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公开(公告)号：US12126108B2
公开(公告)日：2024-10-22
申请号：US17634188
申请日：2020-08-19
申请人： AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Shinji Nozaki
IPC分类号： H01R13/424 , H01R13/453 , H01R13/631
CPC分类号： H01R13/424 , H01R13/4538 , H01R13/631
摘要： It is aimed to realize a size reduction. A connector includes a first housing (10) and a second housing (20) connectable to each other. The second housing (20) is configured by assembling a first terminal holding member (21) and a second terminal holding member (32) to be relatively displaceable. The first housing (10) is provided with a restricting portion (16) for allowing a connecting operation of the first terminal holding member (21) and restricting a connecting operation of the second terminal holding member (32). The first terminal holding member (21) is provided with a restriction releasing portion (27) for releasing restriction by the restricting portion (16) in a state where the connecting operation of the first terminal holding member (21) is started.
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公开(公告)号：US12107360B2
公开(公告)日：2024-10-01
申请号：US17772005
申请日：2020-10-29
申请人： AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Yuya Tsukamoto
IPC分类号： H01R13/20 , H01R13/11 , H01R13/15 , H01R13/187
CPC分类号： H01R13/20 , H01R13/187 , H01R13/112 , H01R13/15
摘要： It is aimed to provide a terminal connection structure of a novel structure capable of advantageously preventing rotational displacements between two terminals without being accompanied by an increased spring force of a spring member. A terminal connection structure is provided with a first terminal 10 including a first connecting portion 32, a second terminal 12 including a second connecting portion 24, and a spring member 14 for sandwiching the first and second connecting portions 32, 24 in an overlapped state. At least one 44 of contact surfaces of the first and second connecting portions 32, 24 has a contact point portion 42 in the form of a curved surface bulging toward the other contact surface 30. The spring member 14 includes a pressing point 50 for pressing the first and second connecting portions 32, 24 in an overlapping direction at a position separated from the contact point portion 42.
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公开(公告)号：US12095205B2
公开(公告)日：2024-09-17
申请号：US17629613
申请日：2020-07-22
申请人： AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Hiroyoshi Maesoba , Toshifumi Ichio
IPC分类号： H01R13/6593 , H01R9/05 , H01R13/05 , H01R13/629 , H01R13/64 , H01R13/6583 , H01R13/428 , H01R13/506 , H01R13/6581 , H01R13/6591 , H01R13/6592
CPC分类号： H01R13/6593 , H01R9/05 , H01R13/05 , H01R13/629 , H01R13/64 , H01R13/6583 , H01R9/0512 , H01R9/0518 , H01R13/428 , H01R13/506 , H01R13/6581 , H01R13/6591 , H01R13/6592
摘要： A male connector connected to an end of a cable, said male connector comprising a first male outer conductor, and a second male outer conductor assembled to the first male outer conductor. The first male outer conductor and the second male outer conductor in an assembled state cover a male dielectric body in which a male inner conductor connected to the electric wire is housed. One of the first male outer conductor and the second male outer conductor has a male positioning projection which is formed so as to project toward the other one of the first male outer conductor and the second male outer conductor, and the other one of the first male outer conductor and the second male outer conductor has a male slit which is formed so as to engage with the male positioning projection.
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公开(公告)号：US12080968B2
公开(公告)日：2024-09-03
申请号：US17767038
申请日：2020-08-04
申请人： AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Hiroki Kobayashi
IPC分类号： H01R13/514 , H01R13/506 , H01R31/08
CPC分类号： H01R13/514 , H01R13/506 , H01R31/085
摘要： A joint connector 10 is provided with connecting members 21 each including a plurality of terminals 12 and a conductive member, and a plurality of housings. The plurality of housings are stacked along a stacking direction. At least one housing constituting the plurality of housings includes a placing portion, on which the connecting member 21 is placed, and a lid portion for at least partially covering the connecting member 21 placed on the placing portion to hold the connecting member 21 in the housing. A first housing 71 and a second housing 171 are stacked on each other. A first lid portion relating to the first housing 71 and a second lid portion relating to the second housing 171 are provided with a stacked state holding portion.
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公开(公告)号：US12080450B2
公开(公告)日：2024-09-03
申请号：US17630664
申请日：2020-07-20
申请人： AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Shintaro Nambara , Takashi Takada
CPC分类号： H01B7/285 , H01B7/0045 , H01R4/70
摘要： It is aimed to provide a wiring harness excellent in the waterproof performance of a part covered with a water blocking member also under a high temperature environment, a low temperature environment and a cold heat environment. In a wiring harness (10) in which an exposed conductor part (7) of an insulated wire (1, 2, 3) is covered with a water blocking member (8), the water blocking member (8) is a cured product of a composition containing a urethane (meth)acrylate and has two or more glass transition points.
