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1.发明授权Process for production of sintered copper alloy sliding material and sintered copper alloy sliding material 有权烧结铜合金滑动材料和烧结铜合金滑动材料的生产工艺公开(公告)号：US09028582B2
公开(公告)日：2015-05-12
申请号：US12864171
申请日：2009-01-22
CPC分类号： B22F3/10 , B22F1/0003 , B22F3/1017 , C22C1/0425 , C22C9/00 , C22C9/02 , F16C2204/12 , F16C2204/18 , F16C2360/42
摘要： Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
摘要翻译： Cu-Bi-In铜合金滑动材料的耐冲击性和耐磨性通过形成尽可能纯的柔软相Bi而增强。 使用Cu-In合金粉末和含Cu-Bi的Cu基合金粉末的混合粉末。 设定烧结条件使得Bi移动到所述含Cu-Bi的Cu基粉末的颗粒外部并形成不含In的Bi晶界相，并且In从所述含Cu-In的Cu基粉末扩散到所述Cu- 含有Cu的粉末。
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2.发明申请公开(公告)号：US20140147326A1
公开(公告)日：2014-05-29
申请号：US14168450
申请日：2014-01-30
CPC分类号： B22F3/10 , B22F1/0003 , B22F3/1017 , C22C1/0425 , C22C9/00 , C22C9/02 , F16C2204/12 , F16C2204/18 , F16C2360/42
摘要： Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
摘要翻译： Cu-Bi-In铜合金滑动材料的耐冲击性和耐磨性通过形成尽可能纯的柔软相Bi而增强。 使用Cu-In合金粉末和含Cu-Bi的Cu基合金粉末的混合粉末。 设定烧结条件使得Bi移动到所述含Cu-Bi的Cu基粉末的颗粒外部并形成不含In的Bi晶界相，并且In从所述含Cu-In的Cu基粉末扩散到所述Cu- 含有Cu的粉末。
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公开(公告)号：US20100266444A1
公开(公告)日：2010-10-21
申请号：US12376381
申请日：2007-08-02
申请人： Hiromi Yokota , Daisuke Yoshitome
发明人： Hiromi Yokota , Daisuke Yoshitome
IPC分类号： C22C9/02
CPC分类号： C22C9/00 , C22C9/02 , C22C32/0089 , F16C2204/12
摘要： When a Cu—Sn—Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.
摘要翻译： 当使用Cu-Sn-Bi颗粒基滑动材料进行滑动时，Cu基体的Cu流动并覆盖Bi相。 随着时间的推移，抗癫痫药物耐药性下降。 提供了防止耐发霉性降低的无铅滑动材料。 （1）组成：Sn的1〜15％，Bi的1〜15％，P的0.02〜0.2％，平均粒径为50〜70μm的1〜10％的硬质粒子， 余量为Cu和不可避免的杂质。 （2）结构：Bi相，硬质粒分散在铜基体中，所有的硬粒子均与铜基体结合。
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公开(公告)号：US10041148B2
公开(公告)日：2018-08-07
申请号：US13555639
申请日：2012-07-23
申请人： Hiromi Yokota , Daisuke Yoshitome
发明人： Hiromi Yokota , Daisuke Yoshitome
摘要： When a Cu—Sn—Bi had—particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.
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公开(公告)号：US20060000527A1
公开(公告)日：2006-01-05
申请号：US11148186
申请日：2005-06-09
申请人： Hiromi Yokota , Daisuke Yoshitome , Hiroaki Hayakawa , Naruhiko Inayoshi , Youichi Murakami , Masashi Suzuki , Takahiro Nozu
发明人： Hiromi Yokota , Daisuke Yoshitome , Hiroaki Hayakawa , Naruhiko Inayoshi , Youichi Murakami , Masashi Suzuki , Takahiro Nozu
IPC分类号： C22C9/00
CPC分类号： C22C32/00 , C22C32/0073 , C22C32/0089 , F16C33/121 , F16C33/14 , F16C2220/20 , F16C2220/44 , F16C2220/82
摘要： In a Cu—Bi based sintered alloy, to which hard particles, such as Fe3P, are added, the main constituent components of the microstructure are a Cu matrix, Bi phase and the hard particles. In the sintering method of the present invention, the flow of the Bi phase is suppressed to as low level as possible. The novel structure is that the contact between the Bi phase and hard particles is kept to a low ratio. A lead-free bearing used for a fuel injection pump according to the present invention contains from 1 to 30 mass % of Bi and from 0.1 to 10 mass % of hard particles having from 10 to 50 μm of the average particle diameter, the balance being Cu and unavoidable impurities. The properties of the main component phases are utilized at a high level such that the sliding properties are equivalent to those of a Pb containing Cu-based sintered alloy.
