Invention Grant
- Patent Title: Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesive
- Patent Title (中): 含硫酚醛树脂,其制备方法,具有硫醚结构或二硫键结构的苯酚衍生物,其制备方法和环氧树脂组合物和粘合剂
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Application No.: US10514501Application Date: 2002-10-11
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Publication No.: US07504471B2Publication Date: 2009-03-17
- Inventor: Haruaki Sue , Takashi Kumaki , Hideyasu Tsuiki , Hiroshi Matsutani , Toshihiko Takasaki , Iwao Fukuchi
- Applicant: Haruaki Sue , Takashi Kumaki , Hideyasu Tsuiki , Hiroshi Matsutani , Toshihiko Takasaki , Iwao Fukuchi
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee: Hitachi Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Priority: JP2002-137594 20020513
- International Application: PCT/JP02/10600 WO 20021011
- International Announcement: WO03/095526 WO 20031120
- Main IPC: C08G8/28
- IPC: C08G8/28 ; C08L63/00 ; C08L63/04

Abstract:
The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1— (1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.
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