Abstract:
An integrated circuit memory fabrication process and structure, in which salicidation is performed on the periphery (and optionally on the ground lines) of a memory chip, but not on the transistors of the memory cells.
Abstract:
A semiconductor device includes an emitter region, a contact region, and a resistive medium. The resistive medium is connected between the contact region and the emitter region. The contact region and the emitter region each include an edge facing each other. At least a portion of the emitter region edge and at least a portion of the contact region edge are non-parallel relative to each other. This configuration enables an emitter ballast resistance to be provided with varied emitter current flow along the injecting edge of the emitter. Furthermore, by including an additional contact and an additional resistive medium between the contacts, the ballast resistance of the semiconductor device can be increased without decreasing the figure of merit of the device.
Abstract:
According to the present invention, by setting the logic state of one or more delay signals to appropriate values, the resistive value of a plurality of power supply delay elements throughout an integrated circuit having distributed circuit blocks may be modified to produce desired delay times or pulse width adjustments throughout the integrated circuit. Setting delay signals to desired logic states may be accomplished by a variety of means including forcing test pads to a logic level, blowing fuses, or entering into a test mode.
Abstract:
A resistor structure suitable for use in an SRAM cell is formed from polycrystalline silicon elements. These elements have a cross-section which is less than is normally available for polycrystalline silicon interconnect lines, allowing increased resistance values to be implemented using a lesser amount of surface area. In one embodiment of a resistor, sidewall spacers are formed in a cavity within an insulating layer, and polycrystalline silicon resistive elements are formed in the narrowed region within the cavity. In another embodiment, polycrystalline silicon resistors alongside vertical sidewalls of a cavity are formed using sidewall spacer technology. In either event, the cross-sectional area of the resistors is less than that normally available for a given processing technology, resulting in enhanced resistor values.
Abstract:
According to the present invention, a circuit, utilizing a minimum number of bipolar devices and current mirror scaling devices, generates a bandgap reference voltage. The bandgap voltage generated by the bandgap reference circuit is a function of a plurality of sized current mirror devices, the ratio of a first resistor to a second resistor, and the number and relative sizing of bipolar junction transistors used. The bandgap reference circuit generates a bandgap reference voltage which is suitable for use in a variety of integrated circuit devices, such as a zero power static random access memory (SRAM). If used in a zero power SRAM application, the bandgap reference voltage may be utilized to determine when the primary power source of the zero power SRAM has fallen below a predetermined voltage level and a secondary power source must be substituted for the primary power source.
Abstract:
The decoded address signal is stored in the slave latch. The output of the slave latch is a column select signal. The slave latches are organized in a slave latch circuit which is connected as a counter. Each of the slave latches is treated as a register and four slave latches are combined to permit the sequential addresses selected to be in count up or count down as the slave latch circuit is clocked. In addition, a burst counter control circuit selectively controls the counter to produce a count in an interleaved mode or a count up mode. The least significant bit of the address is stored within the burst control circuit for indicating whether the count should be an up count or a down count when operating in the interleaved mode.
Abstract:
Crystal oscillator circuitry provides a very fast start-up function requiring less than 100 mS. The crystal oscillator circuitry enters a stop mode when a control signal transitions from a first logic level to a second logic level thereby causing a crystal to stop oscillating. In order to initiate the fast start-up function, a pulse is provided to the gate of a transistor which is electrically connected between a first node and a second node, thus causing the voltage of the first node to move towards the voltage level of the second node and the second node to move towards the voltage level of the first node. Upon initiation of the start-up function, the energy at the crystal of the crystal oscillator circuitry is at least four times higher than the energy required in a steady state mode. The crystal oscillator circuitry has a VT (threshold voltage) independent high feedback resistance which provides stable oscillation frequency over a wide range of Vcc supply voltage. The VT independent high feedback resistance is ensured by proper sizing of the transistors of the crystal oscillator circuitry.
Abstract:
An output driver circuit an integrated circuit memory device prevents crowbar currents from occurring. The output driver uses just one resistive element having multiple taps so that the amount of silicon area used for slew rate control is minimized. The signals which control the output driver devices are carefully balanced for no skew and cross at a voltage level of Vcc/2 so that there is no crowbar current generated during tri-stating of the output driver output signal.
Abstract:
A comparator with a built-in hysteresis is disclosed. The comparator has a differential input stage, an output stage, and a bias circuit with a hysteresis circuit. The hysteresis circuit selectively applies a bias voltage to the differential input stage to achieve the hysteresis.
Abstract:
A control circuit for providing a stable, adjustable, time constant for use as a master time constant is presented. Used as a master time-constant circuit, this control circuit can ensure multiple slave circuits are precisely calibrated. The circuit includes a charging section that receives a series of calibrating pulses. The reference cell's voltage is compared to a reference voltage equal of Vcc/e. If the cell's voltage is below the reference voltage, a current source charges a capacitor, lowering the resistance of the transistor in the cell to correct the time circuit inaccuracy. Conversely, if the cell's voltage is above the reference voltage, a current sink discharges the capacitor, raising the transistor's resistance. This also corrects the time circuit inaccuracy. Thus, this circuit includes a method to correct time-constants which are too large or too small. This circuit is used in various applications where extreme accuracy and precision is needed, such as media drive read/write heads.