公开(公告)号：US07973434B2

公开(公告)日：2011-07-05

申请号：US11355706

申请日：2006-02-16

申请人： Kazuaki Yazawa ,  Iwao Takiguchi

发明人： Kazuaki Yazawa ,  Iwao Takiguchi

IPC分类号： H02K44/00 ,  H01L23/34

CPC分类号： H05K7/20272 ,  F04B19/006 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electromotive cooling head includes a substrate, an N-pole magnet, and an S-pole magnet, and kept in intimate contact with the backside of the semiconductor integrated circuit so as to cover it. The substrate has a fluid channel having a micro-channel structure, through which a conductive fluid flows. An anode and a cathode are disposed to sandwich the fluid channel. The conductive fluid interacts with a magnetic field to thereby induce an electromotive force between the anode and the cathode. A circuit includes, on its backside, a power supply voltage terminal and a ground terminal, and is driven by the electromotive force induced in the electromotive cooling head.

摘要翻译： 电动冷却头包括基板，N极磁体和S极磁体，并且与半导体集成电路的背面保持紧密接触以覆盖它。 衬底具有具有微通道结构的流体通道，导电流体通过该通道结构流动。 设置阳极和阴极以夹持流体通道。 导电流体与磁场相互作用，从而在阳极和阴极之间引起电动势。 电路的背面包括电源电压端子和接地端子，并且由电动冷却头中感应的电动势驱动。

公开(公告)号：US20090222251A1

公开(公告)日：2009-09-03

申请号：US12347989

申请日：2008-12-31

申请人： Tilman Gloekler ,  Ingemar Holm ,  Ralph C. Koester ,  Mack Wayne Riley ,  Shoji Sawamura ,  Iwao Takiguchi

发明人： Tilman Gloekler ,  Ingemar Holm ,  Ralph C. Koester ,  Mack Wayne Riley ,  Shoji Sawamura ,  Iwao Takiguchi

IPC分类号： G06F17/50

CPC分类号： G01R31/318555 ,  G01R31/318558 ,  G01R31/318572 ,  G06F11/2236

摘要： A design structure for a integrated circuit interfacing system may be embodied in a machine readable medium for designing, manufacturing or testing a integrated circuit. In one embodiment, the design structure specifies an integrated circuit that includes multiple interfaces. The design structure may specify that each of the interfaces couples to a respective set of registers or storage elements on the integrated circuit. The design structure may also specify a bridge circuit on the integrated circuit that switchably couples the two interfaces together such that one interface may communicate with the registers that associate with that interface as well as the registers that associate with the other interface.

摘要翻译： 用于集成电路接口系统的设计结构可以体现在用于设计，制造或测试集成电路的机器可读介质中。 在一个实施例中，设计结构指定包括多个接口的集成电路。 设计结构可以指定每个接口耦合到集成电路上相应的一组寄存器或存储元件。 该设计结构还可以指定集成电路上的桥接电路，其可切换地将两个接口耦合在一起，使得一个接口可以与与该接口相关联的寄存器以及与另一接口相关联的寄存器通信。

公开(公告)号：US20090112550A1

公开(公告)日：2009-04-30

申请号：US11927840

申请日：2007-10-30

申请人： Makoto Aikawa ,  Jonathan J. DeMent ,  Sang H. Dhong ,  Brian K. Flachs ,  Gilles Gervais ,  Iwao Takiguchi ,  Tetsuji Tamura

发明人： Makoto Aikawa ,  Jonathan J. DeMent ,  Sang H. Dhong ,  Brian K. Flachs ,  Gilles Gervais ,  Iwao Takiguchi ,  Tetsuji Tamura

IPC分类号： G06F17/50

CPC分类号： G06F17/5036 ,  G01R31/318364

摘要： A system and method for generating a worst case current waveform for testing of integrated circuit devices are provided. Architectural analysis of an integrated circuit device is first performed to determine an initial worst case power workload to be applied to the integrated circuit device. Thereafter, the derived worst case power workload is applied to a model and is simulated to generate a worst case current waveform that is input to an electrical model of the integrated circuit device to generate a worst case noise budget value. The worst case noise budget value is then compared to measured noise from application of the worst case power workload to a hardware implemented integrated circuit device. The worst case current waveform may be selected for future testing of integrated circuit devices or modifications to the simulation models may be performed and the process repeated based on the results of the comparison.

