公开(公告)号：US07755200B2

公开(公告)日：2010-07-13

申请号：US12210920

申请日：2008-09-15

Applicant: Hau Nguyen

Inventor： Hau Nguyen

IPC: H01L23/48

CPC classification number: B23K3/0623 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/40 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10257 ,  Y02P70/613 ,  Y10T428/24612

Abstract: The present invention relates to methods and arrangements for forming a solder joint connection. One embodiment involves an improved solder ball. The solder ball includes a perforated, metallic shell with an internal opening. Solder material encases the shell and fills its internal opening. The solder ball may be applied to an electrical device, such as an integrated circuit die, to form a solder bump on the device. The solder bump in turn can be used to form an improved solder joint connection between the device and a suitable substrate, such as a printed circuit board. In some applications, a solder joint connection is formed without requiring the application of additional solder material to the surface of the substrate. The present invention also includes different solder bump arrangements and methods for using such arrangements to form solder joint connections between devices and substrates.

Abstract translation: 本发明涉及形成焊点连接的方法和装置。 一个实施例涉及一种改进的焊球。 焊球包括具有内部开口的穿孔金属外壳。 焊接材料包住外壳并填充其内部开口。 焊球可以被施加到诸如集成电路管芯的电气装置上，以在器件上形成焊料凸块。 焊料凸点又可用于在器件和合适的衬底（例如印刷电路板）之间形成改进的焊点连接。 在一些应用中，形成焊接接头，而不需要向衬底的表面施加额外的焊料。 本发明还包括不同的焊料凸块布置和使用这种布置来形成器件和衬底之间的焊接连接的方法。

公开(公告)号：US07629246B2

公开(公告)日：2009-12-08

申请号：US11897971

申请日：2007-08-30

Applicant: Viraj Patwardhan ,  Hau Nguyen

Inventor： Viraj Patwardhan ,  Hau Nguyen

IPC: H01L21/44

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/13099 ,  H01L2224/13561 ,  H01L2224/13575 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/0221 ,  Y02P70/613

Abstract: A Micro SMDxt package is provided that configured for mounting to a circuit board. The SMDxt package includes a silicon-based IC having an array of contact pads on one side of thereof, and a die electrically attached to the silicon-based IC. A plurality of solder balls is included, each of which has a polymeric core surrounded by a metallic shell that in turn is surrounded by a layer of solder material. Further, each solder ball is positioned in contact with a corresponding contact pad of the package. An intertwined intermetallic fusion layer is formed through the fusion between material components of the contact pads and the solder material, via heat treatment. The intermetallic fusion extends between and from an outer surface of the metallic shell of each solder to an outer surface of a corresponding contact pad to form a high strength intermetallic solder joint therebetween.

Abstract translation: 提供了一个Micro SMDxt封装，用于安装到电路板上。 SMDxt封装包括其一侧具有接触焊盘阵列的硅基IC，以及电连接到硅基IC的管芯。 包括多个焊球，每个焊球具有由金属壳包围的聚合物芯，该金属壳又由一层焊料材料包围。 此外，每个焊球定位成与封装的对应接触焊盘接触。 通过热处理，通过接触焊盘的材料部件和焊料材料之间的熔合形成交织的金属间熔融层。 金属间熔融物在每个焊料的金属壳的外表面之间和从相应的接触焊盘的外表面延伸，以在它们之间形成高强度的金属间焊料接头。

公开(公告)号：US07918200B2

公开(公告)日：2011-04-05

申请号：US12087934

申请日：2006-12-21

Applicant: Van Hau Nguyen

Inventor： Van Hau Nguyen

IPC: F01L1/18

CPC classification number: F01L1/182 ,  F01L2001/188 ,  Y10T74/20882

Abstract: A rocker arm (1) made of thin-walled sheet steel which rocker arm is intended for a suspended arrangement together with other like rocker arms under a girder-like carrier (2) of a valve train of an internal combustion engine, the rocker arm having an inverted U-shaped profile, a support (7) for a gas exchange valve is formed on one end (6) of an underside (5) of a crossbar (4) of the rocker arm, an upper side (9) of the crossbar (4) is stamped in the region of the support (7) by a stamping and extrusion molding method toward the underside (5), so that an M-like cross-section with a longitudinal channel (10) formed on the upper side (9) is obtained and at its other end (11), the rocker arm (1) has a fork-shaped, open configuration and merges into a region (12) which is angularly bent towards the underside (5) and on which a roller (13) forming a cam contacting surface is arranged, said rocker arm (1) of this type possesses, among other things, an excellent stiffness, is simple to manufacture and has a small design height requirement.

