公开(公告)号：US08845776B2

公开(公告)日：2014-09-30

申请号：US13265248

申请日：2010-04-27

申请人： Ryo Mukai ,  Atsushi Koyama ,  Nahomi Hamaguchi ,  Kao Mouri ,  Hiromi Yokota

发明人： Ryo Mukai ,  Atsushi Koyama ,  Nahomi Hamaguchi ,  Kao Mouri ,  Hiromi Yokota

IPC分类号： C22C9/02 ,  C22C1/05 ,  C22C9/04 ,  C22C9/01 ,  C22C9/00 ,  F16C33/12 ,  C22C9/06

CPC分类号： F16C33/12 ,  C22C1/05 ,  C22C9/00 ,  C22C9/01 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  F16C33/121 ,  F16C2204/12 ,  Y02T10/865

摘要： The present invention relates to sliding material provided by sintering a lead-free copper or copper alloy and contains at least one mineral selected from the group consisting of talc, mica, kaolinite mineral and montmorillonite mineral. Pb has conventionally been included in sliding materials for the purpose of obtaining conformability and seizure resistance. Despite the absence of Pb, the Pb-free copper-based sliding material and sliding parts according to the present invention have improved sliding properties.

摘要翻译： 本发明涉及通过烧结无铅铜或铜合金提供的滑动材料，并且含有至少一种选自滑石，云母，高岭石矿物和蒙脱石矿物的矿物。 为了获得一致性和耐咬合性，Pb通常被包括在滑动材料中。 尽管没有Pb，但是根据本发明的无铅铜基滑动材料和滑动部件具有改善的滑动性能。

公开(公告)号：US20120251375A1

公开(公告)日：2012-10-04

申请号：US13493617

申请日：2012-06-11

申请人： Hiromi YOKOTA ,  Ryo Mukai ,  Shinichi Kato ,  Nahomi Hamaguchi

发明人： Hiromi YOKOTA ,  Ryo Mukai ,  Shinichi Kato ,  Nahomi Hamaguchi

IPC分类号： B22F7/04 ,  B22F3/10 ,  B22F3/24

CPC分类号： B22F7/08 ,  B22F2998/00 ,  C22C1/0425 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/08 ,  F16C33/121 ,  F16C2204/12 ,  Y02T10/865 ,  B22F3/10

摘要： A method of producing a Pb-free copper-alloy sliding material containing 1.0 to 15.0% of Sn, 0.5 to 15.0% of Bi and 0.05 to 5.0% of Ag, and Ag and Bi from an Ag—Bi eutectic. If necessary, at least one of 0.1 to 5.0% of Ni, 0.02 to 0.2% P, 0.5 to 30.0% of Zn, and 1.0 to 10.0 mass % of at least one of a group consisting of Fe3P, Fe2P, FeB, NiB and AlN may be added.

摘要翻译： 制备含有Sn：1.0〜15.0％，Bi：0.5〜15.0％，Ag：0.05〜5.0％，Ag-Bi共晶的Ag，Bi的无铅铜合金滑动材料的制造方法。 如果需要，可以使用0.1〜5.0％的Ni，0.02〜0.2％的P，0.5〜30.0％的Zn和1.0〜10.0质量％的Fe 3 P，Fe 2 P，FeB，NiB和 可以添加AlN。

公开(公告)号：US20120096988A1

公开(公告)日：2012-04-26

申请号：US13265248

申请日：2010-04-27

申请人： Ryo Mukai ,  Atsushi Koyama ,  Nahomi Hamaguchi ,  Kao Mouri ,  Hiromi Yokota

发明人： Ryo Mukai ,  Atsushi Koyama ,  Nahomi Hamaguchi ,  Kao Mouri ,  Hiromi Yokota

IPC分类号： B22F1/00

CPC分类号： F16C33/12 ,  C22C1/05 ,  C22C9/00 ,  C22C9/01 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  F16C33/121 ,  F16C2204/12 ,  Y02T10/865

摘要： The present invention relates to sliding material provided by sintering a lead-free copper or copper alloy and contains at least one mineral selected from the group consisting of talc, mica, kaolinite mineral and montmorillonite mineral. Pb has conventionally been included in sliding materials for the purpose of obtaining conformability and seizure resistance. Despite the absence of Pb, the Pb-free copper-based sliding material and sliding parts according to the present invention have improved sliding properties.