摘要翻译： 提供一种用于产生用于集成电路器件测试的最坏情况电流波形的系统和方法。 首先执行集成电路装置的结构分析，以确定要应用于集成电路装置的初始最坏情况功率工作负荷。 此后，将得到的最坏情况功率工作量应用于模型，并且被模拟以产生输入到集成电路器件的电气模型以产生最坏情况噪声预算值的最坏情况电流波形。 然后将最坏情况的噪声预算值与从最坏情况功率工作负载应用于硬件实现的集成电路设备的测量噪声进行比较。 可以选择最坏情况下的电流波形以用于集成电路设备的未来测试，或者可以对仿真模型进行修改，并且基于比较的结果重复该过程。

公开(公告)号：US20080189090A1

公开(公告)日：2008-08-07

申请号：US11671852

申请日：2007-02-06

申请人： Makoto Aikawa ,  Sang H. Dhong ,  Brian Flachs ,  Gilles Gervais ,  Yoichi Nishino ,  Iwao Takiguchi ,  Tetsuji Tamura ,  Yaping Zhou

发明人： Makoto Aikawa ,  Sang H. Dhong ,  Brian Flachs ,  Gilles Gervais ,  Yoichi Nishino ,  Iwao Takiguchi ,  Tetsuji Tamura ,  Yaping Zhou

IPC分类号： G06G7/62 ,  G06F17/50

CPC分类号： G06F17/5036 ,  G01R31/318357

摘要： A system and method for determining a guard band for an operating voltage of an integrated circuit device are provided. The system and method provide a mechanism for calculating the guard band based on a comparison of simulated noise obtained from a simulation of the integrated circuit device using a worst case waveform stimuli with simulated or measured power supply noise of a workload/test pattern that may be achieved using testing equipment. A scaling factor for the guard band is determined by comparing results of a simulation of a workload/test pattern with measured results of the workload/test pattern as applied to a hardware implementation of the integrated circuit device. This scaling factor is applied to a difference between the noise generated through simulation of the workload/test pattern and the noise generated through simulation of the worst case current waveform to generate a guard band value.

摘要翻译： 提供了一种用于确定集成电路装置的工作电压的保护带的系统和方法。 该系统和方法提供了一种基于使用最差情况波形刺激从集成电路装置的模拟获得的模拟噪声与可能是工作负载/测试模式的模拟或测量的电源噪声的比较来计算保护频带的机制 使用测试设备实现。 通过将工作负载/测试模式的仿真结果与应用于集成电路设备的硬件实现的工作负载/测试模式的测量结果进行比较来确定保护频带的缩放因子。 该缩放因子被应用于通过模拟工作负载/测试模式产生的噪声与通过模拟最坏情况电流波形产生的噪声之间的差异以产生保护带值。

公开(公告)号：US20070074216A1

公开(公告)日：2007-03-29

申请号：US10575042

申请日：2005-04-08

申请人： Kenichi Adachi ,  Kazuaki Yazawa ,  Iwao Takiguchi ,  Atsuhiko Imai ,  Tetsuji Tamura

发明人： Kenichi Adachi ,  Kazuaki Yazawa ,  Iwao Takiguchi ,  Atsuhiko Imai ,  Tetsuji Tamura

IPC分类号： G06F9/46

CPC分类号： G06F1/3203 ,  G06F1/329 ,  G06F9/4887 ,  Y02D10/126 ,  Y02D10/24

摘要： This task management method includes dividing a unit time of processing into a reserved band for guaranteeing real-timeness and a non-reserved band not for guaranteeing real-timeness, and skipping a task to be executed in the non-reserved band as appropriate when processor throughput falls. That is, when the operating frequency of the processor is lowered in order to suppress heat generation, the real-timeness of tasks to be executed in the reserved band is guaranteed at the expense of processing the task to be executed in the non-reserved band in a best-efforts fashion.

