Abstract:
Transistors, methods of manufacturing thereof, and image sensor circuits with reduced random telegraph signal (RTS) noise are disclosed. In one embodiment, a transistor includes a channel disposed between two isolation regions in a workpiece. The channel has edge regions proximate the isolation regions and a central region between the edge regions. The transistor includes a gate dielectric disposed over the channel, and a gate disposed over the gate dielectric. The transistor includes a voltage threshold modification feature proximate the edge regions configured to increase a voltage threshold of the transistor proximate edge regions relative to the central region of the channel.
Abstract:
A method of fabricating a complementary metal-oxide-semiconductor image sensor is provided. First, a substrate having a photo sensitive region and a transistor device region is provided. A p type well in the substrate of the transistor device region is formed. A dielectric layer and an un-doped polysilicon layer on the substrate are sequentially formed. A n type polysilicon layer on a first portion of the transistor device region and a p type polysilicon layer on the photo sensitive region and on a second portion of the transistor device region are formed. The dielectric layer, the n type polysilicon layer and the p type polysilicon layer are patterned to form a plurality of n type gate structures and a p type gate structure on the p type well of the transistor device region. A photo sensitive diode is formed in the substrate of the photo sensitive region.
Abstract:
A method of generating a gain of an image frame according to a look up table of gain which is set up based on luminance sensitivity of human eyes is proposed. The method includes setting a gain of an image frame to 1, scanning images of a plurality of front rows of the image frame, averaging the images of the plurality of the front rows of the image frame to generate an average value of the images of the plurality of the front rows of the image frame, finding a gain from the look up table of gain according to the average value of the images of the plurality of the front rows of the image frame, and adjusting remaining rows of the image frame according to the gain to generate images of the remaining rows of the image frame.
Abstract:
A composite transfer gate is described, which is disposed over a semiconductor substrate between an electron reservoir and a floating node in the semiconductor substrate. The composite transfer gate includes at least one N-type portion and a P-type portion that are arranged laterally.
Abstract:
A complementary metal-oxide-semiconductor (CMOS) image sensor including a substrate, a p type well, a light emitting diode, a p type gate structure and a plurality of n type gate structures is provided. The substrate has a photo sensitive region and a transistor device region, and the p type well is disposed in the substrate. The light emitting diode is disposed in the p type well and the substrate of the photo sensitive region. The p type gate structure is disposed on the substrate of the transistor device region. The n type gate structures are disposed on the substrate of the transistor device region.
Abstract:
An image sensor includes a semiconductor substrate, a photo receiving area in the semiconductor substrate, a gate electrode installed in a lateral side of the photo receiving area on the semiconductor substrate, and a patterned dielectric layer covering the gate electrode, the photo receiving area, and exposing a partial gate electrode. A spacer surrounds the gate electrode on the dielectric layer.
Abstract:
An active pixel sensor is proposed by the invention. The position of the gate of the reset transistor is kept away from the interface of the isolation region and the silicon so that the depletion region does not reach the isolation. Accordingly, dark currents caused by isolation region damages can be avoided.
Abstract:
A method of fabricating an image sensor device is disclosed. In the method, a substrate having a plurality of trenches therein is provided. A first anti-reflective layer is formed on the surfaces of the trenches. An insulating layer is filled in the trenches for forming a plurality of shallow trench isolation regions. At least one photo sensitive region is formed within the substrate between neighboring shallow trench isolation regions. A second anti-reflective layer is formed at least covering the photo sensitive region. Because the first anti-reflective layer is formed on the surfaces of the trenches, and the second anti-reflective layer is formed on the photo sensitive region, the sensitivity of the image sensor device is improved.
Abstract:
A method of fabricating a DRAM capacitor. A conductive layer and an amorphous silicon layer are formed on a substrate having a dielectric layer. The amorphous silicon layer and the conductive layer are etched to form a region of a capacitor to expose a portion of the dielectric layer. An opening with a profile having a wider upper portion and a narrower lower portion is formed within the conductive layer, and through the opening, the dielectric layer is then etched through to form a node contact window to expose the substrate. An amorphous silicon spacer is formed on the sidewall of conductive layer of the region of the capacitor and fills the node contact window. A selective HSG-Si, a dielectric layer and a polysilicon layer are formed to achieve the fabrication of the capacitor. The conductive layer, the amorphous silicon layer and the HSG-Si serve as a lower electrode of the capacitor and the polysilicon layer serves as an upper electrode of the capacitor.
Abstract:
A device includes a dielectric layer, and a heavily doped semiconductor layer over the dielectric layer. The heavily doped semiconductor layer is of a first conductivity type. A semiconductor region is over the heavily doped semiconductor layer, wherein the semiconductor region is of a second conductivity type opposite the first conductivity type. A Lateral Insulated Gate Bipolar Transistor (LIGBT) is disposed at a surface of the semiconductor region.