公开(公告)号：US20130005055A1

公开(公告)日：2013-01-03

申请号：US13543418

申请日：2012-07-06

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai ,  Hsiu-Jen Lin ,  Weng-Jung Lu ,  Yi-Ping Huang ,  Ya-Chun Tu

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai ,  Hsiu-Jen Lin ,  Weng-Jung Lu ,  Yi-Ping Huang ,  Ya-Chun Tu

IPC: H01L33/62

CPC classification number: F21V19/02 ,  F21K9/00 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/29339 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract translation: 一种发光二极管（LED）模块和一种LED封装方法。 由于LED模块在考虑到烛光分布的情况下被封装，所以封装在LED模块中的LED芯片的每个引线框架被弯曲以使LED芯片以不同的角度倾斜以呈现各种照明效果。 同时，在LED封装方法中，可以通过一次操作快速地将多个LED芯片加载在一起，从而导致烛光分布曲线的偏差较小。

公开(公告)号：US20120168777A1

公开(公告)日：2012-07-05

申请号：US13021861

申请日：2011-02-07

Applicant: Chieh-Lung Lai ,  Chih-Sheng Hsu ,  Chang-Yueh Chan

Inventor： Chieh-Lung Lai ,  Chih-Sheng Hsu ,  Chang-Yueh Chan

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package structure includes: a carrier; at least a first protruding portion and a plurality of electrical contacts formed on the carrier; a plurality of LED chips disposed on the first protruding portion and on the carrier in a region free from the first protruding portion, respectively; a plurality of bonding wires electrically connecting theLED chips and the electrical contacts; and a phosphor covering the LED chips, the electrical contacts and the bonding wires. The LED chips are disposed at different heights so as to allow the portions of the phosphor on the LED chips to have different thicknesses and thus generate light with different color temperatures.

Abstract translation: LED封装结构包括：载体; 至少第一突出部分和形成在所述载体上的多个电触头; 分别设置在第一突出部分和载体上的多个LED芯片，分别位于没有第一突出部分的区域中; 电连接LED芯片和电触头的多个接合线; 以及覆盖LED芯片，电触点和接合线的荧光体。 LED芯片设置在不同的高度，以便允许LED芯片上的荧光体的部分具有不同的厚度，从而产生具有不同色温的光。

公开(公告)号：US20090135599A1

公开(公告)日：2009-05-28

申请号：US11964627

申请日：2007-12-26

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai

IPC: F21V21/00

CPC classification number: H05K3/301 ,  F21K9/00 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/10606

Abstract: A light source device is disclosed, which involves forming a plurality of carrier planes on a substrate with at least one of the carrier planes forming an angle relative to the substrate, and respectively mounting LEDs on the carrier planes and electrically connecting the LEDs with the carrier planes so as to obtain a preferred light distribution effect, thereby eliminating the need of additional light control element in the prior art and enhancing light emitting efficiency of the light source device.

Abstract translation: 公开了一种光源装置，其涉及在基板上形成多个载体平面，其中至少一个载体平面相对于基板形成一角度，并且分别将LED安装在载体平面上并将LED与载体电连接 平面，从而获得优选的配光效果，从而消除了现有技术中额外的光控制元件的需要，并提高了光源装置的发光效率。

公开(公告)号：US08716737B2

公开(公告)日：2014-05-06

申请号：US13530396

申请日：2012-06-22

Applicant: Hsiu Jen Lin ,  Jian Shian Lin ,  Shau Yi Chen ,  Chieh Lung Lai

Inventor： Hsiu Jen Lin ,  Jian Shian Lin ,  Shau Yi Chen ,  Chieh Lung Lai

IPC: H01L33/00 ,  H01L21/00 ,  H01L23/532 ,  H01L23/00 ,  H01L33/30 ,  H01L33/40 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L23/53247 ,  H01L24/29 ,  H01L24/83 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/30 ,  H01L33/40 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/83193 ,  H01L2224/83207 ,  H01L2224/8382 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/00014

Abstract: An LED includes a first intermetallic layer, a first metal thin film layer, an LED chip, a substrate, a second metal thin film layer, and a second intermetallic layer. The first metal thin film layer is located on the first intermetallic layer. The LED chip is located on the first metal thin film layer. The second metal thin film layer is located on the substrate. The second intermetallic layer is located on the second metal thin film layer, and the first intermetallic layer is located on the second intermetallic layer. Materials of the first and the second metal thin film layer are selected from a group consisting of Au, Ag, Cu, and Ni. Materials of the intermetallic layers are selected from a group consisting of a Cu—In—Sn intermetallics, an Ni—In—Sn intermetallics, an Ni—Bi intermetallics, an Au—In intermetallics, an Ag—In intermetallics, an Ag—Sn intermetallics, and an Au—Bi intermetallics.