摘要翻译： 该任务管理方法包括将处理的单位时间划分为用于保证实时性的保留频带和不保证实时性的非保留频带，并且当处理器适当时跳过在非保留频带中执行的任务 吞吐量下降。 也就是说，当为了抑制发热而降低处理器的工作频率时，保证在保留频带中执行的任务的实时性以处理在非保留频带中执行的任务为代价 以尽力而为的方式。

公开(公告)号：US07167778B2

公开(公告)日：2007-01-23

申请号：US11140491

申请日：2005-05-27

申请人： Kazuaki Yazawa ,  Iwao Takiguchi ,  Tetsuji Tamura ,  Atsuhiko Imai ,  Kenichi Adachi

发明人： Kazuaki Yazawa ,  Iwao Takiguchi ,  Tetsuji Tamura ,  Atsuhiko Imai ,  Kenichi Adachi

IPC分类号： G05D23/00 ,  H01L23/34

CPC分类号： G06F1/206 ,  G01K7/425 ,  G05D23/1917 ,  H01L23/34 ,  H01L23/467 ,  H01L23/4735 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K7/20172 ,  H05K7/20209 ,  H01L2924/00

摘要： A temperature predicting unit predicts the temperature of an electronic device after a predetermined period, and the speed of temperature variation from the operating state of the load. Based on the results of prediction by the temperature predicting unit, a selection unit instructs either one or both of a nozzle control unit and an electric fan control unit to exercise control. According to a control signal from the selection unit, the nozzle control unit transmits a control signal to a nozzle unit to drive a jet cooling apparatus. According to a control signal from the selection unit, the electric fan control unit transmits a control signal to an electric fan unit to drive an electric fan. The selection unit selects the electric fan when the predicted speed of temperature variation exceeds a predetermined threshold, and selects the jet cooling apparatus when the predetermined thresholds is not exceeded.

摘要翻译： 温度预测单元在预定时间段之后预测电子设备的温度，以及从负载的操作状态开始的温度变化速度。 基于温度预测单元的预测结果，选择单元指示喷嘴控制单元和电风扇控制单元中的一个或两个进行控制。 根据来自选择单元的控制信号，喷嘴控制单元向喷嘴单元发送控制信号以驱动喷射冷却装置。 根据来自选择单元的控制信号，电风扇控制单元向电风扇单元发送控制信号以驱动电风扇。 当预测的温度变化速度超过预定阈值时，选择单元选择电风扇，并且当不超过预定阈值时选择喷射冷却装置。

公开(公告)号：US20060185973A1

公开(公告)日：2006-08-24

申请号：US11355706

申请日：2006-02-16

申请人： Kazuaki Yazawa ,  Iwao Takiguchi

发明人： Kazuaki Yazawa ,  Iwao Takiguchi

IPC分类号： C25B5/00

CPC分类号： H05K7/20272 ,  F04B19/006 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electromotive cooling head includes a substrate, an N-pole magnet, and an S-pole magnet, and kept in intimate contact with the backside of the semiconductor integrated circuit so as to cover it. The substrate has a fluid channel having a micro-channel structure, through which a conductive fluid flows. An anode and a cathode are disposed to sandwich the fluid channel. The conductive fluid interacts with a magnetic field to thereby induce an electromotive force between the anode and the cathode. A circuit includes, on its backside, a power supply voltage terminal and a ground terminal, and is driven by the electromotive force induced in the electromotive cooling head.

摘要翻译： 电动冷却头包括基板，N极磁体和S极磁体，并且与半导体集成电路的背面保持紧密接触以覆盖它。 衬底具有具有微通道结构的流体通道，导电流体通过该通道结构流动。 设置阳极和阴极以夹持流体通道。 导电流体与磁场相互作用，从而在阳极和阴极之间引起电动势。 电路的背面包括电源电压端子和接地端子，并且由电动冷却头中感应的电动势驱动。

公开(公告)号：US08051304B2

公开(公告)日：2011-11-01

申请号：US12064303

申请日：2006-04-24

申请人： Iwao Takiguchi ,  Kazuaki Mitsui ,  Tetsuji Tamura ,  Atsuhiko Imai

发明人： Iwao Takiguchi ,  Kazuaki Mitsui ,  Tetsuji Tamura ,  Atsuhiko Imai

IPC分类号： G06F1/00 ,  B23K11/24 ,  B63H23/24 ,  G01R21/00 ,  H04M1/00

CPC分类号： G06F1/26

摘要： In a power supply apparatus for supplying a target power supply voltage to a microprocessor, a system controller sets the target power supply voltage to be supplied to the microprocessor based on a voltage configuration signal outputted from the microprocessor and outputs a voltage setting signal corresponding to the target power supply voltage. The regulator circuit generates the target power supply voltage set by the system controller based on the voltage setting signal outputted from the system controller and supplies the voltage to the microprocessor 10. The system controller acquires the conditions of the microprocessor, such as the operating time and temperature of the microprocessor and the amount of computation in the microprocessor, and reflects the acquired conditions on the setting of the power supply voltage.

