公开(公告)号：USD1036213S1

公开(公告)日：2024-07-23

申请号：US29875060

申请日：2023-04-28

申请人： Sachin Shashikant Dakare ,  Rahul Maruti Nanche ,  John Wayne Kroening ,  Andrew Francis Troy ,  Katey Earley ,  Jae Kwang Lee ,  John Hagan

设计人： Sachin Shashikant Dakare ,  Rahul Maruti Nanche ,  John Wayne Kroening ,  Andrew Francis Troy ,  Katey Earley ,  Jae Kwang Lee ,  John Hagan

摘要： FIG. 1 is a front perspective view of a conduit bending tool, showing the new design.
FIG. 2 is an alternate front perspective view of the conduit bending tool;
FIG. 3 is a front elevation view of the conduit bending tool;
FIG. 4 is a rear elevation view of the conduit bending tool;
FIG. 5 is a right side elevation view of the conduit bending tool;
FIG. 6 is a left side elevation view of the conduit bending tool;
FIG. 7 is a top plan view of the conduit bending tool; and,
FIG. 8 is a bottom plan view of the conduit bending tool.
The broken lines in the drawings depict portions of the conduit bending tool which form no part of the claimed design.

公开(公告)号：US20110313561A1

公开(公告)日：2011-12-22

申请号：US12939851

申请日：2010-11-04

申请人： Jae Kwang LEE

发明人： Jae Kwang LEE

IPC分类号： G06F19/00

CPC分类号： G06T7/0004 ,  G06T2207/30141 ,  G06T2207/30148 ,  G06T2207/30244

摘要： Disclosed herein is a machining error corrector method using optical pickup. The machining error corrector method using optical pickup according to the present invention includes: calculating absolute coordinates by identifying alignment marks formed at edges of a plate-shaped substrate that is a workpiece to be machined by laser; storing the calculated absolute coordinates as reference position information; moving a plurality of optical pickup units according to a horizontal or vertical direction patterns formed on the plate-shaped substrate; storing the coordinates of the patterns detected by the plurality of optical pickup units as error position information; and correcting actual machining position information by comparing the reference position information with the error position information, thereby making it possible to remarkably improve the substrate machining rate using laser, or the like.

摘要翻译： 这里公开了使用光学拾取器的加工误差校正器方法。 使用根据本发明的光学拾取器的加工误差校正器方法包括：通过识别在作为待加工的工件的板状基板的边缘处形成的对准标记来计算绝对坐标; 存储所计算出的绝对坐标作为参考位置信息; 根据形成在所述板状基板上的水平或垂直方向图案移动多个光学拾取单元; 存储由所述多个光学拾取单元检测到的图案的坐标作为错误位置信息; 并且通过将参考位置信息与误差位置信息进行比较来校正实际加工位置信息，从而可以显着地提高使用激光的基板加工速度等。

公开(公告)号：US20110129994A1

公开(公告)日：2011-06-02

申请号：US12929614

申请日：2011-02-03

申请人： Seung Wook Park ,  Young Do Kweon ,  Jingli Yuan ,  Seon Hee Moon ,  Ju Pyo Hong ,  Jae Kwang Lee

发明人： Seung Wook Park ,  Young Do Kweon ,  Jingli Yuan ,  Seon Hee Moon ,  Ju Pyo Hong ,  Jae Kwang Lee

IPC分类号： H01L21/60

CPC分类号： H01L21/76898 ,  H01L21/481 ,  H01L23/3114 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing a dual face package, including: preparing an upper substrate composed of an insulating layer including a post via-hole; forming a filled electrode in a semiconductor substrate, the filled electrode being connected to a die pad; applying an adhesive layer on one side of the semiconductor substrate including the filled electrode, and attaching the upper substrate to the semiconductor substrate; cutting another side of the semiconductor substrate in a thickness direction, thus making the filled electrode into a through-electrode; and forming a post electrode in the post via-hole, forming an upper redistribution layer connected to the post electrode of the semiconductor substrate, and forming a lower redistribution layer connected to the through-electrode on the other side of the semiconductor substrate.