Abstract translation: LED包括第一金属间层，第一金属薄膜层，LED芯片，基板，第二金属薄膜层和第二金属间层。 第一金属薄膜层位于第一金属间层上。 LED芯片位于第一金属薄膜层上。 第二金属薄膜层位于基板上。 第二金属间化合物层位于第二金属薄膜层上，第一金属间化合物层位于第二金属间层上。 第一和第二金属薄膜层的材料选自由Au，Ag，Cu和Ni组成的组。 金属间层的材料选自Cu-In-Sn金属间化合物，Ni-In-Sn金属间化合物，Ni-Bi金属间化合物，Au-In金属间化合物，Ag-In金属间化合物，Ag-Sn 金属间化合物和Au-Bi金属间化合物。

公开(公告)号：US20120127693A1

公开(公告)日：2012-05-24

申请号：US13023239

申请日：2011-02-08

Applicant: Chieh-Lung Lai ,  Chang-Yueh Chan ,  Jui-Feng Lai ,  Chih-Sheng Hsu

Inventor： Chieh-Lung Lai ,  Chang-Yueh Chan ,  Jui-Feng Lai ,  Chih-Sheng Hsu

IPC: F21V9/16 ,  B32B38/14 ,  B32B1/06 ,  B32B37/02

CPC classification number: H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  Y10T156/10 ,  Y10T428/234 ,  Y10T428/239 ,  H01L2924/00014

Abstract: A light-permeating cover board structure includes a first light-permeating board having a light-permeating substrate and a frame formed on the light-permeating substrate, wherein a first recess portion is defined by the frame and the light-permeating substrate; a first fluorescent material filled in the first recess portion; and a second light-permeating board disposed on the first light-permeating board and covering the first fluorescent material in the first recess portion. Therefore, the first light-permeating board and the second light-permeating board prevent the first fluorescent material from contacting moisture.

Abstract translation: 透光盖板结构包括：第一透光板，其具有透光基板和形成在透光基板上的框架，其中，第一凹部由框架和透光基板限定; 填充在第一凹部中的第一荧光材料; 以及第二透光板，其设置在所述第一透光板上并且覆盖所述第一凹部中的所述第一荧光体。 因此，第一透光板和第二透光板防止第一荧光体与水分接触。

公开(公告)号：US20110111539A1

公开(公告)日：2011-05-12

申请号：US12846839

申请日：2010-07-30

Applicant: Chieh-Lung Lai ,  Jian-Shian Lin ,  Hsiu-Jen Lin

Inventor： Chieh-Lung Lai ,  Jian-Shian Lin ,  Hsiu-Jen Lin

IPC: H01L33/60 ,  H01L33/64 ,  H01L33/62

CPC classification number: H01L33/641 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L24/97 ,  H01L25/0753 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A method of manufacturing a light emitting diode (LED) package includes disposing at least one LED chip on a first surface of a lead frame, and the LED chip is connected to the lead frame. At least one heat dissipation area corresponding to the LED chip is defined on a second surface of the lead frame. A thermal conductive material is disposed in the heat dissipation area. The thermal conductive material directly comes into contact with the lead frame. A solidification process is performed to solidify the thermal conductive material and form a plurality of heat dissipation blocks. The heat dissipation blocks directly come into contact with the lead frame, and the solidification process is performed at a temperature substantially lower than 300° C.

Abstract translation: 一种制造发光二极管（LED）封装的方法包括在引线框架的第一表面上设置至少一个LED芯片，并且LED芯片连接到引线框架。 在引线框架的第二表面上限定与LED芯片对应的至少一个散热区域。 导热材料设置在散热区域中。 导热材料直接与引线框接触。 进行凝固过程以固化导热材料并形成多个散热块。 散热块直接与引线框架接触，凝固过程在基本上低于300℃的温度下进行。

公开(公告)号：US07717587B2

公开(公告)日：2010-05-18

申请号：US11964627

申请日：2007-12-26

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai

IPC: F21V21/00

CPC classification number: H05K3/301 ,  F21K9/00 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/10606

Abstract: A light source device is disclosed, which involves forming a plurality of carrier planes on a substrate with at least one of the carrier planes forming an angle relative to the substrate, and respectively mounting LEDs on the carrier planes and electrically connecting the LEDs with the carrier planes so as to obtain a preferred light distribution effect, thereby eliminating the need of additional light control element in the prior art and enhancing light emitting efficiency of the light source device.

