peng ,  Cheng-Hsuan Lin ,  Jian-Shian Lin

IPC: H01L23/48

CPC classification number: H01L33/0079 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2933/0075 ,  H01L2924/00014

Abstract: A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.

Abstract translation: 模具结构，制造方法和基板，其中，所述模具结构由晶片上的芯片（COW）和所述基板构成，所述基板通过层叠形成，然后切割多个导热极和多个导电极 的绝缘材料层。 此外，模具结构的制造包括承载在载体板上的多个COW结合在基板上，多个COW与基板上的多个热导电极接触，然后载板是 删除。 之后，在多个COW上粘接荧光体板，形成层叠结构。 此后，切割堆叠结构，从而形成具有至少一个COW的多个模具结构。

公开(公告)号：US08235551B2

公开(公告)日：2012-08-07

申请号：US12634468

申请日：2009-12-09

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai ,  Hsiu-Jen Lin ,  Weng-Jung Lu ,  Yi-Ping Huang ,  Ya-Chun Tu

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai ,  Hsiu-Jen Lin ,  Weng-Jung Lu ,  Yi-Ping Huang ,  Ya-Chun Tu

IPC: F21S4/00 ,  F21V21/00 ,  H01L23/48

CPC classification number: F21V19/02 ,  F21K9/00 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/29339 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract translation: 一种发光二极管（LED）模块和一种LED封装方法。 由于LED模块在考虑到烛光分布的情况下被封装，所以封装在LED模块中的LED芯片的每个引线框架被弯曲以使LED芯片以不同的角度倾斜以呈现各种照明效果。 同时，在LED封装方法中，可以通过一次操作快速地将多个LED芯片加载在一起，从而导致烛光分布曲线的偏差较小。

公开(公告)号：US20110127563A1

公开(公告)日：2011-06-02

申请号：US12854278

申请日：2010-08-11

Applicant: Hsiu Jen Lin ,  Jian Shian Lin ,  Shau Yi Chen ,  Chieh Lung Lai

Inventor： Hsiu Jen Lin ,  Jian Shian Lin ,  Shau Yi Chen ,  Chieh Lung Lai

IPC: H01L33/62 ,  H01L21/50

CPC classification number: H01L23/53247 ,  H01L24/29 ,  H01L24/83 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/30 ,  H01L33/40 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/83193 ,  H01L2224/83207 ,  H01L2224/8382 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/00014

Abstract: A die-bonding method is suitable for die-bonding a LED chip having a first metal thin-film layer to a substrate. The method includes forming a second metal thin film layer on a surface of the substrate; forming a die-bonding material layer on the second metal thin film layer; placing the LED chip on the die-bonding material layer with the first metal thin film layer contacting the die-bonding material layer; heating the die-bonding material layer at a liquid-solid reaction temperature for a pre-curing time, so as to form a first intermetallic layer and a second intermetallic layer; and heating the die-bonding material layer at a solid-solid reaction temperature for a curing time, so as to perform a solid-solid reaction. The liquid-solid reaction temperature and the solid-solid reaction temperature are both lower than 110° C., and a melting point of the first and second intermetallic layers after the solid-solid reaction is higher than 200° C.

Abstract translation: 芯片接合方法适合于将具有第一金属薄膜层的LED芯片芯片接合到基板上。 该方法包括在基板的表面上形成第二金属薄膜层; 在所述第二金属薄膜层上形成芯片接合材料层; 将第一金属薄膜层与芯片接合材料层接触，将LED芯片放置在芯片接合材料层上; 在液固固体反应温度下加热芯片接合材料层预固化时间，以形成第一金属间层和第二金属间层; 并在固 - 固反应温度下加热芯片接合材料层达固化时间，以进行固 - 固反应。 液固反应温度和固 - 固反应温度均低于110℃，固 - 固反应后第一和第二金属间化合物的熔点高于200℃。

公开(公告)号：US20100157595A1

公开(公告)日：2010-06-24

申请号：US12634468

申请日：2009-12-09

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai ,  Hsiu-Jen Lin ,  Weng-Jung Lu ,  Yi-Ping Huang ,  Ya-Chun Tu

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai ,  Hsiu-Jen Lin ,  Weng-Jung Lu ,  Yi-Ping Huang ,  Ya-Chun Tu

IPC: F21V7/00 ,  F21S4/00 ,  H01L21/50 ,  H01L21/66

CPC classification number: F21V19/02 ,  F21K9/00 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/29339 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract translation: 一种发光二极管（LED）模块和一种LED封装方法。 由于LED模块在考虑到烛光分布的情况下被封装，所以封装在LED模块中的LED芯片的每个引线框架被弯曲以使LED芯片以不同的角度倾斜以呈现各种照明效果。 同时，在LED封装方法中，可以通过一次操作快速地将多个LED芯片加载在一起，从而导致烛光分布曲线的偏差较小。

