公开(公告)号：US09240527B2

公开(公告)日：2016-01-19

申请号：US14479114

申请日：2014-09-05

申请人： Advanced Photonics, Inc.

发明人： Xueliang Song ,  Foo Cheong Yit ,  Katsumasa Horiguchi ,  Shurong Wang

IPC分类号： H01L33/48 ,  G02B6/42 ,  H01L33/54 ,  H01S5/022 ,  H01L31/0203 ,  H01L31/18 ,  H01L25/075 ,  H01L33/62

CPC分类号： H01L33/486 ,  G02B6/4201 ,  G02B6/4257 ,  G02B6/4274 ,  H01L25/0753 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2933/0033 ,  H01S5/02236 ,  H01S5/02248 ,  H01S5/02284 ,  Y10T156/1052 ,  Y10T156/1082 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In manufacturing a submount, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large to allow, for example, wire bonding using the side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).

摘要翻译： 在制造基座时，在副安装座基板（11）的表面上形成第一电极层（12）作为层。 所述第一电极层（12）的侧表面（122）形成在与所述副安装座基板（11）的侧表面（112）基本相同的平面上; 并且第一电极层（12）的侧表面（122）是用于产生与第一电极层（12）的电连接的连接表面。 通过使第一电极层（12）足够厚，可以使侧表面（122）的表面积足够大以允许例如使用侧表面（122）进行引线接合。 此外，诸如光学元件（14）的部件可以被密封材料（16）保护。

公开(公告)号：US20150050759A1

公开(公告)日：2015-02-19

申请号：US14479114

申请日：2014-09-05

申请人： Advanced Photonics, Inc.

发明人： Xueliang Song ,  Foo Cheong Yit ,  Katsumasa Horiguchi ,  Shurong Wang

IPC分类号： H01L33/48 ,  H01L31/18 ,  H01S5/022 ,  H01L31/0203

CPC分类号： H01L33/486 ,  G02B6/4201 ,  G02B6/4257 ,  G02B6/4274 ,  H01L25/0753 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2933/0033 ,  H01S5/02236 ,  H01S5/02248 ,  H01S5/02284 ,  Y10T156/1052 ,  Y10T156/1082 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In manufacturing a submount, a first electrode layer (12) is formed as a layer on the surface of a submount substrate (11); a side surface (122) of the first electrode layer (12) is formed on substantially the same plane as a side surface (112) of the submount substrate (11); and the side surface (122) of the first electrode layer (12) is a connection surface for creating an electrical connection with the first electrode layer (12). By making the first electrode layer (12) sufficiently thick, the surface area of the side surface (122) can be made sufficiently large to allow, for example, wire bonding using the side surface (122). Further, components such as an optical element (14) can be protected by a sealing material (16).

摘要翻译： 在制造基座时，在副安装座基板（11）的表面上形成第一电极层（12）作为层。 所述第一电极层（12）的侧表面（122）形成在与所述副安装座基板（11）的侧表面（112）基本相同的平面上; 并且第一电极层（12）的侧表面（122）是用于产生与第一电极层（12）的电连接的连接表面。 通过使第一电极层（12）足够厚，可以使侧表面（122）的表面积足够大以允许例如使用侧表面（122）进行引线接合。 此外，诸如光学元件（14）的部件可以被密封材料（16）保护。

公开(公告)号：US20150108636A1

公开(公告)日：2015-04-23

申请号：US14406964

申请日：2013-07-05

申请人： Advanced Photonics, Inc.

发明人： Xueliang Song ,  Nozomu Sato ,  Genta Kanno ,  Yohko Makino

IPC分类号： H01L23/00

CPC分类号： H01L24/17 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49805 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/03 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05669 ,  H01L2224/06155 ,  H01L2224/13144 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1714 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48496 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48669 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48766 ,  H01L2224/48769 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/48869 ,  H01L2224/48997 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/85395 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/85466 ,  H01L2224/8592 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/03 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/48455 ,  H01L2924/00012 ,  H01L2224/4554

摘要： The present invention provides a submount which includes a semiconductor element and which can be easily connected to an IC on a main substrate. The submount in one embodiment of the present invention includes: a substrate; electrodes; the semiconductor element; Au wires; and gold bumps. The electrodes, the semiconductor element, the Au wires, and the gold bumps are encapsulated on the substrate by a resin. The gold bumps are formed on the electrodes and the Au wires by ball bonding and are cut by dicing such that side surfaces of the gold bumps are exposed. The exposed surfaces function as side surface electrodes of the submount.