摘要翻译： 一种双面包装的制造方法，包括：准备由包括柱状通孔的绝缘层构成的上基板; 在半导体衬底中形成填充电极，所述填充电极连接到管芯焊盘; 在包括填充电极的半导体衬底的一侧上施加粘合剂层，并将上衬底附接到半导体衬底; 在厚度方向切割半导体衬底的另一侧，从而使填充的电极成为通孔; 在柱状通孔中形成柱状电极，形成与半导体衬底的柱状电极连接的上部再分配层，在半导体衬底的另一侧形成与贯通电极连接的下部再分布层。

公开(公告)号：US20110021582A1

公开(公告)日：2011-01-27

申请号：US12934521

申请日：2009-03-05

申请人： Nam-Song Choi ,  Young-Hoon Kim ,  Jae-Kwang Lee ,  Hee-Ryong Kang ,  Ho-Jin Choi ,  Seung-Kee Moon ,  Soo-Jin Kim ,  Gyu-Tae Park ,  Byeong-Hoon Han ,  Dal-Hyun Kim ,  Jae-Hoon Choi ,  Sung-Sook Lee ,  Soon-Kil Ahn ,  Kyung-Joo Lee ,  Su-Yeal Bae

发明人： Nam-Song Choi ,  Young-Hoon Kim ,  Jae-Kwang Lee ,  Hee-Ryong Kang ,  Ho-Jin Choi ,  Seung-Kee Moon ,  Soo-Jin Kim ,  Gyu-Tae Park ,  Byeong-Hoon Han ,  Dal-Hyun Kim ,  Jae-Hoon Choi ,  Sung-Sook Lee ,  Soon-Kil Ahn ,  Kyung-Joo Lee ,  Su-Yeal Bae

IPC分类号： A61K31/427 ,  C07D417/10 ,  A61P35/00 ,  A61P31/04 ,  A61P29/00 ,  A61P37/00 ,  A61P17/06

CPC分类号： C07D417/10 ,  C07D417/14

摘要： Disclosed are a novel thiazole-containing benzophenone derivative represented by formula 1, and an isomer thereof, a pharmaceutically acceptable salt thereof, a hydrate thereof and a solvate thereof, a pharmaceutical composition comprising the derivative, a use of the derivative as therapeutic agent and a method for preparing the derivative. The benzophenone thiazole derivatives inhibit formation of microtubules and eliminate actively proliferating cells of malignant tumors to control general cell proliferation. In formula 1, R, R1 and R2 are defined as above.

摘要翻译： 公开了由式1表示的新型含噻唑的二苯甲酮衍生物及其异构体，其药学上可接受的盐，其水合物和溶剂合物，包含该衍生物的药物组合物，该衍生物作为治疗剂的用途和 制备衍生物的方法 二苯甲酮噻唑衍生物抑制微管的形成并消除恶性肿瘤的积极增殖细胞以控制一般细胞增殖。 在式1中，R，R 1和R 2如上所定义。

公开(公告)号：US20090046930A1

公开(公告)日：2009-02-19

申请号：US12175954

申请日：2008-07-18

申请人： Jae Kwang LEE ,  Chang Joon PARK ,  Kwang Ho YANG

发明人： Jae Kwang LEE ,  Chang Joon PARK ,  Kwang Ho YANG

IPC分类号： G06K9/46

CPC分类号： G06K9/4604

摘要： A method of extracting line segments from a subject image includes calculating a gradient image and a direction image of respective edge pixels in a canny edge image obtained from the subject image, calculating a primary line passing arbitrary two pixels selected among the edge pixels, selecting candidate line segment pixels through performing an incremental pixel extension from a midpoint of the two pixels forming the primary line, and extracting the line segments by checking whether the candidate line segment pixels are connected to each another.