摘要翻译： 在添加了Fe 3 P 3等硬质粒子的Cu-Bi系烧结合金中，微观结构的主要构成成分是Cu基体，Bi相和硬质粒子。 在本发明的烧结方法中，Bi相的流动被抑制到尽可能低的水平。 新颖的结构是将Bi相与硬质颗粒之间的接触保持在较低的比例。 根据本发明的用于燃料喷射泵的无铅轴承包含1至30质量％的Bi和0.1至10质量％的平均粒径为10至50微米的硬颗粒，余量为 Cu和不可避免的杂质。 主要组分相的性质被利用在高水平，使得滑动性能等于含Pb的Cu基烧结合金的滑动性能。
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公开(公告)号：US07883588B2
公开(公告)日：2011-02-08
申请号：US11148186
申请日：2005-06-09
申请人： Hiromi Yokota , Daisuke Yoshitome , Hiroaki Hayakawa , Naruhiko Inayoshi , Youichi Murakami , Masashi Suzuki , Takahiro Nozu
发明人： Hiromi Yokota , Daisuke Yoshitome , Hiroaki Hayakawa , Naruhiko Inayoshi , Youichi Murakami , Masashi Suzuki , Takahiro Nozu
CPC分类号： C22C32/00 , C22C32/0073 , C22C32/0089 , F16C33/121 , F16C33/14 , F16C2220/20 , F16C2220/44 , F16C2220/82
摘要： In a Cu—Bi based sintered alloy, to which hard particles, such as Fe3P, are added, the main constituent components of the microstructure are a Cu matrix, Bi phase and the hard particles. In the sintering method of the present invention, the flow of the Bi phase is suppressed to as low level as possible. The novel structure is that the contact between the Bi phase and hard particles is kept to a low ratio. A lead-free bearing used for a fuel injection pump according to the present invention contains from 1 to 30 mass % of Bi and from 0.1 to 10 mass % of hard particles having from 10 to 50 μm of the average particle diameter, the balance being Cu and unavoidable impurities. The properties of the main component phases are utilized at a high level such that the sliding properties are equivalent to those of a Pb containing Cu-based sintered alloy.
摘要翻译： 在添加Fe 3 P等硬质粒子的Cu-Bi系烧结合金中，微观组织的主要成分为Cu基体，Bi相和硬质粒子。 在本发明的烧结方法中，Bi相的流动被抑制到尽可能低的水平。 新颖的结构是将Bi相与硬质颗粒之间的接触保持在较低的比例。 根据本发明的用于燃料喷射泵的无铅轴承包含1至30质量％的Bi和0.1至10质量％的平均粒径为10至50μm的硬颗粒，余量为 Cu和不可避免的杂质。 主要组分相的性质被利用在高水平，使得滑动性能等于含Pb的Cu基烧结合金的滑动性能。
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公开(公告)号：US20100111753A1
公开(公告)日：2010-05-06
申请号：US12527003
申请日：2008-02-13
CPC分类号： C22C9/02 , B22F2998/10 , C22C1/0425 , C22C9/00 , C22C9/06 , C22C32/0089 , F16C33/121 , F16C2204/18 , B22F3/1007 , B22F2201/013 , B22F3/115 , B22F3/18
摘要： [Task] The adhesion resistance of Cu—Bi based or Cu—Sn—Bi based alloy is lower than that of Cu—Sn—Pb based alloy, and also since conformability of the former alloy is low. Therefore, when Bi of the former alloy adheres onto an opposite shaft, seizure of the former alloy is likely to occur as compared with the case of the latter Cu—Sn—Pb based alloy. In is alloyed in the Bi phase of the Cu—Sn—Bi—In based copper alloy. The In-alloyed Bi phase has a considerably low melting point and therefore the sliding properties deteriorate.[Means for Solving] A Pb-free copper-based sintered sliding material has a composition that 0.5 to 15.0 mass % Bi and 0.3 to 15.0 mass % In, with the balance being Cu and inevitable impurities. With regard to the existence of Cu, Bi, and In, the material consists of a Cu matrix containing In, a Bi phase, and an In concentrated region in said Cu matrix at a boundary of said Bi phase.
