公开(公告)号：US09031266B2

公开(公告)日：2015-05-12

申请号：US13270613

申请日：2011-10-11

Applicant: Alfons Dehe ,  Mohsin Nawaz ,  Christoph Glacer

Inventor： Alfons Dehe ,  Mohsin Nawaz ,  Christoph Glacer

IPC: H04R25/00 ,  H04R3/00 ,  H04R1/00 ,  H04R9/06 ,  H04R11/02 ,  H04R19/02 ,  H04R19/01 ,  H04R7/04

CPC classification number: H04R19/02 ,  H04R7/04 ,  H04R19/013 ,  H04R2201/003 ,  Y10T29/49005

Abstract: An electrostatic loudspeaker comprises a membrane structure and an electrode structure. The membrane structure comprises a central membrane portion and a circumferential membrane portion. The electrode structure is configured to electrostatically interact with the membrane structure for causing a movement of the membrane structure along an axis of movement. The electrode structure comprises a circumferential electrode portion and an opening, the circumferential electrode portion being substantially aligned to the circumferential membrane portion and the opening being substantially aligned to the central membrane portion with respect to a direction parallel to the axis of movement. In an end position of the movement of the membrane structure, the central membrane portion is configured to extend at least partially through the opening. A method for operating an electrostatic loudspeaker and a method for manufacturing an electrostatic loudspeaker are also described.

Abstract translation: 静电扬声器包括膜结构和电极结构。 膜结构包括中央膜部分和周向膜部分。 电极结构被配置为与膜结构静电相互作用以引起膜结构沿着运动轴线的移动。 电极结构包括周向电极部分和开口，周向电极部分基本上对齐于周向膜部分，并且开口基本上与中心膜部分相对于平行于运动轴线的方向对准。 在膜结构的运动的结束位置中，中心膜部分构造成至少部分延伸穿过开口。 还描述了用于操作静电扬声器的方法和用于制造静电扬声器的方法。

公开(公告)号：US20130221453A1

公开(公告)日：2013-08-29

申请号：US13408928

申请日：2012-02-29

Applicant: Alfons Dehe ,  Martin Wurzer ,  Christian Herzum ,  Wolfgang Klein ,  Stefan Barzen

Inventor： Alfons Dehe ,  Martin Wurzer ,  Christian Herzum ,  Wolfgang Klein ,  Stefan Barzen

IPC: H01L29/84

CPC classification number: B81B3/0086 ,  B81B2201/0257 ,  H04R1/04 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006

Abstract: A tunable MEMS device and a method of manufacturing a tunable MEMS device are disclosed. In accordance with an embodiment of the present invention, a semiconductor device comprises a substrate, a moveable electrode and a counter electrode. The moveable electrode or the counter electrode comprises a first region and a second region, wherein the first region is isolated from the second region, wherein the first region is configured to be tuned, wherein the second region is configured to provide a sensing signal or control a system, and wherein the moveable electrode and the counter electrode are mechanically connected to the substrate.

Abstract translation: 公开了一种可调谐MEMS器件和制造可调谐MEMS器件的方法。 根据本发明的实施例，半导体器件包括衬底，可移动电极和对电极。 可移动电极或对电极包括第一区域和第二区域，其中第一区域与第二区域隔离，其中第一区域被配置为被调谐，其中第二区域被配置为提供感测信号或控制 系统，并且其中可移动电极和对电极机械地连接到基板。

公开(公告)号：US20110127623A1

公开(公告)日：2011-06-02

申请号：US12627833

申请日：2009-11-30

Applicant: Marc Fueldner ,  Martin Wurzer ,  Alfons Dehe

Inventor： Marc Fueldner ,  Martin Wurzer ,  Alfons Dehe

IPC: H01L29/84 ,  H01L21/50

CPC classification number: H04R31/00 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/1461 ,  H04R19/005 ,  H04R19/04 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for producing a microphone module includes arranging a MEMS microphone structure on a first surface of a first substrate, the first substrate further including a second surface, which is opposite to the first surface. Furthermore, a cap is arranging on the first surface of the first substrate such that the cap and the first surface enclose the MEMS microphone structure. A readout device for the MEMS microphone structure is arranged on a first surface of a second substrate which further includes a second surface, which is opposite to the first surface. The second surface of the first substrate is attached to the second surface of the second substrate.