摘要翻译： 本发明提供了一种包括半导体元件并且可以容易地连接到主基板上的IC的基座。 本发明的一个实施例中的基座包括：基板; 电极 半导体元件; 金线; 和金块。 电极，半导体元件，Au线和金凸块通过树脂封装在基板上。 通过球接合在电极和Au线上形成金凸块，并通过切割来切割金凸块的侧表面。 暴露的表面用作副安装座的侧面电极。

公开(公告)号：US11688822B2

公开(公告)日：2023-06-27

申请号：US17765863

申请日：2020-09-29

申请人： ADVANCED PHOTONICS, INC.

发明人： Xueliang Song ,  Nozomu Sato

IPC分类号： H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L29/267 ,  G02B6/42 ,  H01S5/026 ,  H04B10/80

CPC分类号： H01L31/12 ,  G02B6/42 ,  H01S5/0262 ,  H04B10/802

摘要： A pair of optical components is used in an isolator that enables electric isolation. Each of the optical components includes: first lens portions arranged on different optical paths and transmitting light in a first direction; second lens portions arranged on different optical paths and transmitting light in the second direction orthogonal to the first direction; and a reflection portion reflecting, in the second direction, the light in the first direction transmitted through the first lens portion and guiding the light to the second lens portion, or reflecting, in the first direction, the light in the second direction transmitted through the second lens portion and guiding the light to the first lens portion The second lens portion included in one of the pair of optical components and the second lens portion included in the other optical component are spaced apart from each other and face each other.

公开(公告)号：US20220328712A1

公开(公告)日：2022-10-13

申请号：US17765863

申请日：2020-09-29

申请人： ADVANCED PHOTONICS, INC.

发明人： Xueliang SONG ,  Nozomu SATO

IPC分类号： H01L31/12 ,  H01S5/026 ,  G02B6/42 ,  H04B10/80

摘要： A pair of optical components is used in an isolator that enables electric isolation. Each of the optical components includes: first lens portions arranged on different optical paths and transmitting light in a first direction; second lens portions arranged on different optical paths and transmitting light in the second direction orthogonal to the first direction; and a reflection portion reflecting, in the second direction, the light in the first direction transmitted through the first lens portion and guiding the light to the second lens portion, or reflecting, in the first direction, the light in the second direction transmitted through the second lens portion and guiding the light to the first lens portion The second lens portion included in one of the pair of optical components and the second lens portion included in the other optical component are spaced apart from each other and face each other.

公开(公告)号：US09263411B2

公开(公告)日：2016-02-16

申请号：US14406964

申请日：2013-07-05

申请人： Advanced Photonics, Inc.

发明人： Xueliang Song ,  Nozomu Sato ,  Genta Kanno ,  Yohko Makino

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/03 ,  H01L25/065 ,  H01L23/13 ,  H01L23/498

CPC分类号： H01L24/17 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49805 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L25/03 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05669 ,  H01L2224/06155 ,  H01L2224/13144 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1714 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48496 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48669 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48766 ,  H01L2224/48769 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/48869 ,  H01L2224/48997 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/85395 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/85466 ,  H01L2224/8592 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/03 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/48455 ,  H01L2924/00012 ,  H01L2224/4554

摘要： The present invention provides a submount which includes a semiconductor element and which can be easily connected to an IC on a main substrate. The submount in one embodiment of the present invention includes: a substrate; electrodes; the semiconductor element; Au wires; and gold bumps. The electrodes, the semiconductor element, the Au wires, and the gold bumps, are encapsulated on the substrate by a resin. The gold bumps are formed on the electrodes and the Au wires by ball bonding and are cut by dicing such that side surfaces of the gold bumps are exposed. The exposed surfaces function as side surface electrodes of the submount.

摘要翻译： 本发明提供了一种包括半导体元件并且可以容易地连接到主基板上的IC的基座。 本发明的一个实施例中的基座包括：基板; 电极 半导体元件; 金线; 和金块。 电极，半导体元件，Au线和金凸块通过树脂封装在基板上。 通过球接合在电极和Au线上形成金凸块，并通过切割来切割金凸块的侧表面。 暴露的表面用作副安装座的侧面电极。