Device for fast taking out and putting in
    3.
    发明授权
    Device for fast taking out and putting in 失效
    快速取出和放入的装置

    公开(公告)号:US06505528B2

    公开(公告)日:2003-01-14

    申请号:US09880971

    申请日:2001-06-15

    Abstract: The invention is a device for fast taking out and putting in, especially the device can fast take out a chip from a wafer to put in another chip receptacle, wherein, the invention includes a gear set, which consists of a first big gear, a second big gear and a small gear; at least two driving device, which consists a first driving device and a second driving device; a link mechanism, which cooperates with the gear set to proceed that the link mechanism moves forth toward a non-horizontal direction and back toward the reverse direction, and moves down toward a non-vertical direction and up toward the reverse direction as well; a lift mechanism, which is driven by the first driving device, and a mold plate with gear set and link mechanism is then driven either to complete the actions of moving down toward a non-vertical direction and up toward the reverse direction as mentioned above. The second driving device drives gear set, which utilizes the rotation of gear set to complete the actions of moving forth toward a non-horizontal direction and back toward the reverse direction as mentioned above.

    Abstract translation: 本发明是用于快速取出和放入的装置,特别是装置可以从晶片快速取出芯片以放入另一个芯片插座,其中,本发明包括一个齿轮组,其包括第一大齿轮, 第二大齿轮和小齿轮; 至少两个驱动装置,其包括第一驱动装置和第二驱动装置; 连杆机构与齿轮组配合,以使连杆机构向非水平方向前进并朝向相反方向移动,并向着不垂直方向向下移动,朝向相反方向向上移动; 然后驱动由第一驱动装置驱动的升降机构和具有齿轮组和连杆机构的模板,以完成如上所述的向非垂直方向向下移动的向上的方向。 第二驱动装置驱动齿轮组,其利用齿轮组的旋转来完成如上所述的朝向非水平方向向前移动并朝向相反方向的动作。

    Ejector with multi-ejection pins
    4.
    发明申请
    Ejector with multi-ejection pins 失效
    喷射器具有多重喷射销

    公开(公告)号:US20060093698A1

    公开(公告)日:2006-05-04

    申请号:US10980317

    申请日:2004-11-04

    CPC classification number: H01L21/67132 H01L21/67092 H01L21/67121 Y10S425/06

    Abstract: An ejector with multi-ejection pins is used in the post-processes of the semiconductor industry and is used by a selection device to choose a predetermined quantity of ejection pins. When a propelling device lifts the selection device, a pin-base vertical driver controls the vertical motion of a pin base, and a pin-base motion device controls the planar motion of the pin base; the chosen ejection pins can be lifted to elevate the respective dies for separation from adhesive film.

    Abstract translation: 具有多个喷射销的喷射器用于半导体工业的后处理,并且由选择装置用于选择预定量的喷射销。 当推进装置升起选择装置时,针脚垂直驱动器控制销底座的垂直运动,并且销基运动装置控制销底座的平面运动; 可以提起所选择的弹出销以升高相应的模具以与粘合剂膜分离。

    Air-suspended die sorter
    5.
    发明授权
    Air-suspended die sorter 失效
    空气悬浮模具分选机

    公开(公告)号:US06592325B2

    公开(公告)日:2003-07-15

    申请号:US09887426

    申请日:2001-06-25

    CPC classification number: H01L21/67271 H01L21/6838

    Abstract: An air-suspended die sorter is disclosed, in particular an air-suspended die sorter capable of performing die sorting, die attaching and die pick-up in the semiconductor industry. The present invention provides an air-suspended die sorter capable of eliminating spring preload, and lowering mechanical friction so as to lift die sorting precision and elevate the success rate, and has a cylinder unit, a piston unit and a pressure unit. The piston type design and a precise control of pressure on top and on bottom of the piston, respectively, enables the present invention to offer an air-suspended state that has done away with stress problems associated with the use of springs. The present invention further provides a novel buffer design for reducing friction and die impact often encountered in prior art applications.