摘要翻译： 本发明涉及通过烧结无铅铜或铜合金提供的滑动材料，并且含有至少一种选自滑石，云母，高岭石矿物和蒙脱石矿物的矿物。 为了获得一致性和耐咬合性，Pb通常被包括在滑动材料中。 尽管没有Pb，但是根据本发明的无铅铜基滑动材料和滑动部件具有改善的滑动性能。

公开(公告)号：US20100266444A1

公开(公告)日：2010-10-21

申请号：US12376381

申请日：2007-08-02

申请人： Hiromi Yokota ,  Daisuke Yoshitome

发明人： Hiromi Yokota ,  Daisuke Yoshitome

IPC分类号： C22C9/02

CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C32/0089 ,  F16C2204/12

摘要： When a Cu—Sn—Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.

摘要翻译： 当使用Cu-Sn-Bi颗粒基滑动材料进行滑动时，Cu基体的Cu流动并覆盖Bi相。 随着时间的推移，抗癫痫药物耐药性下降。 提供了防止耐发霉性降低的无铅滑动材料。 （1）组成：Sn的1〜15％，Bi的1〜15％，P的0.02〜0.2％，平均粒径为50〜70μm的1〜10％的硬质粒子， 余量为Cu和不可避免的杂质。 （2）结构：Bi相，硬质粒分散在铜基体中，所有的硬粒子均与铜基体结合。

公开(公告)号：US09028582B2

公开(公告)日：2015-05-12

申请号：US12864171

申请日：2009-01-22

申请人： Hitoshi Wada ,  Takashi Tomikawa ,  Daisuke Yoshitome ,  Hiromi Yokota

发明人： Hitoshi Wada ,  Takashi Tomikawa ,  Daisuke Yoshitome ,  Hiromi Yokota

IPC分类号： C22C9/00 ,  C22C1/04 ,  B22F3/10 ,  B22F1/00 ,  C22C9/02

CPC分类号： B22F3/10 ,  B22F1/0003 ,  B22F3/1017 ,  C22C1/0425 ,  C22C9/00 ,  C22C9/02 ,  F16C2204/12 ,  F16C2204/18 ,  F16C2360/42

摘要： Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.

摘要翻译： Cu-Bi-In铜合金滑动材料的耐冲击性和耐磨性通过形成尽可能纯的柔软相Bi而增强。 使用Cu-In合金粉末和含Cu-Bi的Cu基合金粉末的混合粉末。 设定烧结条件使得Bi移动到所述含Cu-Bi的Cu基粉末的颗粒外部并形成不含In的Bi晶界相，并且In从所述含Cu-In的Cu基粉末扩散到所述Cu- 含有Cu的粉末。

公开(公告)号：US20140147326A1

公开(公告)日：2014-05-29

申请号：US14168450

申请日：2014-01-30

申请人： Hitoshi WADA ,  Takashi TOMIKAWA ,  Daisuke YOSHITOME ,  Hiromi YOKOTA

发明人： Hitoshi WADA ,  Takashi TOMIKAWA ,  Daisuke YOSHITOME ,  Hiromi YOKOTA

IPC分类号： B22F3/10 ,  B22F1/00

CPC分类号： B22F3/10 ,  B22F1/0003 ,  B22F3/1017 ,  C22C1/0425 ,  C22C9/00 ,  C22C9/02 ,  F16C2204/12 ,  F16C2204/18 ,  F16C2360/42

摘要： Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.

摘要翻译： Cu-Bi-In铜合金滑动材料的耐冲击性和耐磨性通过形成尽可能纯的柔软相Bi而增强。 使用Cu-In合金粉末和含Cu-Bi的Cu基合金粉末的混合粉末。 设定烧结条件使得Bi移动到所述含Cu-Bi的Cu基粉末的颗粒外部并形成不含In的Bi晶界相，并且In从所述含Cu-In的Cu基粉末扩散到所述Cu- 含有Cu的粉末。

公开(公告)号：US20130116157A1

公开(公告)日：2013-05-09

申请号：US13639367

申请日：2011-04-07

申请人： Ryo Mukai ,  Hiromi Yokota ,  Akira Sawamoto ,  Takao Masamura ,  Masanori Akizuki

发明人： Ryo Mukai ,  Hiromi Yokota ,  Akira Sawamoto ,  Takao Masamura ,  Masanori Akizuki

IPC分类号： C10M103/02

CPC分类号： C10M111/04 ,  C08G73/10 ,  C08G73/14 ,  C08K3/04 ,  C08K7/00 ,  C08L79/08 ,  C10M125/02 ,  C10M2201/041 ,  C10M2201/061 ,  C10M2201/066 ,  C10M2201/087 ,  C10M2201/103 ,  C10M2213/062 ,  C10M2217/0403 ,  C10M2217/0415 ,  C10M2217/0443 ,  C10N2220/082 ,  C10N2230/06 ,  C10N2250/14 ,  C10N2250/141 ,  C10N2250/18

摘要： [Task] Seizure resistance of sliding material based on graphite-added resin is improved.[Means for Solution] A sliding material based on graphite-added resin has composition (1); graphite: average particle diameter of from 5 to 50 μm, a degree of graphitization of 0.6 or more, the number of graphite particles having a minimum diameter/maximum diameter ratio of 0.5 or more amounts to 50% or more of the total number of the graphite particles observed in a photograph of an optional cross section, content 5 to 60% by weight, as well as composition (2). balance of polyimide resin and/or polyamide-imide resin.

