公开(公告)号：US08236687B2

公开(公告)日：2012-08-07

申请号：US12854278

申请日：2010-08-11

Applicant: Hsiu-Jen Lin ,  Jian-Shian Lin ,  Shau-Yi Chen ,  Chieh-Lung Lai

Inventor： Hsiu-Jen Lin ,  Jian-Shian Lin ,  Shau-Yi Chen ,  Chieh-Lung Lai

IPC: H01L21/44

CPC classification number: H01L23/53247 ,  H01L24/29 ,  H01L24/83 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/30 ,  H01L33/40 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/83193 ,  H01L2224/83207 ,  H01L2224/8382 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/00014

Abstract: A die-bonding method is suitable for die-bonding a LED chip having a first metal thin-film layer to a substrate. The method includes forming a second metal thin film layer on a surface of the substrate; forming a die-bonding material layer on the second metal thin film layer; placing the LED chip on the die-bonding material layer with the first metal thin film layer contacting the die-bonding material layer; heating the die-bonding material layer at a liquid -solid reaction temperature for a pre-curing time, so as to form a first intermetallic layer and a second intermetallic layer; and heating the die-bonding material layer at a solid-solid reaction temperature for a curing time for performing a solid-solid reaction. The liquid-solid reaction temperature and the solid-solid reaction temperature are both lower than 110° C., and a melting point of the first and second intermetallic layers after the solid-solid reaction is higher than 200° C.

Abstract translation: 芯片接合方法适合于将具有第一金属薄膜层的LED芯片芯片接合到基板上。 该方法包括在基板的表面上形成第二金属薄膜层; 在所述第二金属薄膜层上形成芯片接合材料层; 将第一金属薄膜层与芯片接合材料层接触，将LED芯片放置在芯片接合材料层上; 在液固固化反应温度下加热芯片接合材料层达预固化时间，以形成第一金属间层和第二金属间层; 并在固 - 固反应温度下加热芯片接合材料层进行固 - 固反应的固化时间。 液固反应温度和固 - 固反应温度均低于110℃，固 - 固反应后第一和第二金属间化合物的熔点高于200℃。

公开(公告)号：US07530712B2

公开(公告)日：2009-05-12

申请号：US11490175

申请日：2006-07-21

Applicant: Jian-Shian Lin ,  Jian-Chiuan Wang ,  Chieh-Lung Lai ,  Hsiu-Chen Hsu ,  Yi-Ting Sun

Inventor： Jian-Shian Lin ,  Jian-Chiuan Wang ,  Chieh-Lung Lai ,  Hsiu-Chen Hsu ,  Yi-Ting Sun

IPC: F21V7/00

CPC classification number: F21V7/09 ,  F21S4/20 ,  F21V7/0008 ,  F21Y2103/10 ,  F21Y2103/33 ,  F21Y2115/10 ,  G02B3/08

Abstract: A reflective illumination device is disclosed, which is comprised of a light-guiding screen with light reflecting ability and at least a directional light source; wherein the light-guiding screen includes a reflecting surface having a semi-Fresnel lens structure arranged thereon. The semi-Fresnel lens structure, being designed basing on the principle of Fresnel lens, is the equivalent of a parabolic mirror that has spiral cut ridges for focusing light to a focal point, whereas the profile of the ridges can be a planar surface, a curved surface or the combination thereof. By arranging the reflecting surface with semi-Fresnel lens structure at the bottom of the light-guiding screen and each light source at a circumferential side wall of the light-guiding screen, the light beams emitting from each light source can be reflected out of the light-guiding screen by a specific angle as the direction of the light beams is adjusted to pour on the semi-Fresnel lens structure by a specific angle matching the configuration of the same.

