公开(公告)号：US08943685B2

公开(公告)日：2015-02-03

申请号：US12923992

申请日：2010-10-19

申请人： Young Do Kweon ,  Sung Yi ,  Hong-Won Kim

发明人： Young Do Kweon ,  Sung Yi ,  Hong-Won Kim

IPC分类号： H05K3/02 ,  H05K1/16 ,  H05K3/06 ,  H05K3/46

CPC分类号： H05K1/162 ,  H05K3/062 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/09672 ,  H05K2201/09881 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A method of manufacturing a capacitor-embedded printed circuit board using a first conductive layer formed on one side of an insulation layer, the method including: forming a second conductive layer on one side of the first conductive layer; forming a second electrode by removing a portion of the second conductive layer; forming a first electrode by removing a portion of the first conductive layer in correspondence with the second electrode; and forming a dielectric layer on one side of the second electrode.

摘要翻译： 一种使用形成在绝缘层的一侧上的第一导电层制造电容器嵌入式印刷电路板的方法，所述方法包括：在所述第一导电层的一侧上形成第二导电层; 通过去除所述第二导电层的一部分来形成第二电极; 通过与所述第二电极对应地移除所述第一导电层的一部分来形成第一电极; 以及在所述第二电极的一侧上形成介电层。

公开(公告)号：US08756804B2

公开(公告)日：2014-06-24

申请号：US13213984

申请日：2011-08-19

申请人： Hyung Jin Jeon ,  Young Do Kweon ,  Seung Wook Park ,  Seon Hee Moon

发明人： Hyung Jin Jeon ,  Young Do Kweon ,  Seung Wook Park ,  Seon Hee Moon

IPC分类号： H01K3/10

CPC分类号： H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/036 ,  H05K3/42 ,  H05K3/4602 ,  H05K3/4605 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/09563 ,  H05K2201/10378 ,  H05K2203/0594 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

摘要： Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member. A method of manufacturing the printed circuit board is also provided.

摘要翻译： 公开了一种印刷电路板，包括基底构件，形成在基底构件的两个表面中的每一个上的绝缘层，使得基底构件的表面变平，形成在绝缘层上的电路层和用于连接的通孔 所述电路层形成在所述基底构件的一个表面上，所述电路层形成在所述基底构件的另一个表面上。 还提供了制造印刷电路板的方法。

公开(公告)号：US20130169382A1

公开(公告)日：2013-07-04

申请号：US13472195

申请日：2012-05-15

申请人： Jin Gu Kim ,  Jong Yun Lee ,  Young Do Kweon ,  Chang Bae Lee ,  Young Seuck Yoo

发明人： Jin Gu Kim ,  Jong Yun Lee ,  Young Do Kweon ,  Chang Bae Lee ,  Young Seuck Yoo

IPC分类号： H03H7/01 ,  H04B3/28 ,  B32B38/00 ,  H04B15/00 ,  B05D5/12

CPC分类号： H01P1/20345 ,  H01F17/0013 ,  H01F2017/0093 ,  H03H1/0007 ,  H03H7/427 ,  H03H2001/0085 ,  H04B3/28

摘要： Disclosed herein are a common mode filter and a method for manufacturing the same. The common mode filter includes a first insulator sheet; a first circuit layer having a first-layered first coil and a first-layered second coil alternately and separately arranged; a second insulator sheet laminated on the first circuit layer; and a second circuit layer having a second-layered first coil and a second-layered second coil alternately and separately arranged, the second-layered first coil being connected to the first-layered first coil and the second-layered second coil being connected to the first-layered second coil through the plurality of penetration holes.

摘要翻译： 这里公开了共模滤波器及其制造方法。 共模滤波器包括第一绝缘片; 具有第一层次的第一线圈和第一层次的第二线圈的第一电路层交替且分开布置; 叠层在第一电路层上的第二绝缘片; 并且具有交替且分离布置的具有第二层第一线圈和第二层次线圈的第二电路层，所述第二层第一线圈连接到所述第一层第一线圈，所述第二层第二线圈连接到 第一层第二线圈通过多个穿透孔。

公开(公告)号：US20130153275A1

公开(公告)日：2013-06-20

申请号：US13425665

申请日：2012-03-21

申请人： Jin Gul Hyun ,  Jin Gu Kim ,  Young Do Kweon ,  Hyung Jin Jeon

发明人： Jin Gul Hyun ,  Jin Gu Kim ,  Young Do Kweon ,  Hyung Jin Jeon

IPC分类号： H05K1/00 ,  H05K3/28 ,  H05K3/10

CPC分类号： H05K3/4673 ,  H05K3/28 ,  H05K2201/09781 ,  H05K2203/0126 ,  H05K2203/0759 ,  Y10T29/49158

摘要： Disclosed herein are a printed circuit board and a method for manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; circuit patterns formed in a circuit region on the base substrate; dummy patterns formed in a dummy region on the base substrate; and an insulating layer formed above the circuit patterns and the dummy patterns by a slit die coating method.

