发明申请
US20150108636A1 SUBMOUNT, ENCAPSULATED SEMICONDUCTOR ELEMENT, AND METHODS OF MANUFACTURING THE SAME
有权
SUBMOUNT，封装的半导体元件及其制造方法
- 专利标题： SUBMOUNT, ENCAPSULATED SEMICONDUCTOR ELEMENT, AND METHODS OF MANUFACTURING THE SAME
- 专利标题（中）： SUBMOUNT，封装的半导体元件及其制造方法
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申请号： US14406964申请日： 2013-07-05
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公开(公告)号： US20150108636A1公开(公告)日： 2015-04-23
- 发明人: Xueliang Song , Nozomu Sato , Genta Kanno , Yohko Makino
- 申请人： Advanced Photonics, Inc.
- 优先权： JP2012-157541 20120713
- 国际申请： PCT/JP2013/004205 WO 20130705
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
The present invention provides a submount which includes a semiconductor element and which can be easily connected to an IC on a main substrate. The submount in one embodiment of the present invention includes: a substrate; electrodes; the semiconductor element; Au wires; and gold bumps. The electrodes, the semiconductor element, the Au wires, and the gold bumps are encapsulated on the substrate by a resin. The gold bumps are formed on the electrodes and the Au wires by ball bonding and are cut by dicing such that side surfaces of the gold bumps are exposed. The exposed surfaces function as side surface electrodes of the submount.
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