公开(公告)号：US20090009868A1

公开(公告)日：2009-01-08

申请号：US11947792

申请日：2007-11-30

Applicant: Mao-Jen Wu ,  Jian-Shian Lin ,  Chih-Chieh Su ,  Che-Lung Hsu ,  Zong-Ru Tu ,  Jenq-Yang Chang

Inventor： Mao-Jen Wu ,  Jian-Shian Lin ,  Chih-Chieh Su ,  Che-Lung Hsu ,  Zong-Ru Tu ,  Jenq-Yang Chang

IPC: G02B5/18

CPC classification number: G02B6/124 ,  B42D25/328 ,  G02B6/13

Abstract: A diffraction grating recording medium including a waveguide layer and a grating structure layer is provided. The waveguide layer has a reflective surface and a light incident surface, in which a thickness of the waveguide layer is between 100 nanometers and 2 micrometers, and the reflective surface reflects a light that enters the waveguide layer from the light incident layer. The grating structure layer is disposed on the light incident surface of the waveguide layer, in which the grating structure layer has a plurality of diffractive elements, and the arranging period of the diffractive elements is between 50 nanometers and 900 nanometers.

Abstract translation: 提供了包括波导层和光栅结构层的衍射光栅记录介质。 波导层具有反射表面和光入射表面，其中波导层的厚度在100纳米和2微米之间，并且反射表面反射从光入射层进入波导层的光。 光栅结构层设置在波导层的光入射表面上，其中光栅结构层具有多个衍射元件，衍射元件的布置周期在50纳米到900纳米之间。

公开(公告)号：US20070147727A1

公开(公告)日：2007-06-28

申请号：US11540972

申请日：2006-10-02

Applicant: Yen-Chieh Mao ,  Jian-Shian Lin ,  Lai-Sheng Chen ,  Wei-Han Wang

Inventor： Yen-Chieh Mao ,  Jian-Shian Lin ,  Lai-Sheng Chen ,  Wei-Han Wang

IPC: G02B6/00

CPC classification number: G01N21/7703 ,  G01N21/553 ,  G01N2021/7773

Abstract: An optical waveguide bio-sensing device, comprising: a monochromatic light source, a beam splitter, a grating chip with a sub-wavelength grating structure and a sensor. Moreover, in order to enhance the sensitivity of the system using the optical waveguide bio-sensing device, a light concentrating element or a quarter waveplate (¼λ) is arranged in the optical path during detection. When the grating chip is not coated with a layer of biochemical substance corresponding to a monochrome light emitted from the monochromatic light source, a reflected light of a specific narrow wavelength is reflected by a specific angle as a surface plasmon resonant effect caused by waveguide coupling is excited by the incidence of the monochrome light to the grating chip through the beam splitter; otherwise, there will be little or no reflection. Accordingly, the optical waveguide bio-sensing device can detect bio-molecular interactions, reaction rate and/or molecular dynamics without any labeling in real time. Optical systems using the present invention are simplified and capable of being portable. Thus a high sensitivity detection technique is achieved.

Abstract translation: 一种光波导生物感测装置，包括：单色光源，分束器，具有亚波长光栅结构的光栅芯片和传感器。 此外，为了提高使用光波导生物感测装置的系统的灵敏度，在检测期间在光路中布置光聚集元件或四分之一波片（λ=λ）。 当光栅芯片没有涂覆与从单色光源发射的单色光相对应的生物化学物质层时，由于波导耦合引起的表面等离子体共振效应，特定窄波长的反射光被反射特定角度 由单色光通过分束器激发到光栅芯片; 否则，会有很少或没有反映。 因此，光波导生物传感装置可以实时检测生物分子相互作用，反应速率和/或分子动力学，而无需任何标记。 使用本发明的光学系统被简化并能够便携。 因此实现了高灵敏度检测技术。

公开(公告)号：US07217010B2

公开(公告)日：2007-05-15

申请号：US11088792

申请日：2005-03-25

Applicant: Jian-Shian Lin ,  Hsiu-Chen Hsu ,  Min-Lung Hsieh

Inventor： Jian-Shian Lin ,  Hsiu-Chen Hsu ,  Min-Lung Hsieh

IPC: F21V7/00

CPC classification number: F21V7/09 ,  F21V7/005 ,  F21V13/04 ,  F21Y2103/00 ,  F21Y2115/10

Abstract: A luminaire with reflector of negative focal length is disclosed, which comprises a light source and a luminaire screen having a reflector of negative focal length, a side screen and a plate; wherein the reflector of negative focal length is capable of reflecting the upward-incident rays emitted from the light source; and the side screen is capable of reflecting the sideward-incident rays emitted from the light source and the reflected rays of the reflector; and the plate being disposed at the lower portion of the luminaire screen beneath the light source has a plurality of micro-structures arranged thereon and is capable of accepting the rays of the downward incident area along with both the reflected rays of the reflector and the side screen so as to diffuse the same for discharging. By the luminaire screen of the invention, the rays emitting from the light source of the luminaire are reflected and directed to a preferred discharging area so as to enable the rays to be discharged out of the luminaire by large angles for reducing glare.