Abstract translation: 公开了一种反射照明装置，其包括具有光反射能力的导光屏和至少一个定向光源; 其中所述导光屏幕包括其上布置有半菲涅尔透镜结构的反射表面。 基于菲涅尔透镜原理设计的半菲涅尔透镜结构相当于具有用于将光聚焦到焦点的螺旋切割脊的抛物面镜，而脊的轮廓可以是平面表面， 曲面或其组合。 通过在导光屏的底部配置具有半菲涅耳透镜结构的反射面，在导光屏的周向侧壁配置各光源，可以将从各光源射出的光束反射出 导光屏以特定的角度调节，以调整光束的方向，以与其匹配的特定角度倾倒在半菲涅尔透镜结构上。

公开(公告)号：US20070217193A1

公开(公告)日：2007-09-20

申请号：US11490175

申请日：2006-07-21

Applicant: Jian-Shian Lin ,  Jian-Chiuan Wang ,  Chieh-Lung Lai ,  Hsiu-Chen Hsu ,  Yi-Ting Sun

Inventor： Jian-Shian Lin ,  Jian-Chiuan Wang ,  Chieh-Lung Lai ,  Hsiu-Chen Hsu ,  Yi-Ting Sun

IPC: F21V5/00

CPC classification number: F21V7/09 ,  F21S4/20 ,  F21V7/0008 ,  F21Y2103/10 ,  F21Y2103/33 ,  F21Y2115/10 ,  G02B3/08

Abstract: A reflective illumination device is disclosed, which is comprised of a light-guiding screen with light reflecting ability and at least a directional light source; wherein the light-guiding screen includes a reflecting surface having a semi-Fresnel lens structure arranged thereon. The semi-Fresnel lens structure, being designed basing on the principle of Fresnel lens, is the equivalent of a parabolic mirror that has spiral cut ridges for focusing light to a focal point, whereas the profile of the ridges can be a planar surface, a curved surface or the combination thereof. By arranging the reflecting surface with semi-Fresnel lens structure at the bottom of the light-guiding screen and each light source at a circumferential side wall of the light-guiding screen, the light beams emitting from each light source can be reflected out of the light-guiding screen by a specific angle as the direction of the light beams is adjusted to pour on the semi-Fresnel lens structure by a specific angle matching the configuration of the same.

Abstract translation: 公开了一种反射照明装置，其包括具有光反射能力的导光屏和至少一个定向光源; 其中所述导光屏幕包括其上布置有半菲涅尔透镜结构的反射表面。 基于菲涅尔透镜原理设计的半菲涅尔透镜结构相当于具有用于将光聚焦到焦点的螺旋切割脊的抛物面镜，而脊的轮廓可以是平面表面， 曲面或其组合。 通过在导光屏的底部配置具有半菲涅耳透镜结构的反射面，在导光屏的周向侧壁配置各光源，可以将从各光源射出的光束反射出 导光屏以特定的角度调节，以调整光束的方向，以与其匹配的特定角度倾倒在半菲涅尔透镜结构上。

公开(公告)号：US07575344B2

公开(公告)日：2009-08-18

申请号：US11774561

申请日：2007-07-07

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai ,  Jen-Hui Tsai ,  Tung-Chuan Wu

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai ,  Jen-Hui Tsai ,  Tung-Chuan Wu

IPC: F21V5/02

CPC classification number: F21S13/12 ,  F21S6/003 ,  F21V5/04 ,  F21V5/045 ,  F21Y2103/00

Abstract: An improved lamp fixture with anti-glare function is disclosed, which comprises: a lamp; a light source; and a light-control unit, composed of a semi-Fresnel microstructure and a light-control microstructure; wherein the light source and the light-control unit are mounted on the lamp; and the semi-Fresnel microstructure is used for diffusing/collimating light of the light source while the light-control microstructure is used for controlling the resulting lighting angle. With the aforesaid lamp fixture, not only glare can be prevented, but also uniformity of the lamp fixture is improved.

