公开(公告)号：US08198737B2

公开(公告)日：2012-06-12

申请号：US12510274

申请日：2009-07-28

申请人： Changliang Zhang ,  Yingwei Jiang ,  Zhijie Wang ,  Wei Xiao

发明人： Changliang Zhang ,  Yingwei Jiang ,  Zhijie Wang ,  Wei Xiao

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48482 ,  H01L2224/48489 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49175 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2224/78 ,  H01L2924/00

摘要： A method of forming a wire bond in a semiconductor device includes forming a first bump of a first composition proximate to a probe mark on a bond pad. A second bump of the first composition is formed adjacent to the first bump such that the first and second bumps are formed away from the probe mark. A wire of a second composition that is harder than the first composition is attached on top of the first and second bumps to form an interconnection.

摘要翻译： 在半导体器件中形成引线接合的方法包括在接合焊盘上形成靠近探针标记的第一组合物的第一凸点。 第一组合物的第二凸起形成为与第一凸起相邻，使得第一和第二凸块形成为远离探针标记。 比第一组合物硬的第二组合物的导线附接在第一和第二凸块的顶部上以形成互连。

公开(公告)号：US20100314754A1

公开(公告)日：2010-12-16

申请号：US12510274

申请日：2009-07-28

申请人： Changliang ZHANG ,  Yingwei Jiang ,  Zhijie Wang ,  Wei Xiao

发明人： Changliang ZHANG ,  Yingwei Jiang ,  Zhijie Wang ,  Wei Xiao

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48482 ,  H01L2224/48489 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/49175 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2224/78 ,  H01L2924/00

摘要： A method of forming a wire bond in a semiconductor device includes forming a first bump of a first composition proximate to a probe mark on a bond pad. A second bump of the first composition is formed adjacent to the first bump such that the first and second bumps are formed away from the probe mark. A wire of a second composition that is harder than the first composition is attached on top of the first and second bumps to form an interconnection.

摘要翻译： 在半导体器件中形成引线接合的方法包括在接合焊盘上形成靠近探针标记的第一组合物的第一凸点。 第一组合物的第二凸起形成为与第一凸起相邻，使得第一和第二凸块形成为远离探针标记。 比第一组合物硬的第二组合物的导线附接在第一和第二凸块的顶部上以形成互连。

公开(公告)号：US20120082976A1

公开(公告)日：2012-04-05

申请号：US13264391

申请日：2010-04-15

申请人： Susumu Seino ,  Changliang Zhang ,  Megumi Kato ,  Tadao Shibazaki

发明人： Susumu Seino ,  Changliang Zhang ,  Megumi Kato ,  Tadao Shibazaki

IPC分类号： C12Q1/68 ,  C07K19/00 ,  C12N15/85 ,  C12N5/10 ,  C12N15/62 ,  C12N15/63

CPC分类号： C07K14/4702 ,  G01N33/5308 ,  G01N33/542 ,  G01N2333/62 ,  G01N2500/10

摘要： Disclosed are a novel method of screening for insulin secretion-potentiating agents as well as means for performing such screening. The means include a DNA encoding fluorescent-labeled Epac2 comprising two different DNAs encoding two different fluorescent proteins which emit fluorescent light with wavelength differing from each other and a DNA encoding Epac2 which are fused together in-frame, and the cells transformed with the DNA. Also disclosed is a method of screening insulin secretion-potentiating agents comprising bringing a candidate compound into contact with cells transformed with the said DNA, and detecting whether the compound binds to Epac2.

摘要翻译： 公开了一种筛选胰岛素分泌增强剂的新方法以及进行这种筛选的方法。 该方法包括编码荧光标记的Epac2的DNA，其包含两种不同的DNA，其编码两种不同的荧光蛋白，其发射彼此波长不同的荧光，以及编码融合在一起的Epac2的DNA，以及用DNA转化的细胞。 还公开了筛选胰岛素分泌增强剂的方法，包括使候选化合物与用所述DNA转化的细胞接触，并检测该化合物是否结合Epac2。