摘要翻译： 从被摄体图像中提取线段的方法包括：计算从所述被摄体图像获得的小型边缘图像中的各边缘像素的梯度图像和方向图像，计算通过所述边缘像素中选择的任意两个像素的主线，选择候选 通过从形成主线的两个像素的中点执行增量像素扩展，以及通过检查候选线段像素是否彼此连接来提取线段，从而提取线段。

公开(公告)号：US08785810B2

公开(公告)日：2014-07-22

申请号：US13279716

申请日：2011-10-24

申请人： Jeong Woo Hyun ,  Jung Sub Lee ,  Sung Jin Lee ,  Sang Kyu Lim ,  Kwang Soo Kim ,  Jae Kwang Lee

发明人： Jeong Woo Hyun ,  Jung Sub Lee ,  Sung Jin Lee ,  Sang Kyu Lim ,  Kwang Soo Kim ,  Jae Kwang Lee

IPC分类号： B23K26/02 ,  B23K26/08 ,  G02B7/02

CPC分类号： B23K26/02 ,  B23K26/0648 ,  B23K26/08 ,  B23K26/082 ,  G02B7/02 ,  G02F1/1303 ,  G02F1/1309

摘要： According to example embodiments, a laser optical system includes a laser generator, at least one scan module, an objective lens, a relay lens, a review optical system, and a control device. The laser generator is configured to generate a laser beam. The at least one scan module is configured to reflect the laser beam generated by the laser generator and to direct the laser beam in different directions. The objective lens is configured to focus the laser beam on a substrate. The relay lens is configured to guide the laser beam scanned by the at least one scan module to within an incident range of the objective lens. The review optical system is configured to monitor, in real time, repair of the substrate using the laser beam. The control device is configured to control the at least one scan module.

摘要翻译： 根据示例实施例，激光光学系统包括激光发生器，至少一个扫描模块，物镜，中继透镜，复查光学系统和控制装置。 激光发生器被配置为产生激光束。 所述至少一个扫描模块被配置为反射由激光发生器产生的激光束并且将激光束引向不同的方向。 物镜配置成将激光束聚焦在基板上。 中继透镜被配置为将由至少一个扫描模块扫描的激光束引导到物镜的入射范围内。 检查光学系统被配置为实时地监视使用激光束修复衬底。 所述控制装置被配置为控制所述至少一个扫描模块。

公开(公告)号：US08331686B2

公开(公告)日：2012-12-11

申请号：US12175954

申请日：2008-07-18

申请人： Jae Kwang Lee ,  Chang Joon Park ,  Kwang Ho Yang

发明人： Jae Kwang Lee ,  Chang Joon Park ,  Kwang Ho Yang

IPC分类号： G06K9/46 ,  G06K9/48

CPC分类号： G06K9/4604

摘要： A method of extracting line segments from a subject image includes calculating a gradient image and a direction image of respective edge pixels in a canny edge image obtained from the subject image, calculating a primary line passing arbitrary two pixels selected among the edge pixels, selecting candidate line segment pixels through performing an incremental pixel extension from a midpoint of the two pixels forming the primary line, and extracting the line segments by checking whether the candidate line segment pixels are connected to each another.

摘要翻译： 从被摄体图像中提取线段的方法包括：计算从所述被摄体图像获得的小型边缘图像中的各边缘像素的梯度图像和方向图像，计算通过所述边缘像素中选择的任意两个像素的主线，选择候选 通过从形成主线的两个像素的中点执行增量像素扩展，以及通过检查候选线段像素是否彼此连接来提取线段，从而提取线段。

公开(公告)号：US20120188181A1

公开(公告)日：2012-07-26

申请号：US13340211

申请日：2011-12-29

申请人： Joo Young HA ,  Sun Mi SIN ,  Jae Kwang LEE ,  In Cheol CHANG ,  Ho Seop JEONG

发明人： Joo Young HA ,  Sun Mi SIN ,  Jae Kwang LEE ,  In Cheol CHANG ,  Ho Seop JEONG

IPC分类号： G06F3/041

CPC分类号： G06F3/041 ,  G06F3/0414 ,  G06F3/0416 ,  G06F2203/04104 ,  G06F2203/04105

摘要： Disclosed are a touch screen apparatus, in which a plurality of touch areas and touch pressure applied to the plurality of touch areas are sensed, and an electronic apparatus having the same. The touch screen apparatus and the electronic apparatus include a touch pad having pressure applied thereto, a plurality of pressure detectors detecting the pressure applied to the touch pad at different positions, and a touch pressure calculator calculating magnitude of pressure applied to a touch position using distances between the touch position calculated by a difference in detection time of the pressure detected by each of the plurality of pressure detectors and each of the plurality of pressure detectors.

