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    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
    1.
    发明申请
    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF 审中-公开

    公开(公告)号：US20080106281A1

    公开(公告)日：2008-05-08

    申请号：US11929754

    申请日：2007-10-30

    Applicant: Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

    Inventor： Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

    IPC: G01R31/26

    CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

    Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
    2.
    发明申请
    HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF 审中-公开

    公开(公告)号：US20080100318A1

    公开(公告)日：2008-05-01

    申请号：US11929783

    申请日：2007-10-30

    Applicant: Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

    Inventor： Brian Beaman ,  Keith Fogel ,  Paul Lauro ,  Maurice Norcott ,  Da-Yuan Shih ,  George Walker

    IPC: G01R31/26

    CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

    Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

    High throughput assay of lp-pla2 activity
    3.
    发明申请
    High throughput assay of lp-pla2 activity 有权
    lp-pla2活性的高通量测定

    公开(公告)号：US20070065892A1

    公开(公告)日：2007-03-22

    申请号：US10557540

    申请日：2004-05-27

    Applicant: Yun-Fu Hu ,  George Walker

    Inventor： Yun-Fu Hu ,  George Walker

    IPC: C12Q1/48

    CPC classification number: G01N33/573 ,  C12N9/20 ,  C12Q1/44 ,  G01N2333/918

    Abstract: This invention relates to a method for determining the activity of Lp-PLA2 in a plurality of samples from animals. The invention also relates to a kit for determining Lp-PLA2 activity in a plurality of samples.

    Abstract translation: 本发明涉及一种用于确定来自动物的多个样品中Lp-PLA2的活性的方法。 本发明还涉及用于确定多个样品中的Lp-PLA2活性的试剂盒。

    High-density ion transport measurement biochip devices and methods
    5.
    发明申请
    High-density ion transport measurement biochip devices and methods 审中-公开
    高密度离子传输测量生物芯片器件及方法

    公开(公告)号：US20050196746A1

    公开(公告)日：2005-09-08

    申请号：US11033015

    申请日：2005-01-10

    Applicant: Jia Xu ,  Antonio Guia ,  George Walker ,  Mingxian Huang ,  Lei Wu ,  Sithiphong Khachonesin ,  Julian Yuan

    Inventor： Jia Xu ,  Antonio Guia ,  George Walker ,  Mingxian Huang ,  Lei Wu ,  Sithiphong Khachonesin ,  Julian Yuan

    IPC: C12Q1/00 ,  G01N33/487

    CPC classification number: G01N33/48728

    Abstract: The present invention provides novel biochips, biochip-based devices, and device configurations that can be used for ion transport measurement. The chips, devices, and designs of the present invention are particularly suited to high-throughput assays such as compound screening assays using patch clamping techniques. The invention includes high-density biochips made by novel methods and methods of making high density biochips, and also provides novel upper chamber configurations and fluidics designs for upper chambers of ion transport measurement devices that can be used in high throughput patch clamp assays. The present invention also includes methods of using ion transport measuring chips and devices of the present invention.

    Abstract translation: 本发明提供了可用于离子传输测量的新型生物芯片，基于生物芯片的器件和器件配置。 本发明的芯片，器件和设计特别适用于高通量测定，例如使用贴片钳技术的复合筛选测定法。 本发明包括通过制备高密度生物芯片的新方法和方法制备的高密度生物芯片，并且还提供了可用于高通量膜片钳测定的离子传输测量装置的上腔室的新型上室构型和流体学设计。 本发明还包括使用本发明的离子传输测量芯片和器件的方法。

    Electronic pressure scanner
    7.
    发明授权
    Electronic pressure scanner 失效
    电子压力扫描仪

    公开(公告)号：US4753105A

    公开(公告)日：1988-06-28

    申请号：US5747

    申请日：1987-01-22

    Applicant: Douglas B. Juanarena ,  Timothy W. Worst ,  George Walker

    Inventor： Douglas B. Juanarena ,  Timothy W. Worst ,  George Walker

    IPC: G01L9/04 ,  G01L19/00 ,  G01L27/00

    CPC classification number: G01L27/002 ,  G01L19/0015 ,  G01L9/045

    Abstract: A rugged electronic pressure scanner which is capable of withstanding extreme environmental conditions is provided with a transducer per port configuration. Internal multiplexing, amplification and integral calibration valve permit on-line calibrations. The construction of a plurality of individual transducer modules each containing its own electronics permits field replacement of individual pressure transducer modules in the event of destruction or inoperativeness.

    Abstract translation: 一个坚固耐用的电子压力扫描仪能够承受极端的环境条件，每端口配置有一个换能器。 内部多路复用，放大和积分校准阀允许在线校准。 每个包含其自己的电子设备的多个单独的换能器模块的结构允许在破坏或不操作的情况下对各个压力传感器模块进行现场更换。

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