摘要翻译： 这里公开了一种印刷电路板及其制造方法。 根据本发明的优选实施例，印刷电路板包括：基底; 形成在基底基板上的电路区域中的电路图案; 形成在基底基板上的虚拟区域中的虚拟图案; 以及通过狭缝模涂法形成在电路图案和虚设图案之上的绝缘层。

公开(公告)号：US20130081868A1

公开(公告)日：2013-04-04

申请号：US13355797

申请日：2012-01-23

申请人： Dong Hwan LEE ,  Seung Wook Park ,  Kyung Sang Lim ,  Young Do Kweon

发明人： Dong Hwan LEE ,  Seung Wook Park ,  Kyung Sang Lim ,  Young Do Kweon

IPC分类号： H05K1/11

CPC分类号： H05K1/0225 ,  H05K1/0253 ,  H05K1/111

摘要： Disclosed herein is a printed circuit board, including: a dielectric substrate having a ground surface; a plurality of pads formed on the dielectric substrate; a transmission line transmitting a signal between the plurality of pads; and slots formed in partial regions of the ground surface correspondingly to the pads, thereby to improve signal transmitting characteristics and allow high-density wiring and thin thickness.

摘要翻译： 本文公开了一种印刷电路板，包括：具有接地表面的电介质基板; 形成在电介质基板上的多个焊盘; 传输线，在所述多个焊盘之间传输信号; 以及与焊盘对应地形成在地表面的部分区域中的槽，从而改善信号传输特性并允许高密度布线和薄厚度。

公开(公告)号：US08373537B2

公开(公告)日：2013-02-12

申请号：US12923574

申请日：2010-09-28

申请人： Mi Jin Park ,  Young Do Kweon ,  Jin Gu Kim

发明人： Mi Jin Park ,  Young Do Kweon ,  Jin Gu Kim

IPC分类号： H01C1/012

CPC分类号： H01C7/003 ,  H01C1/01 ,  H01C7/06 ,  Y10T29/49082 ,  Y10T29/49099

摘要： There are provided a resistor and a method of fabricating the same. The resistor includes: a substrate; a lower resistant material layer formed on the upper portion of the substrate; an insulating layer to be stacked on the upper portion of the lower resistant material layer; an upper resistant material layer to be stacked on the upper portion of the insulating layer; and two penetration parts vertically penetrating through the insulating layer, wherein the penetration part is filled with a resistant material having the same component as that of the lower resistant material layer and the upper resistant material layer to electrically connect the upper resistant material layer to the lower resistant material layer.

摘要翻译： 提供了一种电阻器及其制造方法。 电阻器包括：基板; 在所述基板的上部形成有较低阻力的材料层; 绝缘层，堆叠在下阻抗材料层的上部; 层叠在绝缘层的上部的上部电阻材料层; 和穿过绝缘层的两个穿透部分，其中穿透部分填充有与下阻力材料层和上阻力材料层具有相同成分的电阻材料，以将上部阻力材料层与下部电阻材料层电连接 耐材料层。

公开(公告)号：US08283768B2

公开(公告)日：2012-10-09

申请号：US12424514

申请日：2009-04-15

申请人： Joon Seok Kang ,  Sung Yi ,  Young Do Kweon

发明人： Joon Seok Kang ,  Sung Yi ,  Young Do Kweon

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/4334 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01073 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

摘要： Disclosed herein are a wafer level package for heat dissipation and a method of manufacturing the same. The wafer level package includes a heat dissipation plate including a cavity and a hole, a die including a pad disposed in the cavity of the heat dissipation plate in a face-up manner, a thermal conductive adhesive disposed between the die and an inner wall of the cavity and disposed in the hole, and a redistribution layer connected at one end to the pad and at the other end extended. The wafer level package protects the die from external environments and enables the die to be easily flush with the heat dissipation plate.

