Invention Grant
US06207789B1 Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
失效
酚醛树脂，树脂组合物，用于封装的成型材料和电子部件装置
- Patent Title: Phenolic resin, resin composition, molding material for encapsulation, and electronic component device
- Patent Title (中): 酚醛树脂，树脂组合物，用于封装的成型材料和电子部件装置
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Application No.: US09445275Application Date: 2000-02-23
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Publication No.: US06207789B1Publication Date: 2001-03-27
- Inventor: Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Kazuyoshi Tendo
- Applicant: Haruaki Sue , Shinsuke Hagiwara , Fumio Furusawa , Seiichi Akagi , Kazuyoshi Tendo
- Priority: JP9-145077 19970603; JP9-331587 19971202; JP10-013943 19980127
- Main IPC: C08G1404
- IPC: C08G1404
Abstract:
The present invention provides a resin containing in the backbone chain a structural unit represented by the following Formula (I) or (II), as a novel phenolic resin having a high Tg, a low moisture absorption, a low molding shrinkage, high adhesive properties and high flow properties. The present invention also provides a resin composition and a molding material each containing the above resin, and an electronic component device having a device element encapsulated with it.
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