Abstract translation: 一种由薄壁钢板制成的摇臂（1），该摇臂用于与内燃机的气门机构的梁状载体（2）下的其他类似的摇臂一起悬挂在一起，摇臂 具有倒U形轮廓，用于气体交换阀的支撑件（7）形成在摇臂的横杆（4）的下侧（5）的一端（6）上，上侧（9） 横杆（4）通过冲压和挤出成型方法冲压到支撑件（7）的区域中，朝向下侧（5），使得具有形成在上部（5）上的纵向通道（10）的M形横截面 （9），并且在其另一端（11）处，摇臂（1）具有叉状开口构造并且合并成朝向下侧（5）成角度地弯曲的区域（12），并且其上 布置形成凸轮接触表面的辊（13），所述这种类型的摇臂（1）具有优异的刚度，简单的制动 具有较小的设计高度要求。

公开(公告)号：US20100068466A1

公开(公告)日：2010-03-18

申请号：US12210920

申请日：2008-09-15

Applicant: Hau NGUYEN

Inventor： Hau NGUYEN

IPC: B32B3/22 ,  B23K35/14 ,  B23K1/20

CPC classification number: B23K3/0623 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/40 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10257 ,  Y02P70/613 ,  Y10T428/24612

Abstract: The present invention relates to methods and arrangements for forming a solder joint connection. One embodiment involves an improved solder ball. The solder ball includes a perforated, metallic shell with an internal opening. Solder material encases the shell and fills its internal opening. The solder ball may be applied to an electrical device, such as an integrated circuit die, to form a solder bump on the device. The solder bump in turn can be used to form an improved solder joint connection between the device and a suitable substrate, such as a printed circuit board. In some applications, a solder joint connection is formed without requiring the application of additional solder material to the surface of the substrate. The present invention also includes different solder bump arrangements and methods for using such arrangements to form solder joint connections between devices and substrates.

Abstract translation: 本发明涉及形成焊点连接的方法和装置。 一个实施例涉及一种改进的焊球。 焊球包括具有内部开口的穿孔金属外壳。 焊接材料包住外壳并填充其内部开口。 焊球可以被施加到诸如集成电路管芯的电气装置上，以在器件上形成焊料凸块。 焊料凸点又可用于在器件和合适的衬底（例如印刷电路板）之间形成改进的焊点连接。 在一些应用中，形成焊接接头，而不需要向衬底的表面施加额外的焊料。 本发明还包括不同的焊料凸块布置和使用这种布置来形成器件和衬底之间的焊接连接的方法。

公开(公告)号：US20090174069A1

公开(公告)日：2009-07-09

申请号：US11969704

申请日：2008-01-04

Applicant: Hau Nguyen ,  Luu T. Nguyen ,  Anindya Poddar

Inventor： Hau Nguyen ,  Luu T. Nguyen ,  Anindya Poddar

IPC: H01L23/488

CPC classification number: H01L24/16 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device is described. The device includes an integrated circuit die having an active surface that includes a plurality of input/output (I/O) pads. The device further includes a plurality of crack resistant structures. Each crack resistant structure is formed over an associated I/O pad and includes an associated raised portion. Each I/O pad may be bumped with solder such that a solder bump is formed over the associated crack resistant structure on the I/O pad.

Abstract translation: 描述半导体器件。 该器件包括具有包括多个输入/输出（I / O）焊盘的有源表面的集成电路管芯。 该装置还包括多个抗裂结构。 每个抗裂结构都形成在相关的I / O焊盘上，并且包括相关联的凸起部分。 每个I / O焊盘可能被焊接凸起，使得在I / O焊盘上的相关的抗裂结构上形成焊料凸块。

公开(公告)号：US20090057897A1

公开(公告)日：2009-03-05

申请号：US11897971

申请日：2007-08-30

Applicant: Viraj Patwardhan ,  Hau Nguyen

Inventor： Viraj Patwardhan ,  Hau Nguyen

IPC: H01L23/488 ,  B23K31/02 ,  H01L21/60

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/13099 ,  H01L2224/13561 ,  H01L2224/13575 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/0221 ,  Y02P70/613

Abstract: A Micro SMDxt package is provided that configured for mounting to a circuit board. The SMDxt package includes a silicon-based IC having an array of contact pads on one side of thereof, and a die electrically attached to the silicon-based IC. A plurality of solder balls is included, each of which has a polymeric core surrounded by a metallic shell that in turn is surrounded by a layer of solder material. Further, each solder ball is positioned in contact with a corresponding contact pad of the package. An intertwined intermetallic fusion layer is formed through the fusion between material components of the contact pads and the solder material, via heat treatment. The intermetallic fusion extends between and from an outer surface of the metallic shell of each solder to an outer surface of a corresponding contact pad to form a high strength intermetallic solder joint therebetween.

公开(公告)号：US20090007870A1

公开(公告)日：2009-01-08

申请号：US12087934

申请日：2006-12-21

Applicant: Van Hau Nguyen

Inventor： Van Hau Nguyen

IPC: F01L1/18

CPC classification number: F01L1/182 ,  F01L2001/188 ,  Y10T74/20882

Abstract: A rocker arm (1) made of thin-walled sheet steel which rocker arm is intended for a suspended arrangement together with other like rocker arms under a girder-like carrier (2) of a valve train of an internal combustion engine, the rocker arm having an inverted U-shaped profile, a support (7) for a gas exchange valve is formed on one end (6) of an underside (5) of a crossbar (4) of the rocker arm, an upper side (9) of the crossbar (4) is stamped in the region of the support (7) by a stamping and extrusion molding method toward the underside (5), so that an M-like cross-section with a longitudinal channel (10) formed on the upper side (9) is obtained and at its other end (11), the rocker arm (1) has a fork-shaped, open configuration and merges into a region (12) which is angularly bent towards the underside (5) and on which a roller (13) forming a cam contacting surface is arranged, said rocker arm (1) of this type possesses, among other things, an excellent stiffness, is simple to manufacture and has a small design height requirement.