Abstract translation: 公开了一种光源装置，其涉及在基板上形成多个载体平面，其中至少一个载体平面相对于基板形成一角度，并且分别将LED安装在载体平面上并将LED与载体电连接 平面，从而获得优选的配光效果，从而消除了现有技术中额外的光控制元件的需要，并提高了光源装置的发光效率。

公开(公告)号：US20080253129A1

公开(公告)日：2008-10-16

申请号：US11774561

申请日：2007-07-07

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai ,  Jen-Hui Tsai ,  Tung-Chuan Wu

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai ,  Jen-Hui Tsai ,  Tung-Chuan Wu

IPC: F21V13/04 ,  F21V23/04

CPC classification number: F21S13/12 ,  F21S6/003 ,  F21V5/04 ,  F21V5/045 ,  F21Y2103/00

Abstract: An improved lamp fixture with anti-glare function is disclosed, which comprises: a lamp; a light source; and a light-control unit, composed of a semi-Fresnel microstructure and a light-control microstructure; wherein the light source and the light-control unit are mounted on the lamp; and the semi-Fresnel microstructure is used for diffusing/collimating light of the light source while the light-control microstructure is used for controlling the resulting lighting angle. With the aforesaid lamp fixture, not only glare can be prevented, but also uniformity of the lamp fixture is improved.

Abstract translation: 公开了一种具有防眩光功能的改进的灯具，其包括：灯; 光源; 以及由半菲涅耳微结构和光控微结构组成的光控单元; 其中所述光源和所述光控制单元安装在所述灯上; 并且半菲涅尔微结构用于扩散/准直光源的光，而光控微结构用于控制所得到的照明角度。 利用上述灯具，不仅可以防止眩光，还能提高灯具的均匀性。

公开(公告)号：US20070263388A1

公开(公告)日：2007-11-15

申请号：US11717753

申请日：2007-03-14

Applicant: Chieh-Lung Lai ,  Jian-Shian Lin ,  Li-Ling Lee ,  Hung-Chun Li

Inventor： Chieh-Lung Lai ,  Jian-Shian Lin ,  Li-Ling Lee ,  Hung-Chun Li

IPC: F21V14/02

CPC classification number: F21S8/086 ,  F21K9/00 ,  F21S43/26 ,  F21V5/002 ,  F21V7/0008 ,  F21V14/02 ,  F21W2131/103 ,  F21Y2115/10

Abstract: An illumination device of flexible lighting angle is disclosed, which comprises: at least a directional light source, capable of emanating a light as it is electrically conducted to a control circuit while enabling the light angle of the light discharged therefrom to be adjustable; and a light guide cover, for receiving the at least one directional light source, having a light-control microstructure formed thereon while enabling the same to be further composed of a plurality of reflective/refractive microsurfaces. By adjusting the light-emitting angle of the directional light source for directing the discharged light to shine on different reflective/refractive microsurfaces of the light-control microstructure where it is reflected/refracted and discharged out of the light guide cover, the angle of the light being discharged out of the light guide cover is varied.

Abstract translation: 公开了一种柔性照明角度的照明装置，其包括：至少一个定向光源，其能够在将光线导电到控制电路时发出光，同时使得从其排出的光的光角度是可调节的; 以及导光罩，用于接收至少一个定向光源，其具有形成在其上的光控微结构，同时使其能够进一步由多个反射/折射微表面组成。 通过调整定向光源的发光角度来引导放电的光照射到光控微结构的不同的反射/折射微表面上，其被反射/折射并从光导罩排出， 从导光罩排出的光是变化的。

公开(公告)号：US20120286308A1

公开(公告)日：2012-11-15

申请号：US13242452

申请日：2011-09-23

Applicant: Chieh-Lung Lai ,  Wen-Lin Chang ,  Chih-Sheng Hsu ,  Chang-Yueh Chan

Inventor： Chieh-Lung Lai ,  Wen-Lin Chang ,  Chih-Sheng Hsu ,  Chang-Yueh Chan

IPC: H01L33/50 ,  H01L33/52 ,  H01L33/62

CPC classification number: H01L33/507 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: An LED package structure and a method of fabricating the same. The LED package structure includes: a package unit including a submount with a cavity, and a light emitting chip disposed in the cavity; a first light-pervious element disposed in the cavity; a multi-layered dam structure concentrically disposed on the first light-pervious element or around a rim of the cavity; a first light-pervious packaging material filled in the dam structure; and a second light-pervious element that combines with the dam structure. Accordingly, the multi-layered dam structure provides an advantage of eliminating gaps and overcomes the problem resulting from the uneven thickness of the first light-pervious packaging material used in the prior technique, thereby ensuring high illumination efficiency and enhanced airtightness.

Abstract translation: 一种LED封装结构及其制造方法。 LED封装结构包括：封装单元，其包括具有空腔的基座和设置在空腔中的发光芯片; 设置在所述空腔中的第一透光元件; 同心地设置在所述第一透光元件上或围绕所述空腔的边缘的多层坝结构; 填充在坝体结构中的第一透光性包装材料; 和与坝结构相结合的第二透光元件。 因此，多层坝结构提供了消除间隙的优点，并且克服了由于现有技术中使用的第一透光性包装材料的厚度不均匀导致的问题，从而确保了高的照明效率和增强的气密性。