Oven Controlled MEMS Oscillator Device
    1.
    发明申请
    Oven Controlled MEMS Oscillator Device 审中-公开
    烤箱控制MEMS振荡器装置

    公开(公告)号:US20120305542A1

    公开(公告)日:2012-12-06

    申请号:US13150499

    申请日:2011-06-01

    IPC分类号: A21B1/02

    CPC分类号: H03L1/022 H03L1/04

    摘要: A system is disclosed that includes an oven and a micromechanical oscillator inside the oven configured to oscillate at a predetermined frequency at a predetermined temperature, where the predetermined frequency is based on a temperature dependency and at least one predetermined property. The system further includes an excitation mechanism configured to excite the micromechanical oscillator to oscillate at the predetermined frequency and a temperature control loop configured to detect a temperature of the micromechanical oscillator using resistive sensing, determine whether the temperature of the micromechanical oscillator is within a predetermined range of the predetermined temperature based on the temperature dependency and the at least one predetermined property in order to minimize frequency drift, and adapt the temperature of the micromechanical oscillator to remain within the predetermined range. The system further includes a frequency output configured to output the predetermined frequency of the micromechanical oscillator.

    摘要翻译: 公开了一种系统,其包括烘箱内部的微机械振荡器,其配置成在预定频率以预定温度振荡,其中预定频率基于温度依赖性和至少一个预定特性。 该系统还包括激励机构,其被配置为激励微机械振荡器以预定频率振荡;以及温度控制回路,其被配置为使用电阻感测来检测微机械振荡器的温度,确定微机械振荡器的温度是否在预定范围内 基于温度依赖性和至少一个预定特性,以便使频率漂移最小化,并使微机械振荡器的温度保持在预定范围内。 该系统还包括被配置为输出微机械振荡器的预定频率的频率输出。

    Reconfigurable cavity resonator with movable micro-electromechanical elements as tuning elements
    2.
    发明授权
    Reconfigurable cavity resonator with movable micro-electromechanical elements as tuning elements 有权
    具有可移动微机电元件的可重构空腔谐振器作为调谐元件

    公开(公告)号:US07586393B2

    公开(公告)日:2009-09-08

    申请号:US11744609

    申请日:2007-05-04

    IPC分类号: H01P7/06

    CPC分类号: H01P7/06

    摘要: One inventive aspect relates to a reconfigurable cavity resonator. The resonator comprises a cavity delimited by metallic walls. The resonator further comprises a coupling device for coupling an electromagnetic wave into the cavity. The resonator further comprises a tuning element for tuning a resonance frequency at which the electromagnetic wave resonates in the cavity. The tuning element comprises one or more movable micro-electromechanical elements with an associated actuation element located in their vicinity for actuating each of them between an up state and a down state. The movable micro-electromechanical elements at least partially have a conductive surface and are mounted within the cavity.

    摘要翻译: 本发明的一个方面涉及可重构腔谐振器。 谐振器包括由金属壁限定的空腔。 谐振器还包括用于将电磁波耦合到空腔中的耦合装置。 谐振器还包括用于调谐电磁波在空腔中谐振的谐振频率的调谐元件。 调谐元件包括一个或多个可移动的微机电元件,其中相关联的致动元件位于其附近,用于在升高状态和向下状态之间驱动它们。 可移动的微机电元件至少部分地具有导电表面并且安装在腔内。

    Method for designing a micro electromechanical device with reduced self-actuation
    3.
    发明申请
    Method for designing a micro electromechanical device with reduced self-actuation 有权
    用于设计具有减少的自动致动的微机电装置的方法

    公开(公告)号:US20060168788A1

    公开(公告)日:2006-08-03

    申请号:US11317370

    申请日:2005-12-23

    IPC分类号: H04R17/00

    摘要: A method is described for designing a micro electromechanical device in which the risk of self-actuation of the device in use is reduced. The method includes locating a first conductor in a plane and locating a second conductor with its collapsible portion at a predetermined distance above the plane. The method also includes laterally offsetting the first conductor by a predetermined distance from a region of maximum actuation liability. The region of maximum actuation liability is where an attraction force to be applied to activate the device is at a minimum.