Abstract translation: 麦克风模块的制造方法包括在第一基板的第一表面上配置MEMS麦克风结构，第一基板还包括与第一表面相对的第二表面。 此外，盖子布置在第一基板的第一表面上，使得盖和第一表面包围MEMS麦克风结构。 用于MEMS麦克风结构的读出装置设置在第二基板的第一表面上，该第二表面还包括与第一表面相对的第二表面。 第一基板的第二表面附接到第二基板的第二表面。

公开(公告)号：US20080104825A1

公开(公告)日：2008-05-08

申请号：US11634810

申请日：2006-12-06

Applicant: Alfons Dehe ,  Stefan Barzen ,  Marc Fueldner

Inventor： Alfons Dehe ,  Stefan Barzen ,  Marc Fueldner

IPC: H04R31/00

CPC classification number: H04R19/04 ,  H04R7/00 ,  H04R19/005 ,  H04R31/00 ,  H04R31/003 ,  H04R31/006 ,  Y10T29/49005

Abstract: For manufacturing a sound transducer structure, membrane support material is applied on a first main surface of a membrane carrier material and membrane material is applied in a sound transducing region and an edge region on a surface of the membrane support material. In addition, counter electrode support material is applied on a surface of the membrane material and recesses are formed in the sound transducing region of the membrane material. Counter electrode material is applied to the counter electrode support material and membrane carrier material and membrane support material are removed in the sound transducing region to the membrane material.

Abstract translation: 为了制造声换能器结构，膜支撑材料被施加在膜载体材料的第一主表面上，并且膜材料被施加在膜支撑材料的表面的声音传导区域和边缘区域中。 此外，在膜材料的表面上施加反电极支撑材料，并且在膜材料的声音传导区域中形成凹部。 将反电极材料施加到对电极支撑材料上，并且将膜载体材料和膜支撑材料在声音传导区域中移除到膜材料。

公开(公告)号：US07253016B2

公开(公告)日：2007-08-07

申请号：US10991350

申请日：2004-11-15

Applicant: Stefan Barzen ,  Alfons Dehe ,  Marc Füldner

Inventor： Stefan Barzen ,  Alfons Dehe ,  Marc Füldner

IPC: H01L21/00 ,  H01L29/82

CPC classification number: H04R19/005 ,  Y10T29/43

Abstract: A micromechanical capacitive converter and a method for manufacturing a micromechanical converter comprise a movable membrane and an electrically conductive face element in a carrier layer. The electrically conductive face element is arranged opposite the membrane above a cavity. The electrically conductive face element and the carrier layer are perforated by perforation openings. The opening width of the perforation openings corresponds approximately to the thickness of the carrier layer.

Abstract translation: 微机电容转换器和微机电转换器的制造方法包括载体层中的可动膜和导电面元件。 导电面元件布置成与空腔上方的膜相对。 导电面元件和载体层被穿孔开孔。 穿孔的开口宽度大致对应于载体层的厚度。

公开(公告)号：US20050207605A1

公开(公告)日：2005-09-22

申请号：US11075039

申请日：2005-03-08

Applicant: Alfons Dehe ,  Marc Fueldner

Inventor： Alfons Dehe ,  Marc Fueldner

IPC: H04R1/34 ,  H04R19/01 ,  H04R19/04 ,  H04R25/00 ,  H04R31/00

CPC classification number: H04R19/04 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A microphone has a substrate including an acoustically transparent substrate region, a lid with an acoustically transparent lid region, and a membrane which is held by a membrane carrier between the lid and the substrate. The acoustically transparent substrate region or the acoustically transparent lid region is provided with at least one impedance hole sized so that an acoustic impedance of the impedance hole is larger than an acoustic impedance of the acoustically transparent region of the respective other region of substrate region and lid region.