摘要翻译： 这里公开了用于散热的晶片级封装及其制造方法。 晶片级封装包括包括空腔和孔的散热板，包括以面朝上的方式设置在散热板的空腔中的焊盘的模具，设置在模具和内壁之间的导热粘合剂 空腔并设置在孔中，并且再分配层在一端连接到垫并且在另一端延伸。 晶圆级封装保护模具免受外部环境的影响，使模具能够轻松地与散热板齐平。

公开(公告)号：US20120084977A1

公开(公告)日：2012-04-12

申请号：US13268252

申请日：2011-10-07

申请人： Seung Wook PARK ,  Young Do KWEON ,  Ju Pyo HONG ,  Seung Wan SHIN ,  Kyung Seob OH

发明人： Seung Wook PARK ,  Young Do KWEON ,  Ju Pyo HONG ,  Seung Wan SHIN ,  Kyung Seob OH

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  H01L23/49531 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/09701 ,  H05K3/202 ,  H05K3/363 ,  H05K2201/0715 ,  H05K2201/10924 ,  H05K2203/1316 ,  Y10T29/4913

摘要： Disclosed herein is a method of manufacturing a block module including: mounting an electronic part on a base substrate on which a ground terminal is formed; forming a lead frame to extend to the outside of the base substrate from the ground terminal; connecting a flexible printed circuit to a circuit layer on the base substrate; forming a mold to surround the base substrate; cutting the lead frame and exposing the cut surface of the lead frame to the outside of the mold; and forming a metal coating layer connected to the lead frame on the mold, whereby the metal coating layer is formed to surround the mold to interrupt the electromagnetic waves and the metal coating layer is connected to the ground terminal by the lead frame to make the process simple.

摘要翻译： 本文公开了一种制造块模块的方法，包括：将电子部件安装在其上形成有接地端子的基底基板上; 形成引线框架，从接地端子延伸到基底基板的外部; 将柔性印刷电路连接到基底基板上的电路层; 形成包围所述基底基板的模具; 切割引线框架并将引线框架的切割表面暴露于模具的外部; 并且形成与模具上的引线框架连接的金属涂层，由此形成金属涂层以围绕模具以中断电磁波，并且金属涂层通过引线框架连接到接地端子，以使该工艺 简单。

公开(公告)号：US20120073861A1

公开(公告)日：2012-03-29

申请号：US13235110

申请日：2011-09-16

申请人： Ju-Pyo HONG ,  Young-Do Kweon ,  Jin-Gu Kim ,  Seon-Hee Moon ,  Dong-Jin Lee ,  Seung-Wook Park

发明人： Ju-Pyo HONG ,  Young-Do Kweon ,  Jin-Gu Kim ,  Seon-Hee Moon ,  Dong-Jin Lee ,  Seung-Wook Park

IPC分类号： H05K1/02 ,  H05K3/10

CPC分类号： H05K3/4644 ,  H05K1/0271 ,  H05K2201/09036

摘要： A printed circuit board and a manufacturing method of the printed circuit board are disclosed. The printed circuit board includes: a first insulation layer having a first pattern formed thereon; a first trench caved in one surface of the first insulation layer along at least a portion of the first pattern; and a second insulation layer stacked on one surface of the first insulation layer so as to cover the first pattern. The first trench is filled by the second insulation layer.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 印刷电路板包括：第一绝缘层，其上形成有第一图案; 沿着所述第一图案的至少一部分在所述第一绝缘层的一个表面中凹陷的第一沟槽; 以及层叠在所述第一绝缘层的一个表面上以覆盖所述第一图案的第二绝缘层。 第一沟槽由第二绝缘层填充。

公开(公告)号：US20120067636A1

公开(公告)日：2012-03-22

申请号：US13233851

申请日：2011-09-15

申请人： Jin Gu KIM ,  Mi Jin KIM ,  Young Ho KIM ,  Seung Wook PARK ,  Hee Kon LEE ,  Young Do KWEON

发明人： Jin Gu KIM ,  Mi Jin KIM ,  Young Ho KIM ,  Seung Wook PARK ,  Hee Kon LEE ,  Young Do KWEON

IPC分类号： H05K1/16 ,  H05K1/11

CPC分类号： H05K3/4694 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/112 ,  H05K3/3436 ,  H05K2203/041 ,  H01L2224/0401

摘要： Disclosed herein is an interposer-embedded printed circuit board, including: a substrate including a cavity formed in one side thereof and having a predetermined height in a thickness direction of the substrate; an interposer disposed in the cavity and including a wiring region and an insulating region; and a circuit layer formed in the substrate and including a connection pattern connected with one side of the wiring region. The interposer-embedded printed circuit board is advantageous in that an interposer is embedded in a substrate, so that the thickness of a semiconductor package can be reduced, thereby keeping up with the trend of slimming the semiconductor package.

摘要翻译： 本发明公开了一种嵌入式嵌入式印刷电路板，包括：基板，其具有在其一面形成并在基板的厚度方向上具有预定高度的空腔; 插入器，其设置在所述空腔中并且包括布线区域和绝缘区域; 以及形成在所述基板中并且包括与所述布线区域的一侧连接的连接图案的电路层。 嵌入式嵌入式印刷电路板的优点在于，嵌入在衬底中，从而可以减小半导体封装的厚度，从而跟上半导体封装变窄的趋势。