    摘要翻译: 描述了一种用于设计微机电装置的方法,其中使用中的装置的自动致动的风险降低。 该方法包括将第一导体定位在平面中并将具有其可折叠部分的第二导体定位在平面上方预定距离处。 该方法还包括将第一导体横向偏移距离最大致动责任区域预定的距离。 最大致动责任区域是要施加以激活装置的吸引力的最小值。

    Micro electromechanical device with stress and stress gradient compensation
    4.
    发明申请
    Micro electromechanical device with stress and stress gradient compensation 审中-公开
    具有应力和应力梯度补偿的微机电装置

    公开(公告)号:US20070069605A1

    公开(公告)日:2007-03-29

    申请号:US11453697

    申请日:2006-06-15

    IPC分类号: H02N1/00 H01L41/00

    摘要: Micro electromechanical devices and methods for designing such devices are disclosed. An example micro electromechanical device includes at least two anchors. The example device also includes a floating element. The floating element extends between the at least two anchors and includes a predetermined reference portion. In at least one predetermined state during operation of the device, the reference portion is located within a predetermined reference plane. The floating element includes at least two flexible sections, where the at least two flexible sections each extends between the reference portion and a respective one of the anchors. In the example device, at least two of the at least two flexible sections include respective stress relieving elements. The stress relieving elements enable deflection of the floating element as a result of a stress gradient. The stress relieving elements are provided at predetermined locations between the respective anchors and the reference portion, where the predetermined locations are selected such that the reference portion is substantially located within the predetermined reference plane in the at least one predetermined state of the device.

    摘要翻译: 公开了用于设计这种装置的微机电装置和方法。 示例性微机电装置包括至少两个锚。 示例设备还包括浮动元件。 浮动元件在至少两个锚固件之间延伸并且包括预定的参考部分。 在设备运行期间的至少一个预定状态下,参考部分位于预定的参考平面内。 浮动元件包括至少两个柔性部分,其中至少两个柔性部分各自在参考部分和相应的一个锚固件之间延伸。 在示例性装置中,至少两个柔性部分中的至少两个包括各自的应力释放元件。 应力消除元件使得浮动元件由于应力梯度而偏转。 应力消除元件设置在相应的锚固件和参考部分之间的预定位置处,其中预定位置被选择为使得参考部分在装置的至少一个预定状态中基本上位于预定参考平面内。

    Acoustic resonator
    5.
    发明申请
    Acoustic resonator 有权
    声谐振器

    公开(公告)号:US20050146401A1

    公开(公告)日:2005-07-07

    申请号:US11024165

    申请日:2004-12-27

    IPC分类号: H03H9/02 H03H9/17 H03H9/54

    摘要: A tuneable film bulk acoustic resonator (FBAR) device. The FBAR device includes a bottom electrode, a top electrode and a piezoelectric layer in between the bottom electrode and the top electrode. The piezoelectric layer has a first overlap with the bottom electrode, where the first overlap is defined by a projection of the piezoelectric layer onto the bottom electrode in a direction substantially perpendicular to a plane of the bottom electrode. The FBAR device also includes a first dielectric layer in between the piezoelectric layer and the bottom electrode and a mechanism for reversibly varying an internal impedance of the device, so as to tune a resonant frequency of the FBAR device.

    摘要翻译: 可调薄膜体声共振器(FBAR)装置。 FBAR器件包括在底部电极和顶部电极之间的底部电极,顶部电极和压电层。 压电层具有与底部电极的第一重叠,其中第一重叠由基本上垂直于底部电极的平面的方向将压电层投影到底部电极上限定。 FBAR器件还包括在压电层和底部电极之间的第一介电层和用于可逆地改变器件的内部阻抗的机构,以调谐FBAR器件的谐振频率。

    Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
    6.
    发明申请
    Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules 有权
    集成可调/可切换无源微波和毫米波模块的制造方法和系统

    公开(公告)号:US20050003606A1

    公开(公告)日:2005-01-06

    申请号:US10897271

    申请日:2004-07-21

    摘要: An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further comprises forming a passive device on the substrate at a location laterally adjacent to the interconnect section. The passive device comprises at least one moveable element comprising a metal layer. The method further comprises forming the metal layer and one of the at least two metal interconnect layers from substantially the same material.

    摘要翻译: 互连模块及其制造方法。 在衬底上制造互连模块的方法包括在衬底上形成互连部分。 互连部分包括由介电层隔开的至少两个金属互连层。 该方法还包括在横向邻近互连部分的位置处在衬底上形成无源器件。 无源器件包括至少一个包括金属层的可移动元件。 该方法还包括从基本上相同的材料形成金属层和至少两个金属互连层中的一个。

    MEMS ELEMENT AND ELECTRICAL DEVICE USING THE SAME
    7.
    发明申请
    MEMS ELEMENT AND ELECTRICAL DEVICE USING THE SAME 有权
    使用其的MEMS元件和电气设备

    公开(公告)号:US20130214366A1

    公开(公告)日:2013-08-22

    申请号:US13590439

    申请日:2012-08-21

    IPC分类号: H01L29/84

    CPC分类号: H01L29/84 B81C1/00293

    摘要: In a MEMS element 500 where a MEMS structure 201 is hermetically sealed in a cavity 110 by a substrate 301 and laminated structure 120, interface sealing layers 101, 102 and 103 are provided between two layers that constitute the laminated structure 120, so as to prevent gas from breaking into the cavity 110 through the interface between two layers along the direction parallel to the surface of the substrate 301.

