公开(公告)号：US20120251830A1

公开(公告)日：2012-10-04

申请号：US13498278

申请日：2010-09-28

Applicant: Tomoo Nishiyama ,  Haruaki Sue ,  Hideyuki Katagi ,  Naoki Hara ,  Hiroyuki Takahashi ,  Yasuo Miyazaki ,  Yoshitaka Takezawa ,  Hiroyuki Tanaka ,  Kensuke Yoshihara ,  Masayoshi Joumen

Inventor： Tomoo Nishiyama ,  Haruaki Sue ,  Hideyuki Katagi ,  Naoki Hara ,  Hiroyuki Takahashi ,  Yasuo Miyazaki ,  Yoshitaka Takezawa ,  Hiroyuki Tanaka ,  Kensuke Yoshihara ,  Masayoshi Joumen

IPC: C08L63/00 ,  B32B37/06 ,  B32B37/14 ,  C08K3/22 ,  B32B15/092

CPC classification number: C08L63/08 ,  B32B15/08 ,  B32B27/26 ,  B32B27/38 ,  C08G59/621 ,  C08K3/22 ,  C08K2003/2227 ,  C08L61/06 ,  C08L61/12 ,  C08L63/00 ,  Y10T156/10 ,  Y10T428/31529 ,  C08L2666/22 ,  C08L2666/16

Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing.In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.

Abstract translation: 含有具有介晶结构的环氧树脂单体，含有具有下述通式（I）表示的结构单元的化合物的酚醛清漆树脂）和无机填料的树脂组合物在固化前的保存稳定性优异，可以达到 固化后导热性好。 在下列通式（I）中，R 1，R 2和R 3独立地表示氢原子，烷基，芳基或芳烷基。 m表示0〜2的整数。 n为1〜7的整数。

公开(公告)号：US07504471B2

公开(公告)日：2009-03-17

申请号：US10514501

申请日：2002-10-11

Applicant: Haruaki Sue ,  Takashi Kumaki ,  Hideyasu Tsuiki ,  Hiroshi Matsutani ,  Toshihiko Takasaki ,  Iwao Fukuchi

Inventor： Haruaki Sue ,  Takashi Kumaki ,  Hideyasu Tsuiki ,  Hiroshi Matsutani ,  Toshihiko Takasaki ,  Iwao Fukuchi

IPC: C08G8/28 ,  C08L63/00 ,  C08L63/04

CPC classification number: C07C323/29 ,  C07C323/16 ,  C07C323/20 ,  C07C323/56 ,  C07C323/66 ,  C08G59/06

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—  (1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract translation: 本发明公开了一种含硫酚醛树脂，其含有下述式（1）表示的有机基团：<？在线式说明=“在线式”末端=“铅”→R1-S -R2-S-R1-（1）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中R1表示碳原子数2〜6的烃基，R2表示烃基 具有1至10个碳原子，酚碳和酚碳之间，由下式（5）表示的苯酚衍生物：其中R5表示C2-3亚烷基，R6表示C1-10亚烷基，G表示H， C1-10烷基等，以及含有（A）上述式（5）的固化剂和（B）环氧树脂作为必要成分的环氧树脂组合物。

公开(公告)号：US06207789B1

公开(公告)日：2001-03-27

申请号：US09445275

申请日：2000-02-23

Applicant: Haruaki Sue ,  Shinsuke Hagiwara ,  Fumio Furusawa ,  Seiichi Akagi ,  Kazuyoshi Tendo

Inventor： Haruaki Sue ,  Shinsuke Hagiwara ,  Fumio Furusawa ,  Seiichi Akagi ,  Kazuyoshi Tendo

IPC: C08G1404

CPC classification number: C08G8/24 ,  C08G8/08 ,  C08G8/10 ,  H01B3/36 ,  H01L23/293 ,  H01L24/45 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides a resin containing in the backbone chain a structural unit represented by the following Formula (I) or (II), as a novel phenolic resin having a high Tg, a low moisture absorption, a low molding shrinkage, high adhesive properties and high flow properties. The present invention also provides a resin composition and a molding material each containing the above resin, and an electronic component device having a device element encapsulated with it.

Abstract translation: 本发明提供一种在主链中含有由下式（I）或（II）表示的结构单元的树脂，作为具有高Tg，低吸湿性，低成型收缩率，高粘合性的新型酚醛树脂 和高流动性。 本发明还提供了各自含有上述树脂的树脂组合物和成型材料，以及具有被封装的器件元件的电子部件器件。

公开(公告)号：US5510446A

公开(公告)日：1996-04-23

申请号：US458702

申请日：1995-06-02

Applicant: Haruaki Sue ,  Shinsuke Hagiwara ,  Hiroyuki Saitoh

Inventor： Haruaki Sue ,  Shinsuke Hagiwara ,  Hiroyuki Saitoh

IPC: C08G8/04 ,  C08G8/28 ,  C08L61/06 ,  C08L63/00 ,  H01B3/36 ,  H01B3/40 ,  H01L23/29 ,  C08G14/04

CPC classification number: H01L23/293 ,  C08G8/04 ,  C08G8/28 ,  C08L61/06 ,  C08L63/00 ,  H01B3/36 ,  H01B3/40 ,  H01L2924/0002