Abstract translation: 公开了一种具有防眩光功能的改进的灯具，其包括：灯; 光源; 以及由半菲涅耳微结构和光控微结构组成的光控单元; 其中所述光源和所述光控制单元安装在所述灯上; 并且半菲涅尔微结构用于扩散/准直光源的光，而光控微结构用于控制所得的照明角度。 利用上述灯具，不仅可以防止眩光，还能提高灯具的均匀性。

公开(公告)号：US20130005055A1

公开(公告)日：2013-01-03

申请号：US13543418

申请日：2012-07-06

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai ,  Hsiu-Jen Lin ,  Weng-Jung Lu ,  Yi-Ping Huang ,  Ya-Chun Tu

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai ,  Hsiu-Jen Lin ,  Weng-Jung Lu ,  Yi-Ping Huang ,  Ya-Chun Tu

IPC: H01L33/62

CPC classification number: F21V19/02 ,  F21K9/00 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/29339 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract translation: 一种发光二极管（LED）模块和一种LED封装方法。 由于LED模块在考虑到烛光分布的情况下被封装，所以封装在LED模块中的LED芯片的每个引线框架被弯曲以使LED芯片以不同的角度倾斜以呈现各种照明效果。 同时，在LED封装方法中，可以通过一次操作快速地将多个LED芯片加载在一起，从而导致烛光分布曲线的偏差较小。

公开(公告)号：US20090135599A1

公开(公告)日：2009-05-28

申请号：US11964627

申请日：2007-12-26

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai

IPC: F21V21/00

CPC classification number: H05K3/301 ,  F21K9/00 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/10606

Abstract: A light source device is disclosed, which involves forming a plurality of carrier planes on a substrate with at least one of the carrier planes forming an angle relative to the substrate, and respectively mounting LEDs on the carrier planes and electrically connecting the LEDs with the carrier planes so as to obtain a preferred light distribution effect, thereby eliminating the need of additional light control element in the prior art and enhancing light emitting efficiency of the light source device.

Abstract translation: 公开了一种光源装置，其涉及在基板上形成多个载体平面，其中至少一个载体平面相对于基板形成一角度，并且分别将LED安装在载体平面上并将LED与载体电连接 平面，从而获得优选的配光效果，从而消除了现有技术中额外的光控制元件的需要，并提高了光源装置的发光效率。

公开(公告)号：US20110111539A1

公开(公告)日：2011-05-12

申请号：US12846839

申请日：2010-07-30

Applicant: Chieh-Lung Lai ,  Jian-Shian Lin ,  Hsiu-Jen Lin

Inventor： Chieh-Lung Lai ,  Jian-Shian Lin ,  Hsiu-Jen Lin

IPC: H01L33/60 ,  H01L33/64 ,  H01L33/62

CPC classification number: H01L33/641 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L24/97 ,  H01L25/0753 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A method of manufacturing a light emitting diode (LED) package includes disposing at least one LED chip on a first surface of a lead frame, and the LED chip is connected to the lead frame. At least one heat dissipation area corresponding to the LED chip is defined on a second surface of the lead frame. A thermal conductive material is disposed in the heat dissipation area. The thermal conductive material directly comes into contact with the lead frame. A solidification process is performed to solidify the thermal conductive material and form a plurality of heat dissipation blocks. The heat dissipation blocks directly come into contact with the lead frame, and the solidification process is performed at a temperature substantially lower than 300° C.

Abstract translation: 一种制造发光二极管（LED）封装的方法包括在引线框架的第一表面上设置至少一个LED芯片，并且LED芯片连接到引线框架。 在引线框架的第二表面上限定与LED芯片对应的至少一个散热区域。 导热材料设置在散热区域中。 导热材料直接与引线框接触。 进行凝固过程以固化导热材料并形成多个散热块。 散热块直接与引线框架接触，凝固过程在基本上低于300℃的温度下进行。

公开(公告)号：US07717587B2

公开(公告)日：2010-05-18

申请号：US11964627

申请日：2007-12-26

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai

IPC: F21V21/00

CPC classification number: H05K3/301 ,  F21K9/00 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/10606

Abstract: A light source device is disclosed, which involves forming a plurality of carrier planes on a substrate with at least one of the carrier planes forming an angle relative to the substrate, and respectively mounting LEDs on the carrier planes and electrically connecting the LEDs with the carrier planes so as to obtain a preferred light distribution effect, thereby eliminating the need of additional light control element in the prior art and enhancing light emitting efficiency of the light source device.