Abstract translation: 由薄壁钢板制成的摇臂（1），该摇臂用于与内燃机的气门机构的梁状载体（2）下方的其他类似的摇臂一起悬挂在一起，摇臂 具有倒U形轮廓，用于气体交换阀的支撑件（7）形成在摇臂的横杆（4）的下侧（5）的一端（6）上，上侧（9） 横杆（4）通过冲压和挤出成型方法冲压到支撑件（7）的区域中，朝向下侧（5），使得具有形成在上部（5）上的纵向通道（10）的M形横截面 （9），并且在其另一端（11）处，摇臂（1）具有叉状开口构造并且合并成朝向下侧（5）成角度地弯曲的区域（12），并且其上 布置形成凸轮接触表面的辊（13），所述这种类型的摇臂（1）具有优异的刚度，简单的制动 具有较小的设计高度要求。

公开(公告)号：US10661316B2

公开(公告)日：2020-05-26

申请号：US13480946

申请日：2012-05-25

Applicant: Hau Nguyen-Phuc Pham ,  Miguel Lopez ,  Laurent Coquilleau

Inventor： Hau Nguyen-Phuc Pham ,  Miguel Lopez ,  Laurent Coquilleau

IPC: B08B9/093

Abstract: A system is disclosed. The system is provided with an oilfield material reservoir, a fluid nozzle, and a fluid supplier. The oilfield material reservoir is provided with an opening for receiving an oilfield material and an orifice for discharging the oilfield material. The fluid nozzle is positioned adjacent to the orifice to direct a fluid flow through the orifice, and the fluid supplier is connected to the fluid nozzle.

公开(公告)号：US09574412B2

公开(公告)日：2017-02-21

申请号：US14122685

申请日：2012-05-25

Applicant: Hau Nguyen-Phuc Pham ,  Miguel Lopez ,  Laurent Coquilleau

Inventor： Hau Nguyen-Phuc Pham ,  Miguel Lopez ,  Laurent Coquilleau

IPC: E21B21/06 ,  E21B43/267 ,  G05D7/06

CPC classification number: B65G65/005 ,  B65D88/26 ,  B65D88/54 ,  B65G65/40 ,  E21B21/062 ,  E21B41/00 ,  E21B43/267 ,  G05D7/0605 ,  G05D7/0617

Abstract: An oilfield material reservoir is disclosed. The oilfield material reservoir has a body, the body having an upper end, a lower end, a sidewall extending between the upper and lower ends, the sidewall defining a recess within the body, an opening defined by the upper end, and a first orifice defined by the lower end. The oilfield material reservoir is also provided with a metering gate connected to the body at the lower end. The metering gate has a base having a second orifice aligned with the first orifice, and a knife gate connected to the base. The second orifice has a substantially trapezoidal shape. The knife gate is configured to slidably cover the second orifice. A method is also disclosed for controlling a discharge rate of oilfield material within the oilfield material reservoir by adjusting a metering open area of the second orifice according to mathematical modeling equations.

Abstract translation: 公开了一种油田储层。 油田材料储存器具有主体，主体具有上端，下端，在上端和下端之间延伸的侧壁，侧壁限定主体内的凹部，由上端限定的开口，以及第一孔 由下端定义。 油田物料储存器还设置有连接到下端的主体的计量门。 计量门具有底座，其具有与第一孔对准的第二孔，以及连接到底座的刀栅。 第二孔具有大致梯形的形状。 刀门构造成可滑动地覆盖第二孔。 还公开了一种通过根据数学建模方程式调节第二孔口的计量开口面积来控制油田物料储存器内的油田物料的排放速率的方法。

公开(公告)号：US20120298210A1

公开(公告)日：2012-11-29

申请号：US13480946

申请日：2012-05-25

Applicant: Hau Nguyen-Phuc Pham ,  Miguel Lopez ,  Laurent Coquilleau

Inventor： Hau Nguyen-Phuc Pham ,  Miguel Lopez ,  Laurent Coquilleau

IPC: B08B3/00 ,  B65D25/40

Abstract: A system is disclosed. The system is provided with an oilfield material reservoir, a fluid nozzle, and a fluid supplier. The oilfield material reservoir is provided with an opening for receiving an oilfield material and an orifice for discharging the oilfield material. The fluid nozzle is positioned adjacent to the orifice to direct a fluid flow through the orifice, and the fluid supplier is connected to the fluid nozzle.

Abstract translation: 公开了一种系统。 该系统设置有油田物料储存器，流体喷嘴和流体供应器。 油田物料储存器设置有用于接收油田物料的开口和用于排出油田物料的孔口。 流体喷嘴定位成邻近孔口以引导流体流过孔口，并且流体供应器连接到流体喷嘴。