Abstract: A naphthol-modified phenolic resin having low softening point and good flowability is obtained by allowing a naphthol and a phenol to react with an aldehyde in the presence of an acid catalyst at 60 to 110.degree. C. to obtain a primary reaction mixture, heating the primary reaction mixture in the presence of a strong acid, a super acid or a mixture thereof under ambient pressure at 120 to 180.degree. C. for 1 to 12 hours to obtain a secondary reaction mixture, and subjecting the secondary reaction mixture to vacuum concentration or steam distillation, and the naphthol-modified phenolic resin is suited to use as a curing agent in epoxy resin molding materials for sealing electronic parts.

Abstract translation: 通过在酸催化剂的存在下，使萘酚和苯酚与醛反应得到初级反应混合物，得到具有低软化点和良好流动性的萘酚改性酚醛树脂，得到初级反应混合物 初级反应混合物在强酸，超酸或其混合物存在下，在环境压力下在120-180℃下反应1至12小时，得到第二反应混合物，并将第二反应混合物进行真空浓缩或 蒸汽蒸馏，萘酚改性酚醛树脂适合用作密封电子部件的环氧树脂成型材料中的固化剂。

公开(公告)号：US5459223A

公开(公告)日：1995-10-17

申请号：US193468

申请日：1994-02-08

Applicant: Haruaki Sue ,  Shinsuke Hagiwara ,  Hiroyuki Saitoh

Inventor： Haruaki Sue ,  Shinsuke Hagiwara ,  Hiroyuki Saitoh

IPC: C08G8/04 ,  C08G8/28 ,  C08L61/06 ,  C08L63/00 ,  H01B3/36 ,  H01B3/40 ,  H01L23/29 ,  C08G14/04

CPC classification number: H01L23/293 ,  C08G8/04 ,  C08G8/28 ,  C08L61/06 ,  C08L63/00 ,  H01B3/36 ,  H01B3/40 ,  H01L2924/0002

Abstract: A naphthol-modified phenolic resin having low softening point and good flowability is obtained by allowing a naphthol and a phenol to react with an aldehyde in the presence of an acid catalyst at 60.degree. to 110.degree. C. to obtain a primary reaction mixture, heating the primary reaction mixture in the presence of a strong acid, a super acid or a mixture thereof under ambient pressure at 120.degree. to 180.degree. C. for 1 to 12 hours to obtain a secondary reaction mixture, and subjecting the secondary reaction mixture to vacuum concentration or steam distillation, and the naphthol-modified phenolic resin is suited to use as a curing agent in epoxy resin molding materials for sealing electronic parts.

Abstract translation: 通过使萘酚和苯酚在酸催化剂的存在下在60℃〜110℃下与醛反应得到软化点低，流动性好的萘酚改性酚醛树脂，得到初级反应混合物，加热 初级反应混合物在强酸，超酸或其混合物存在下，在环境压力为120-180℃下反应1至12小时，得到第二反应混合物，并将第二反应混合物真空 浓缩或蒸汽蒸馏，萘酚改性酚醛树脂适合用作密封电子部件的环氧树脂成型材料中的固化剂。

公开(公告)号：US06329492B1

公开(公告)日：2001-12-11

申请号：US09319487

申请日：1999-08-13

Applicant: Haruaki Sue ,  Shinsuke Hagiwara ,  Fumio Furusawa ,  Seiichi Akagi ,  Akihiro Kobayashi ,  Hideki Yokoyama

Inventor： Haruaki Sue ,  Shinsuke Hagiwara ,  Fumio Furusawa ,  Seiichi Akagi ,  Akihiro Kobayashi ,  Hideki Yokoyama

IPC: C08G5906

CPC classification number: C08G59/3218 ,  C07C39/17 ,  C07C2601/08 ,  C08G59/24 ,  C08L63/00 ,  H01L23/293 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/00014 ,  H01L2924/00

Abstract: This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorptive, high adhesion and rich fluidity, which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.

Abstract translation: 本发明提供一种适合作为电子器件的封装材料的化合物，其具有高Tg，低吸水性，高粘附性和较高的流动性，其为由式（I）表示的环戊烯化合物及其由式（I）表示的中间体环戊烯基化合物 III）。 在该式中，m为0以上，Ar 1和Ar 2分别为酚残基，萘酚残基或芴衍生物残基，各自含有羟基或缩水甘油氧基。

公开(公告)号：US5206333A

公开(公告)日：1993-04-27

申请号：US879363

申请日：1992-05-07

Applicant: Haruaki Sue ,  Ken Nanaumi ,  Takuji Itou ,  Ken Madarame ,  Shinsuke Hagiwara

Inventor： Haruaki Sue ,  Ken Nanaumi ,  Takuji Itou ,  Ken Madarame ,  Shinsuke Hagiwara

IPC: C08G8/08

CPC classification number: C08G8/08

Abstract: A copolycondensation of a phenol, a naphthol and formaldehyde proceeds smoothly in the presence of an acid and a metallic element selected from the group consisting of transition metallic elements and metallic elements of Group IIa, Group IIIa, Group IVa, Group Va and Group VIa of the Periodic Table, and a naphthol-modified phenolic resin which has a large molecular weight and does not gel is obtained.