    Abstract translation: 公开了一种空气悬浮模具分选机,特别是一种能够在半导体工业中进行模具分选,模具附着和模具拾取的空气悬浮模具分选机。 本发明提供一种能够消除弹簧预载和降低机械摩擦从而提高模具分选精度并提高成功率的空气悬浮模具分拣机,并且具有气缸单元,活塞单元和压力单元。 活塞式设计和对活塞顶部和底部上的压力的精确控制使得本发明能够提供空气悬挂状态,其已经消除了与使用弹簧相关的应力问题。 本发明进一步提供了用于减少现有技术应用中经常遇到的摩擦和冲击冲击的新型缓冲设计。

    Robotic vacuum cleaner
    6.
    发明授权
    Robotic vacuum cleaner 有权
    机器人吸尘器

    公开(公告)号:US07861365B2

    公开(公告)日:2011-01-04

    申请号:US11537656

    申请日:2006-10-01

    Abstract: A robotic vacuum cleaner is disclosed in the present invention, which comprises a controller, at least a driving wheel module, and a dust-collecting module. The controller is disposed on a housing plate. The driving wheel module, electrically connecting to the controller, further includes: a driver; a wheel connecting to the output shaft of the driver; a linkage rod, having two ends pivotally fixed on the housing plate and the driver respectively; and a resilience element, having two ends pivotally connected to the housing plate and the driver respectively. The dust-collecting module, disposed on the housing plate, is capable of vacuuming for filtering and collecting dust.

    Abstract translation: 在本发明中公开了一种机器人吸尘器,其包括至少一个驱动轮模块和一个集尘模块的控制器。 控制器设置在壳体板上。 电连接到控制器的驱动轮模块还包括:驾驶员; 连接到驱动器的输出轴的轮; 连杆,分别枢转地固定在壳体板和驱动器上的两端; 以及弹性元件,其两端分别枢转地连接到壳体板和驱动器。 设置在壳体板上的集尘模块能够抽真空以过滤和收集灰尘。

    Ejector with multi-ejection pins
    7.
    发明授权
    Ejector with multi-ejection pins 失效
    喷射器具有多重喷射销

    公开(公告)号:US07198479B2

    公开(公告)日:2007-04-03

    申请号:US10980317

    申请日:2004-11-04

    CPC classification number: H01L21/67132 H01L21/67092 H01L21/67121 Y10S425/06

    Abstract: An ejector with multi-ejection pins is used in the post-processes of the semiconductor industry and is used by a selection device to choose a predetermined quantity of ejection pins. When a propelling device lifts the selection device, a pin-base vertical driver controls the vertical motion of a pin base, and a pin-base motion device controls the planar motion of the pin base; the chosen ejection pins can be lifted to elevate the respective dies for separation from adhesive film.

    Abstract translation: 具有多个喷射销的喷射器用于半导体工业的后处理,并且由选择装置用于选择预定量的喷射销。 当推进装置升起选择装置时,针脚垂直驱动器控制销底座的垂直运动,并且销基运动装置控制销底座的平面运动; 可以提起所选择的弹出销以升高相应的模具以与粘合剂膜分离。

    Automatic ball placing device
    9.
    发明授权
    Automatic ball placing device 失效
    自动球放置装置

    公开(公告)号:US5704536A

    公开(公告)日:1998-01-06

    申请号:US615556

    申请日:1996-03-12

    CPC classification number: B23K3/0623 B23K2201/40 H05K3/3478

    Abstract: An automatic ball placing device can automatically attach the solder ball to the pad of BGA's (Ball Grid Array) substrate. It comprises mainly a BGA substrate fixing device, a stencil fixing seat at least, a horizontal driving device, a vertical driving device and a swinging device. The BGA substrate possesses multiple stencil. The horizontal driving device and the vertical driving device can drive the said BGA substrate fixing device to perform horizontal and vertical movement respectively so as to move the BGA substrate to the position below the stencil fixing seat and thereby, make the solder balls drop into the mesh of the stencil which facilitates the solder balls to attach to the pad of BGA's substrate.

    Abstract translation: 自动球放置装置可以自动将焊球附着到BGA(球栅阵列)基板的焊盘上。 其主要包括BGA基板固定装置,至少一个模板固定座,水平驱动装置,垂直驱动装置和摆动装置。 BGA衬底具有多个模板。 水平驱动装置和垂直驱动装置可以驱动所述BGA基板固定装置分别进行水平和垂直移动,以便将BGA基板移动到模板固定座下方的位置,从而使焊球落入网格中 的模板,其有助于焊球附着到BGA衬底的焊盘。

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