摘要翻译： [任务] Cu-Bi系或Cu-Sn-Bi系合金的耐附着性比Cu-Sn-Pb系合金低，并且由于前者合金的贴合性低。 因此，当前一种合金的Bi附着在相反的轴上时，与后一种Cu-Sn-Pb基合金的情况相比，容易发生前者合金的咬合。 In在Cu-Sn-Bi-In系铜合金的Bi相中合金化。 合金化双相具有相当低的熔点，因此滑动性劣化。 [解决方法]无铅铜系烧结滑动材料具有0.5〜15.0质量％Bi和0.3〜15.0质量％In的组成，余量为Cu和不可避免的杂质。 关于Cu，Bi和In的存在，该材料由在所述Bi相的边界处的所述Cu基体中含有In，Bi相和In浓缩区域的Cu基体组成。
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公开(公告)号：US07678173B2
公开(公告)日：2010-03-16
申请号：US10585993
申请日：2005-01-13
CPC分类号： C22C32/0073 , B22F2998/10 , B22F2999/00 , C22C9/00 , C22C32/0089 , F16C33/121 , C22C1/05 , B22F3/10 , B22F3/18 , B22F2201/013
摘要： In a Pb-free copper-based sintered alloy containing from 1 to 30% of Bi and from 0.1 to 10% of hard matter particles having from 10 to 50 μm of average particle diameter, the Bi phase has a smaller average particle diameter than that of the hard matter particles and is dispersed in the Cu matrix, or the hard matter particles having 50% or less of a contact length ratio with the Bi phase based on the total circumferential length of the hard particle, which are in contact with said Bi phase, are present in a ratio of 70% or more based on the entire number of the hard matter particles.
摘要翻译： 在含有1〜30％的Bi和0.1〜10％的平均粒径为10〜50μm的硬质粒子的无铅铜基烧结合金中，Bi相的平均粒径小于 的硬质颗粒分散在Cu基体中，或者与基于与所述Bi相接触的硬质颗粒的总周长的Bi相的接触长度比例为50％以下的硬质物质粒子 相以相对于整个数量的硬质粒子为70％以上的比例存在。
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公开(公告)号：US20120294750A1
公开(公告)日：2012-11-22
申请号：US13555639
申请日：2012-07-23
申请人： HIROMI YOKOTA , Daisuke Yoshitome
发明人： HIROMI YOKOTA , Daisuke Yoshitome
IPC分类号： B22F3/10
CPC分类号： C22C9/00 , C22C9/02 , C22C32/0089 , F16C2204/12
摘要： When a Cu—Sn—Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.
摘要翻译： 当使用Cu-Sn-Bi颗粒基滑动材料进行滑动时，Cu基体的Cu流动并覆盖Bi相。 随着时间的推移，抗癫痫药物耐药性下降。 提供了防止耐发霉性降低的无铅滑动材料。 （1）组成：Sn的1〜15％，Bi的1〜15％，P的0.02〜0.2％，平均粒径为50〜70μm的1〜10％的硬质粒子， 余量为Cu和不可避免的杂质。 （2）结构：Bi相，硬质粒分散在铜基体中，所有的硬粒子均与铜基体结合。
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10.发明申请公开(公告)号：US20110020171A1
公开(公告)日：2011-01-27
申请号：US12864171
申请日：2009-01-22
CPC分类号： B22F3/10 , B22F1/0003 , B22F3/1017 , C22C1/0425 , C22C9/00 , C22C9/02 , F16C2204/12 , F16C2204/18 , F16C2360/42
摘要： Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi.Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
摘要翻译： Cu-Bi-In铜合金滑动材料的耐冲击性和耐磨性通过形成尽可能纯的柔软相Bi而增强。 使用Cu-In合金粉末和含Cu-Bi的Cu基合金粉末的混合粉末。 设定烧结条件使得Bi移动到所述含Cu-Bi的Cu基粉末的颗粒外部并形成不含In的Bi晶界相，并且In从所述含Cu-In的Cu基粉末扩散到所述Cu- 含有Cu的粉末。
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