公开(公告)号：US08642714B2

公开(公告)日：2014-02-04

申请号：US12162277

申请日：2007-01-24

Applicant: Haruaki Sue ,  Kuniaki Satou ,  Osamu Matsuzaka

Inventor： Haruaki Sue ,  Kuniaki Satou ,  Osamu Matsuzaka

IPC: C08G8/04

CPC classification number: C08G8/28 ,  C08G59/08

Abstract: The present invention provides a phenol resin having, as a unit in its main-chain skeleton, a structure represented by the following general formula (I), as well as a resin composition using the same. According to the phenol resin of the invention, epoxylation thereof, chemical modification thereof, reaction thereof with an epoxy resin, and the like are facilitated. Phenol resins ranging from low-molecular-weight resins rich in fluidity to high-melting resins can be synthesized, and these phenol resins are industrially useful. When the phenol resin of the present invention is used as a hardening agent for epoxy resin etc., its resin composition can give a cured product of high Tg without deteriorating adhesiveness.

Abstract translation: 本发明提供一种在其主链骨架中作为单元具有由以下通式（I）表示的结构的酚醛树脂以及使用其的树脂组合物。 根据本发明的酚醛树脂，其环氧化，化学改性，与环氧树脂的反应等有利。 可以合成苯酚树脂，从低流动性的低分子量树脂到高熔点树脂，这些酚醛树脂在工业上是有用的。 当本发明的酚醛树脂用作环氧树脂等的硬化剂时，其树脂组合物可以得到Tg高的固化产物，而不会降低粘附性。

公开(公告)号：US07491789B2

公开(公告)日：2009-02-17

申请号：US11779181

申请日：2007-07-17

Applicant: Haruaki Sue ,  Takashi Kumaki ,  Hideyasu Tsuiki ,  Hiroshi Matsutani ,  Toshihiko Takasaki ,  Iwao Fukuchi

Inventor： Haruaki Sue ,  Takashi Kumaki ,  Hideyasu Tsuiki ,  Hiroshi Matsutani ,  Toshihiko Takasaki ,  Iwao Fukuchi

IPC: C07C321/16 ,  C08G75/14 ,  C08L63/00

CPC classification number: C07C323/29 ,  C07C323/16 ,  C07C323/20 ,  C07C323/56 ,  C07C323/66 ,  C08G59/06

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—  (1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract translation: 本发明公开了一种含硫酚醛树脂，其含有下述式（1）表示的有机基团：<？在线式说明=“在线式”末端=“铅”→R1-S -R2-S-R1-（1）<？in-line-formula description =“In-line Formulas”end =“tail”？>其中R1表示碳原子数2〜6的烃基，R2表示烃基 具有1至10个碳原子，酚碳和酚碳之间，由下式（5）表示的苯酚衍生物：其中R5表示C2-3亚烷基，R6表示C1-10亚烷基，G表示H， C1-10烷基等，以及含有（A）上述式（5）的固化剂和（B）环氧树脂作为必要成分的环氧树脂组合物。

公开(公告)号：US20090171061A1

公开(公告)日：2009-07-02

申请号：US12162277

申请日：2007-01-24

Applicant: Haruaki Sue ,  Kuniaki Satou ,  Osamu Matsuzaka

Inventor： Haruaki Sue ,  Kuniaki Satou ,  Osamu Matsuzaka

IPC: C08G14/04 ,  C08G65/38

CPC classification number: C08G8/28 ,  C08G59/08

Abstract: The present invention provides a phenol resin having, as a unit in its main-chain skeleton, a structure represented by the following general formula (I), as well as a resin composition using the same. According to the phenol resin of the invention, epoxylation thereof, chemical modification thereof, reaction thereof with an epoxy resin, and the like are facilitated. Phenol resins ranging from low-molecular-weight resins rich in fluidity to high-melting resins can be synthesized, and these phenol resins are industrially useful. When the phenol resin of the present invention is used as a hardening agent for epoxy resin etc., its resin composition can give a cured product of high Tg without deteriorating adhesiveness.

Abstract translation: 本发明提供一种在其主链骨架中作为单元具有由以下通式（I）表示的结构的酚醛树脂以及使用其的树脂组合物。 根据本发明的酚醛树脂，其环氧化，化学改性，与环氧树脂的反应等有利。 可以合成苯酚树脂，从低流动性的低分子量树脂到高熔点树脂，这些酚醛树脂在工业上是有用的。 当本发明的酚醛树脂用作环氧树脂等的硬化剂时，其树脂组合物可以得到Tg高的固化产物，而不会降低粘附性。