    摘要翻译: 在通过基板301和层叠结构120将MEMS结构201气密地密封在空腔110中的MEMS元件500中,在构成层叠结构120的两层之间设置界面密封层101,102和103,以防止 气体沿着平行于衬底301的表面的方向通过两层之间的界面而进入空腔110。

    Optimal Leg Design for MEMS Resonator
    8.
    发明申请
    Optimal Leg Design for MEMS Resonator 审中-公开
    MEMS谐振器的最佳腿设计

    公开(公告)号:US20120188023A1

    公开(公告)日:2012-07-26

    申请号:US13150442

    申请日:2011-06-01

    IPC分类号: H03B5/30

    摘要: A microelectromechanical (MEMS) resonator is disclosed that comprises a substrate and a resonator body suspended above the substrate by means of clamped-clamped beams, where each beam comprises two support legs with a common connection to the resonator body, and the resonator body is configured to resonate at an operating frequency. The MEMS resonator further comprises an excitation component configured to excite the resonator body to resonate at the operating frequency, where each beam is further configured to oscillate in a flexural mode at a flexural wavelength as a result of resonating at the operating frequency, and each leg is acoustically long with respect to the flexural wavelength.

    摘要翻译: 公开了一种微机电(MEMS)谐振器,其包括基板和谐振器体,该谐振器主体借助于夹紧的夹持梁悬挂在基板之上,其中每个梁包括两个与谐振器主体共同连接的支撑腿,并且谐振器本体被配置 以工作频率共鸣。 MEMS谐振器还包括激励部件,其被配置为激励谐振器主体以工作频率谐振,其中每个光束进一步配置为在弯曲波长下以弯曲波长振荡,作为在工作频率下谐振的结果,并且每个支腿 相对于弯曲波长在声学上长。

    Temperature Compensation Device and Method for MEMS Resonator
    9.
    发明申请
    Temperature Compensation Device and Method for MEMS Resonator 审中-公开
    MEMS谐振器温度补偿装置及方法

    公开(公告)号:US20110175492A1

    公开(公告)日:2011-07-21

    申请号:US13009638

    申请日:2011-01-19

    IPC分类号: H03H9/08

    CPC分类号: H03H9/02448

    摘要: The present disclosure provides a device including a MEMS resonating element, provided for resonating at a predetermined resonance frequency, the MEMS resonating element having at least one temperature dependent characteristic, a heating circuit arranged for heating the MEMS resonating element to an offset temperature (Toffset), a sensing circuit associated with the MEMS resonating element and provided for sensing its temperature dependent characteristic, and a control circuit connected to the sensing circuit for receiving measurement signals indicative of the sensed temperature dependent characteristic and connected to the heating circuit for supplying a control signal thereto to maintain the temperature of the MEMS resonating element at the offset temperature. The heating circuit includes a tunable thermal radiation source and the MEMS resonating element is provided so as to absorb at least a portion of the thermal radiation generated by the tunable thermal radiation source.

    摘要翻译: 本公开提供了一种包括MEMS谐振元件的器件,其被提供用于以预定谐振频率谐振,具有至少一个温度依赖特性的MEMS谐振元件,被布置为将MEMS谐振元件加热到偏移温度(Toffset)的加热电路, 与MEMS谐振元件相关联并用于感测其与温度相关的特性的感测电路,以及连接到感测电路的控制电路,用于接收指示感测到的温度依赖特性并连接到加热电路的测量信号,以供应控制信号 以将MEMS谐振元件的温度保持在偏移温度。 加热电路包括可调谐热辐射源,并且提供MEMS谐振元件以便吸收由可调热辐射源产生的热辐射的至少一部分。

    MEMS element and electrical device using the same
    10.
    发明授权
    MEMS element and electrical device using the same 有权
    MEMS元件和使用该元件的电子器件

    公开(公告)号:US08610224B2

    公开(公告)日:2013-12-17

    申请号:US13590439

    申请日:2012-08-21

    IPC分类号: H01L23/06 H01L23/10

    CPC分类号: H01L29/84 B81C1/00293

    摘要: In a MEMS element 500 where a MEMS structure 201 is hermetically sealed in a cavity 110 by a substrate 301 and laminated structure 120, interface sealing layers 101, 102 and 103 are provided between two layers that constitute the laminated structure 120, so as to prevent gas from breaking into the cavity 110 through the interface between two layers along the direction parallel to the surface of the substrate 301.

    摘要翻译: 在通过基板301和层叠结构120将MEMS结构201气密地密封在空腔110中的MEMS元件500中,在构成层叠结构120的两层之间设置界面密封层101,102和103,以防止 气体沿着平行于衬底301的表面的方向通过两层之间的界面而进入空腔110。