Abstract translation: 公开了一种光源装置，其涉及在基板上形成多个载体平面，其中至少一个载体平面相对于基板形成一角度，并且分别将LED安装在载体平面上并将LED与载体电连接 平面，从而获得优选的配光效果，从而消除了现有技术中额外的光控制元件的需要，并提高了光源装置的发光效率。

公开(公告)号：US20080253129A1

公开(公告)日：2008-10-16

申请号：US11774561

申请日：2007-07-07

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai ,  Jen-Hui Tsai ,  Tung-Chuan Wu

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai ,  Jen-Hui Tsai ,  Tung-Chuan Wu

IPC: F21V13/04 ,  F21V23/04

CPC classification number: F21S13/12 ,  F21S6/003 ,  F21V5/04 ,  F21V5/045 ,  F21Y2103/00

Abstract: An improved lamp fixture with anti-glare function is disclosed, which comprises: a lamp; a light source; and a light-control unit, composed of a semi-Fresnel microstructure and a light-control microstructure; wherein the light source and the light-control unit are mounted on the lamp; and the semi-Fresnel microstructure is used for diffusing/collimating light of the light source while the light-control microstructure is used for controlling the resulting lighting angle. With the aforesaid lamp fixture, not only glare can be prevented, but also uniformity of the lamp fixture is improved.

Abstract translation: 公开了一种具有防眩光功能的改进的灯具，其包括：灯; 光源; 以及由半菲涅耳微结构和光控微结构组成的光控单元; 其中所述光源和所述光控制单元安装在所述灯上; 并且半菲涅尔微结构用于扩散/准直光源的光，而光控微结构用于控制所得到的照明角度。 利用上述灯具，不仅可以防止眩光，还能提高灯具的均匀性。

公开(公告)号：US20070263388A1

公开(公告)日：2007-11-15

申请号：US11717753

申请日：2007-03-14

Applicant: Chieh-Lung Lai ,  Jian-Shian Lin ,  Li-Ling Lee ,  Hung-Chun Li

Inventor： Chieh-Lung Lai ,  Jian-Shian Lin ,  Li-Ling Lee ,  Hung-Chun Li

IPC: F21V14/02

CPC classification number: F21S8/086 ,  F21K9/00 ,  F21S43/26 ,  F21V5/002 ,  F21V7/0008 ,  F21V14/02 ,  F21W2131/103 ,  F21Y2115/10

Abstract: An illumination device of flexible lighting angle is disclosed, which comprises: at least a directional light source, capable of emanating a light as it is electrically conducted to a control circuit while enabling the light angle of the light discharged therefrom to be adjustable; and a light guide cover, for receiving the at least one directional light source, having a light-control microstructure formed thereon while enabling the same to be further composed of a plurality of reflective/refractive microsurfaces. By adjusting the light-emitting angle of the directional light source for directing the discharged light to shine on different reflective/refractive microsurfaces of the light-control microstructure where it is reflected/refracted and discharged out of the light guide cover, the angle of the light being discharged out of the light guide cover is varied.

Abstract translation: 公开了一种柔性照明角度的照明装置，其包括：至少一个定向光源，其能够在将光线导电到控制电路时发出光，同时使得从其排出的光的光角度是可调节的; 以及导光罩，用于接收至少一个定向光源，其具有形成在其上的光控微结构，同时使其能够进一步由多个反射/折射微表面组成。 通过调整定向光源的发光角度来引导放电的光照射到光控微结构的不同的反射/折射微表面上，其被反射/折射并从光导罩排出， 从导光罩排出的光是变化的。