Abstract translation: 公开了一种具有负焦距反射器的照明装置，其包括光源和具有负焦距反射器，侧屏和板的照明屏幕; 其中负焦距的反射器能够反射从光源发射的向上入射的光线; 并且侧面屏幕能够反射从光源发射的侧射入射线和反射器的反射光线; 并且设置在光源下方的照明器屏幕的下部的板具有布置在其上的多个微结构，并且能够接收向下入射区域的光线以及反射器和侧面的反射光线 屏幕，以便扩散相同的放电。 通过本发明的照明器屏幕，从照明器的光源发射的光线被反射并被引导到优选的放电区域，以便使光线能够以大角度从灯具中排出以减少眩光。

公开(公告)号：US20130334561A1

公开(公告)日：2013-12-19

申请号：US13527318

申请日：2012-06-19

Applicant: Hsiu-Jen LIN ,  Jian-Shian Lin ,  Shau-Yi Chen ,  Jen-Hui Tsai

Inventor： Hsiu-Jen LIN ,  Jian-Shian Lin ,  Shau-Yi Chen ,  Jen-Hui Tsai

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/0079 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L33/0095 ,  H01L2224/2745 ,  H01L2224/27462 ,  H01L2224/29109 ,  H01L2224/29113 ,  H01L2224/83097 ,  H01L2224/83191 ,  H01L2224/83207 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/351 ,  H01L2924/01083 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2924/00

Abstract: A method for bonding an LED wafer, a method for manufacturing an LED chip, and a bonding structure are provided. The method for bonding an LED wafer includes the following steps. A first metal film is formed on an LED wafer. A second metal film is formed on a substrate. A bonding material layer whose melting point is lower than or equal to about 110° C. is formed on the surface of the first metal film. The LED wafer is placed on the substrate. The bonding material layer is heated at a pre-solid reaction temperature for a pre-solid time to perform a pre-solid reaction. The bonding material layer is heated at a diffusion reaction temperature for a diffusing time to perform a diffusion reaction, wherein the melting points of the first and the second inter-metallic layers after diffusion reaction are higher than about 110° C.

Abstract translation: 提供一种用于结合LED晶片的方法，制造LED芯片的方法和接合结构。 用于结合LED晶片的方法包括以下步骤。 在LED晶片上形成第一金属膜。 在基板上形成第二金属膜。 在第一金属膜的表面上形成熔点低于或等于约110℃的接合材料层。 将LED晶片放置在基板上。 将接合材料层在预固体反应温度下加热预固化时间以进行预固体反应。 接合材料层在扩散反应温度下加热扩散时间以进行扩散反应，其中扩散反应后第一和第二金属间层的熔点高于约110℃。

公开(公告)号：US20130139808A1

公开(公告)日：2013-06-06

申请号：US13555812

申请日：2012-07-23

Applicant: JIAN SHIAN LIN ,  YAO CHI PENG ,  TUNG CHUAN WU ,  TUNG CHENG PAN ,  YU TANG CHEN ,  WEN HUA ZHANG

Inventor： JIAN SHIAN LIN ,  YAO CHI PENG ,  TUNG CHUAN WU ,  TUNG CHENG PAN ,  YU TANG CHEN ,  WEN HUA ZHANG

IPC: F24J2/02 ,  F24J2/10 ,  F24J2/08

CPC classification number: F24S20/30 ,  F24S20/20 ,  F24S23/12 ,  F24S60/00 ,  F24S2023/872 ,  Y02B40/18 ,  Y02E10/41

Abstract: The disclosure relates to a solar heating device comprising at least one incidence collector and a thermal container. The thermal container includes at least one light absorbing recess, wherein at least one of the incidence collectors focuses solar beams on a focal point, which is located inside the light absorbing recess. The inner surface of the light absorbing recess converts the energy of the solar beams into radiant heating.

Abstract translation: 本公开涉及包括至少一个入射收集器和热容器的太阳能加热装置。 热容器包括至少一个光吸收凹部，其中至少一个入射收集器将太阳光束聚焦在位于光吸收凹部内的焦点上。 光吸收凹部的内表面将太阳光束的能量转换成辐射加热。