摘要:
An optical component is formed on a silicon on insulator (SOI) substrate and has an array waveguide that demultiplexes an input light signal into N channels and provides that light signal to a corresponding set of N waveguide structures formed on a surface of the SOI substrate. The N waveguide structures provide the N channels of light to N optical detectors. Each optical detector is bonded to a surface of a corresponding one of the waveguide structures. The N channels of light pass through the N waveguide structures and are coupled into the N optical detectors so that light from a corresponding channel of the array waveguide is coupled into a corresponding optical detector and converted into an electrical signal.
摘要:
Methods and apparati for spatially encoding and decoding spread spectrum communication signals using broad band light sources are disclosed. The encoding algorithms involve the use of orthogonal spatial wavelets, which are preferably discrete attenuation functions of light from different sources so that the discrete attenuation function is imposed upon the spectrum of the light source. The function may be used either merely for providing an encoded channel or by providing a second mask that may be, for example, the complement of the discrete attenuation function so that the light beam is discrete with the first attenuation function.
摘要:
A nanophotolithography mask includes a layer of an electrically conductive optically opaque material deposited on a mask substrate in which regular arrays of sub-wavelength apertures are formed. The plasmonic excitation in the layer perforated with the sub-wavelength apertures arrays under the light incident on the mask produces high resolution far-field radiation patterns of sufficient intensity to expose a photoresist on a wafer when propagated to the same. The fill-factor of the mask, i.e., the ratio of the total apertures area to the total mask area, may lead to a significant increase in mask manufacturing throughput by FIB or electron beam “writing”. The mask demonstrates the defect resiliency and ability to imprint coherent clear features of nano dimensions and shapes on the wafers for integrated circuits design.
摘要:
The subject matter disclosed herein relates to formation of silicon germanium devices with tensile strain. Tensile strain applied to a silicon germanium device in fabrication may improve performance of a silicon germanium laser or light detector.
摘要:
A stepper system for ultra-high resolution nano-lithography employs a photolithographic mask which includes a layer of an electrically conductive optically opaque material in which periodic arrays of sub-wavelength apertures are formed. The plasmonic excitation in the photolithographic mask exposed to the light of the wavelength in the range of 197 nm-248 nm, produces high resolution far-field radiation patterns of sufficient intensity to expose a photoresist on a wafer. The stepper system demonstrates the resiliency to the mask defects and ability to imprint coherent clear features of nano dimensions (45 nm-500 nm) and various shapes on the wafers for integrated circuits design. The stepper system may be adjusted to image the plane of the highest plasmonic field exiting the mask.
摘要:
A nanophotolithography mask includes a layer of an electrically conductive optically opaque material deposited on a mask substrate in which regular arrays of sub-wavelength apertures are formed. The plasmonic excitation in the layer perforated with the sub-wavelength apertures arrays under the light incident on the mask produces high resolution far-field radiation patterns of sufficient intensity to expose a photoresist on a wafer when propagated to the same. The fill-factor of the mask, i.e., the ratio of the total apertures area to the total mask area, may lead to a significant increase in mask manufacturing throughput by FIB or electron beam “writing”. The mask demonstrates the defect resiliency and ability to imprint coherent clear features of nano dimensions and shapes on the wafers for integrated circuits design.
摘要:
An optical interconnect architecture provides three dimensional optical interconnects, with the optical interconnects provided along a plane such as a wafer or a substrate. One or more integrated circuits is provided on a second “electronic” plane that is spaced from the optical interconnect plane. Signals from the circuit on the electronic plane are coupled to the optical interconnect plane using various strategies, including metal or optical interlayer interconnects extending perpendicular to the optical plane. Once on the optical interconnect plane, the signals from the circuits on the electronic plane are propagated optically.
摘要:
An optical fiber communications system using spread spectrum code division multiple access techniques to achieve better bandwidth utilization. A transmitting user in the system encodes the optical signal using a first coding mask, and a receiving user decodes the received signal using two decoding masks, all of the masks having lengths N. The first mask is divided into two sections of lengths N/2 each, one of the sections defining a first sub-code of length N/2, while the other section blocks light. Each of the second and third masks is also divided into two sections, which correspond to the two sections of the first mask. The section of the second mask corresponding to the coded section of the first mask has a second code that is identical to the first code, and the section of the second mask corresponding to the blocked section of the first mask is also blocked. The section of the third mask corresponding to coded section of the first mask has a third code that is complementary to the first code, and the section of the third mask corresponding to the blocked section of the first mask is also blocked. Some users on the system have masks in which the first of the two sections are blocked and the second of the two sections are coded, while other users have masks in which the second of the two sections are blocked and the first of the two sections are coded. The first codes used to code the encoding masks are selected from a set of unipolar codes that are derived from a set of balanced bipolar orthogonal codes.
摘要:
The subject matter disclosed herein relates to formation of silicon germanium devices with tensile strain. Tensile strain applied to a silicon germanium device in fabrication may improve performance of a silicon germanium laser or light detector.
摘要:
A stepper system for ultra-high resolution nano-lithography employs a photolithographic mask which includes a layer of an electrically conductive optically opaque material in which periodic arrays of sub-wavelength apertures are formed. The plasmonic excitation in the photolithographic mask exposed to the light of the wavelength in the range of 197 nm-248 nm, produces high resolution far-field radiation patterns of sufficient intensity to expose a photoresist on a wafer. The stepper system demonstrates the resiliency to the mask defects and ability to imprint coherent clear features of nano dimensions (45 nm-500 nm) and various shapes on the wafers for integrated circuits design. The stepper system may be adjusted to image the plane of the highest plasmonic field exiting the mask.