摘要翻译： 在用于向微处理器提供目标电源电压的电源装置中，系统控制器基于从微处理器输出的电压配置信号设置要提供给微处理器的目标电源电压，并输出对应于 目标电源电压。 调节器电路基于从系统控制器输出的电压设定信号，生成由系统控制器设定的目标电源电压，并将电压提供给微处理器10.系统控制器获取微处理器的状态，如操作时间和 微处理器的温度和微处理器中的计算量，并反映了获取的条件对电源电压的设置。

公开(公告)号：US07716516B2

公开(公告)日：2010-05-11

申请号：US11471819

申请日：2006-06-21

申请人： Yosuke Muraki ,  Tetsuji Tamura ,  Iwao Takiguchi ,  Makoto Aikawa ,  Eskinder Hailu ,  Byron Lee Krauter ,  Stephen Douglas Weitzel ,  Jieming Qi ,  Kazuhiko Miki ,  David William Boerstler ,  Gilles Gervais ,  Kirk David Peterson ,  Robert Walter Berry, Jr. ,  Sang Hoo Dhong

发明人： Yosuke Muraki ,  Tetsuji Tamura ,  Iwao Takiguchi ,  Makoto Aikawa ,  Eskinder Hailu ,  Byron Lee Krauter ,  Stephen Douglas Weitzel ,  Jieming Qi ,  Kazuhiko Miki ,  David William Boerstler ,  Gilles Gervais ,  Kirk David Peterson ,  Robert Walter Berry, Jr. ,  Sang Hoo Dhong

IPC分类号： G06F1/04 ,  G06F1/24 ,  G06F11/00

CPC分类号： G06F1/04

摘要： A technology for supplying a power supply voltage to a microprocessor. Before normal arithmetic processing of the microprocessor, duty cycle correction process for adjusting the duty cycle of a clock signal inside the microprocessor is performed. In the duty cycle correction process for adjusting the duty cycle, the duty cycle of the clock signal is adjusted so as to minimize the power voltage at which the microprocessor is still operable.

摘要翻译： 用于向微处理器提供电源电压的技术。 在微处理器的正常运算处理之前，执行用于调整微处理器内的时钟信号占空比的占空比校正处理。 在用于调整占空比的占空比校正处理中，调整时钟信号的占空比以使微处理器仍然可操作的电源电压最小化。

公开(公告)号：US20090292404A1

公开(公告)日：2009-11-26

申请号：US12067315

申请日：2006-07-20

申请人： Kenichi Adachi ,  Tetsuji Tamura ,  Iwao Takiguchi

发明人： Kenichi Adachi ,  Tetsuji Tamura ,  Iwao Takiguchi

IPC分类号： G05D23/19 ,  G06F9/46

CPC分类号： G06F1/206

摘要： A control execution unit (114) of a control stack (110) contained in a software stack causes a receiving unit (112) to receive the temperatures of a main processor and a graphic processor. When it is discriminated on the basis of those temperatures that a thermal error has occurred, the control execution unit (114) causes a class acquisition unit (116) to acquire the class of an active application. Moreover, the control execution unit (114) executes a hardware control operation to adjust the action of a hardware and a software control operation to change the action contents of the application, thereby to control the heat generation state of the hardware. When the software control operation is to be executed, a control method according to the combination of a portion, at which the thermal error has occurred, and the kind of the active application is acquired from a reaction table (118), thereby to control the software control operation by the control method acquired.

摘要翻译： 包含在软件堆栈中的控制堆栈（110）的控制执行单元（114）使得接收单元（112）接收主处理器和图形处理器的温度。 当基于发生热误差的那些温度进行判别时，控制执行单元（114）使得类获取单元（116）获取活动应用的类别。 此外，控制执行单元（114）执行硬件控制操作以调整硬件的动作和软件控制操作，以改变应用的动作内容，从而控制硬件的发热状态。 当要执行软件控制操作时，从反应表（118）获取根据发生热误差的部分和活动应用的种类的组合的控制方法，从而控制 软件控制操作通过控制方式获取。