摘要翻译： 公开了一种触摸屏设备，其中感测到施加到多个触摸区域的多个触摸区域和触摸压力以及具有该触摸屏设备的电子设备。 触摸屏设备和电子设备包括具有施加压力的触摸板，多个压力检测器检测在不同位置处施加到触摸板的压力，以及触摸压力计算器，使用距离计算施加到触摸位置的压力的大小 在由多个压力检测器中的每一个检测到的压力的检测时间差与多个压力检测器中的每一个之间计算的触摸位置之间。

公开(公告)号：US20110193775A1

公开(公告)日：2011-08-11

申请号：US12821519

申请日：2010-06-23

申请人： Jae Kwang Lee ,  Dong Ik Shin ,  Victor Yurlov

发明人： Jae Kwang Lee ,  Dong Ik Shin ,  Victor Yurlov

IPC分类号： G09G5/08

CPC分类号： G06F3/042

摘要： Disclosed herein is an optical pointing device. The device includes a light source which emits light. A guiding plate includes grooves formed in a thickness direction thereof, light emitted from the light source is incident on the guiding plate to move therealong, and the moving light collides with the grooves to be diffused therefrom. A first condensing part is provided under the guiding plate, and condenses light which is diffused from the grooves and reflected from a subject placed on the guiding plate. An image sensor is provided under the first condensing part.

摘要翻译： 本文公开了一种光学指向装置。 该装置包括发光的光源。 引导板包括沿其厚度方向形成的凹槽，从光源发射的光入射到引导板上以沿​​着其移动，并且移动的光与要漫射的凹槽相撞。 第一冷凝部件设置在引导板下方，并且冷凝从凹槽扩散并从放置在引导板上的被摄体反射的光。 图像传感器设置在第一冷凝部件的下方。

公开(公告)号：US20100288739A1

公开(公告)日：2010-11-18

申请号：US12579755

申请日：2009-10-15

申请人： Jae-Kwang Lee ,  Sung Yi ,  Soon-Gyu Yim

发明人： Jae-Kwang Lee ,  Sung Yi ,  Soon-Gyu Yim

IPC分类号： B23K26/38

CPC分类号： B23K26/032 ,  G01B9/02081 ,  G01B11/02 ,  H05K3/0035 ,  H05K2203/0207 ,  H05K2203/108 ,  H05K2203/163

摘要： Disclosed is a laser processing device, which includes a processing beam source configured to irradiate a processing laser towards an object, a measuring beam source configured to irradiate a modulated measuring laser, an irradiator configured to align a path of the measuring laser with a path of the processing laser directed towards the object, a beam receiver configured to receive the measuring laser reflected from the object, an I/Q demodulator configured to calculate a phase difference between the measuring laser irradiated from the measuring beam source and the measuring laser received at the beam receiver, and a data processor configured to calculate a processed length of the object by using the phase difference. The invention can be used to measure the length of a laser-processed portion at the same time as the laser processing itself, so that the laser processing may be performed with improved precision.

摘要翻译： 公开了一种激光处理装置，其包括被配置为朝向物体照射处理激光的处理光束源，被配置为照射调制测量激光的测量光束源，配置成将测量激光的路径与 所述处理激光器被引导到所述物体，被配置为接收从所述物体反射的所述测量激光器的光束接收器; I / Q解调器，被配置为计算从所述测量光束源照射的所述测量激光器与在所述测量激光器处接收的所述测量激光器之间的相位差 以及数据处理器，被配置为通过使用所述相位差来计算所述对象的处理长度。 本发明可以用于与激光加工本身同时测量激光加工部分的长度，使得可以以更高的精度执行激光加工。