Abstract translation: 麦克风具有包括声透明基板区域的基板，具有声透明盖区域的盖子，以及由盖板和基板之间的膜载体保持的膜。 声透明基板区域或声透明盖区域设置有至少一个阻抗孔，阻抗孔的尺寸使得阻抗孔的声阻抗大于基板区域和盖子的各个其它区域的声透明区域的声阻抗 地区。

公开(公告)号：US09711392B2

公开(公告)日：2017-07-18

申请号：US13558265

申请日：2012-07-25

Applicant: Alfons Dehe ,  Damian Sojka ,  Andre Schmenn ,  Carsten Ahrens

Inventor： Alfons Dehe ,  Damian Sojka ,  Andre Schmenn ,  Carsten Ahrens

IPC: H01L21/762 ,  H01L23/60 ,  H01L21/764 ,  H01L27/02 ,  H01L23/00 ,  H02H9/04

CPC classification number: H01L21/76289 ,  H01L21/764 ,  H01L23/60 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L27/0288 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H02H9/046 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In one embodiment of the present invention, an electronic device includes a first emitter/collector region and a second emitter/collector region disposed in a substrate. The first emitter/collector region has a first edge/tip, and the second emitter/collector region has a second edge/tip. A gap separates the first edge/tip from the second edge/tip. The first emitter/collector region, the second emitter/collector region, and the gap form a field emission device.

公开(公告)号：US09284184B2

公开(公告)日：2016-03-15

申请号：US13439729

申请日：2012-04-04

Applicant: Alfons Dehe ,  Martin Wurzer ,  Christian Herzum

Inventor： Alfons Dehe ,  Martin Wurzer ,  Christian Herzum

IPC: H04R19/04 ,  B81B3/00 ,  H04R19/00 ,  H04R7/06

Abstract: A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.

公开(公告)号：US20130264663A1

公开(公告)日：2013-10-10

申请号：US13439729

申请日：2012-04-04

Applicant: Alfons Dehe ,  Martin Wurzer ,  Christian Herzum

Inventor： Alfons Dehe ,  Martin Wurzer ,  Christian Herzum

IPC: H01L29/84 ,  H01L21/02

CPC classification number: B81B3/007 ,  B81B3/0018 ,  B81B3/0035 ,  B81B3/0051 ,  B81B2201/0257 ,  B81C1/00158 ,  H04R7/06 ,  H04R19/005 ,  H04R19/04

Abstract: A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.

Abstract translation: 公开了MEMS器件和制造MEMS器件的方法。 在一个实施例中，半导体器件包括衬底，可移动电极和对电极，其中可移动电极和对电极机械连接到衬底。 可移动电极构造成加强可移动膜的内部区域。

公开(公告)号：US20130015467A1

公开(公告)日：2013-01-17

申请号：US13183272

申请日：2011-07-14

Applicant: Ulrich Krumbein ,  Gerhard Lohninger ,  Alfons Dehe

Inventor： Ulrich Krumbein ,  Gerhard Lohninger ,  Alfons Dehe

IPC: H01L29/16 ,  H01L29/772 ,  H01L23/48

CPC classification number: H01L25/16 ,  H01L23/10 ,  H01L23/4926 ,  H01L23/66 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In an embodiment, a semiconductor device includes a semiconductor substrate. The semiconductor substrate has a first cavity disposed through it, and conductive material covers at least the bottom portion of the first cavity. An integrated circuit is disposed on the top surface of the conductive material. The device further includes a cap disposed on the top surface of the substrate, such that a cavity disposed on a surface of the cap overlies the first cavity in the substrate.

Abstract translation: 在一个实施例中，半导体器件包括半导体衬底。 半导体衬底具有通过其设置的第一腔，并且导电材料至少覆盖第一空腔的底部。 集成电路设置在导电材料的顶表面上。 该装置还包括设置在基板的顶表面上的盖，使得设置在盖的表面上的空腔覆盖在基板中的第一空腔上。