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公开(公告)号：US12077392B2
公开(公告)日：2024-09-03
申请号：US17315423
申请日：2021-05-10
IPC分类号： B65G47/90 , G03F7/16 , H01L21/677 , H01L21/683 , H01L21/687 , H05K9/00
CPC分类号： B65G47/90 , G03F7/162 , H01L21/67766 , H01L21/6838 , H01L21/68707 , H01L21/6875 , H05K9/0067
摘要： A substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector that connects the support and the mover while being grounded; a conductive contact that is provided on the upper surface of the support, and supports the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; a strip-shaped conductive path that is provided to connect the contact and the connector. The strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path.
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公开(公告)号：US12068208B2
公开(公告)日：2024-08-20
申请号：US17475736
申请日：2021-09-15
发明人： Taro Ikeda , Yuki Osada
IPC分类号： H01J37/32 , C23C14/54 , C23C16/455 , C23C16/511 , C23C16/52 , C23C16/54 , H01L21/66
CPC分类号： H01L22/24 , C23C14/54 , C23C16/45508 , C23C16/4558 , C23C16/511 , C23C16/52 , C23C16/54 , H01J37/32192 , H01J37/32935 , H01J37/32954 , H01J37/3299 , H01L22/12 , H01J37/32972
摘要： A method of controlling plasma includes providing a plasma processing apparatus that includes N microwave introducing radiators disposed in a circumferential direction of a ceiling plate of a processing container so as to introduce microwaves for generating plasma into the processing container, wherein N≥2; and M sensors and configured to monitor at least one of electron density Ne and electron temperature Te of the plasma generated in the processing container, wherein M equals to N or a multiple of N. The method further includes controlling at least one of a power and a phase of the microwaves introduced from the microwave introducing radiators based on at least one of electron density Ne and electron temperature Te of the plasma monitored by the M sensors.
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公开(公告)号：US12034285B2
公开(公告)日：2024-07-09
申请号：US17262995
申请日：2019-07-18
申请人： AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Hirokazu Komori , Takahiro Murata
摘要： A hot melt block 20 that is assembled at a portion where an insulating sheath 16 of a cable 10 in which a plurality of electric wires 11 and 12 are collectively surrounded by the insulating sheath 16 is removed and the electric wires 11 and 12 are drawn out, and that is melted through heating. The hot melt block 20 includes: an insertion portion 21 that can be inserted between the electric wires 11 and 12 surrounded by the sheath 16; and a spacer 24 that is fixed to the insertion portion 21, and is disposed between the electric wires 11 and 12 at the portion where the electric wires are drawn out.
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公开(公告)号：US12033872B2
公开(公告)日：2024-07-09
申请号：US17326821
申请日：2021-05-21
发明人： Keita Hirase , Koji Ogura , Hiroshi Yoshida , Takashi Nagai , Jun Nonaka , Takumi Honda
IPC分类号： H01L21/67 , H01L21/311
CPC分类号： H01L21/67057 , H01L21/31111 , H01L21/67017 , H01L21/67086
摘要： A substrate processing apparatus includes: a processing container, a mixing device, a liquid feeding path, and a controller. The processing container processes a substrate by immersing the substrate in a processing liquid. The mixing device mixes a phosphoric acid aqueous solution and an additive, to produce a mixed liquid to be used as a raw material of the processing liquid. The liquid feeding path feeds the mixed liquid from the mixing device to the processing container. The controller controls the substrate processing apparatus. The controller performs a control to feed the mixed liquid from the mixing device to the processing container in which the substrate is immersed, after a phosphoric acid concentration of the mixed liquid is regulated from a first concentration to a second concentration higher than the first concentration. The first concentration is a concentration when the phosphoric acid aqueous solution is supplied to the mixing device.
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10.发明授权公开(公告)号：US12014942B2
公开(公告)日：2024-06-18
申请号：US17064861
申请日：2020-10-07
发明人： Yuta Kunitake
CPC分类号： H01L21/67253 , G01H9/00
摘要： A leak measurement system measures a leak of a semiconductor manufacturing apparatus. The leak measurement system includes a vibration sensor that contacts or is connected to the semiconductor manufacturing apparatus, an image generation unit that generates a vibration waveform image based on vibration data detected by the vibration sensor, and an analysis unit that analyzes the leak of the semiconductor manufacturing apparatus based on the vibration waveform image generated by the image generation unit.
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