摘要翻译： [任务]提高了基于石墨添加树脂的滑动材料的耐震性。 [解决方案]基于添加石墨的树脂的滑动材料具有组成（1）; 石墨：平均粒径为5〜50μm，石墨化度为0.6以上，最小直径/最大直径比为0.5以上的石墨粒子的数量为总数的50％以上 在任意横截面的照片中观察到石墨颗粒，含量为5至60重量％，以及组合物（2）。 聚酰亚胺树脂和/或聚酰胺 - 酰亚胺树脂的平衡。

公开(公告)号：US08993493B2

公开(公告)日：2015-03-31

申请号：US13063069

申请日：2009-09-09

申请人： Ryo Mukai ,  Hiromi Yokota ,  Kao Mouri

发明人： Ryo Mukai ,  Hiromi Yokota ,  Kao Mouri

IPC分类号： C22C9/00 ,  F16C33/12 ,  B22F9/00 ,  C22C9/02 ,  C22C1/04 ,  C22C9/04 ,  C22C32/00 ,  F16C33/24

CPC分类号： C22C9/02 ,  C22C1/0425 ,  C22C9/00 ,  C22C9/04 ,  C22C32/00 ,  F16C33/121 ,  F16C33/24 ,  F16C2204/10 ,  F16C2204/18 ,  Y02T10/865

摘要： Sliding parts are made of Pb-free Cu—Bi based sintered material. The side in contact with a shaft is machined to a predetermined roughness. A number of Bi phases are present on the finished surface. Stable performance of Bi is to be exhibited. Machined sintered material covers a portion of the Bi phases. The ratio of the exposed surface area of the Bi phases is 0.5% or more relative to the area of the finished surface.

摘要翻译： 滑动部件由无铅Cu-Bi基烧结材料制成。 与轴接触的一侧被加工成预定的粗糙度。 在成品表面上存在多个Bi相。 Bi的稳定性能要展现。 加工烧结材料覆盖Bi相的一部分。 Bi相的露出表面积的比例相对于成品表面的面积为0.5％以上。

公开(公告)号：US20120294750A1

公开(公告)日：2012-11-22

申请号：US13555639

申请日：2012-07-23

申请人： HIROMI YOKOTA ,  Daisuke Yoshitome

发明人： HIROMI YOKOTA ,  Daisuke Yoshitome

IPC分类号： B22F3/10

CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C32/0089 ,  F16C2204/12

摘要： When a Cu—Sn—Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.

摘要翻译： 当使用Cu-Sn-Bi颗粒基滑动材料进行滑动时，Cu基体的Cu流动并覆盖Bi相。 随着时间的推移，抗癫痫药物耐药性下降。 提供了防止耐发霉性降低的无铅滑动材料。 （1）组成：Sn的1〜15％，Bi的1〜15％，P的0.02〜0.2％，平均粒径为50〜70μm的1〜10％的硬质粒子， 余量为Cu和不可避免的杂质。 （2）结构：Bi相，硬质粒分散在铜基体中，所有的硬粒子均与铜基体结合。

公开(公告)号：US20110020171A1

公开(公告)日：2011-01-27

申请号：US12864171

申请日：2009-01-22

申请人： Hitoshi Wada ,  Takashi Tomikawa ,  Daisuke Yoshitome ,  Hiromi Yokota

发明人： Hitoshi Wada ,  Takashi Tomikawa ,  Daisuke Yoshitome ,  Hiromi Yokota

IPC分类号： C22C9/00 ,  C22C33/02 ,  C22C9/02

CPC分类号： B22F3/10 ,  B22F1/0003 ,  B22F3/1017 ,  C22C1/0425 ,  C22C9/00 ,  C22C9/02 ,  F16C2204/12 ,  F16C2204/18 ,  F16C2360/42

摘要： Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi.Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.

摘要翻译： Cu-Bi-In铜合金滑动材料的耐冲击性和耐磨性通过形成尽可能纯的柔软相Bi而增强。 使用Cu-In合金粉末和含Cu-Bi的Cu基合金粉末的混合粉末。 设定烧结条件使得Bi移动到所述含Cu-Bi的Cu基粉末的颗粒外部并形成不含In的Bi晶界相，并且In从所述含Cu-In的Cu基粉末扩散到所述Cu- 含有Cu的粉末。