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    Intelligent lighting system
    2.
    发明授权
    Intelligent lighting system 有权
    智能照明系统

    公开(公告)号：US09282596B2

    公开(公告)日：2016-03-08

    申请号：US13694569

    申请日：2012-12-13

    申请人： Power Gold LLC

    发明人： James Jen-Ho Wang

    IPC分类号： H05B37/02 ,  H05B33/08

    CPC分类号： H05B33/0803 ,  H05B33/0815 ,  H05B33/0857

    摘要： Intelligent lighting system 100 is configured to operate from an AC source 12. An array of visible light emitting diodes (LEDs) 124 responds to environmental room conditions monitored by a sensor circuit. A microcontroller 146 operates in response to sensor circuit communications to control the state of the visible light array. An internal low noise voltage source VL is derived from the waste heat product from a portion of the LED array. The low noise voltage source is used to power the sensor circuit and the microcontroller.

    摘要翻译： 智能照明系统100被配置为从AC源12操作。可见光发射二极管（LED）124的阵列响应于由传感器电路监测的环境房间状态。 微控制器146响应于传感器电路通信而操作以控制可见光阵列的状态。 来自LED阵列的一部分的废热产物导出内部低噪声电压源VL。 低噪声电压源用于为传感器电路和微控制器供电。

    FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING THE SAME 有权
    柔性电子组件及其制造方法

    公开(公告)号：US20140268780A1

    公开(公告)日：2014-09-18

    申请号：US13835634

    申请日：2013-03-15

    申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  POWER GOLD LLC

    发明人： James Jen-Ho WANG ,  Jin Joo PARK

    IPC分类号： F21V19/00 ,  F21K99/00 ,  H05K3/30 ,  H05K1/02

    CPC分类号： F21V19/003 ,  F21K9/00 ,  F21K9/90 ,  F21S4/22 ,  F21S4/24 ,  H05K1/0206 ,  H05K1/028 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/306 ,  H05K2201/051 ,  H05K2201/10106 ,  Y10T29/49139

    摘要： A flexible circuit assembly for accommodating a plurality of power electronic devices, including an insulating cover layer having first openings for power electronic devices, a flexible conductive layer arranged under the insulating cover layer and attached with a first adhesive to the insulating cover layer, an intermediate insulating layer arranged under the flexible conductive layer and attached with a second adhesive to the flexible conductive layer, the intermediate insulating layer having second openings, a plurality of heat-conductive elements arranged inside the second openings, a first thin heat sink layer, the heat-conductive elements arranged to be in contact with an upper surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material; and a second thin heat sink layer, upper surfaces of the power electronic devices arranged to be in contact with a lower surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material.

    摘要翻译： 一种用于容纳多个功率电子器件的柔性电路组件，包括具有用于功率电子器件的第一开口的绝缘覆盖层，布置在绝缘覆盖层下方并且与第一粘合剂附着到绝缘覆盖层的柔性导电层，中间层 绝缘层，布置在所述柔性导电层下方并且具有第二粘合剂附着到所述柔性导电层，所述中间绝缘层具有第二开口，布置在所述第二开口内部的多个导热元件，第一薄散热层，所述热 导电元件，其经由导热材料布置成与薄散热层的上表面和岛的下表面接触; 以及第二薄散热层，电力电子器件的上表面经由导热材料布置成与薄散热层的下表面和岛的下表面接触。

    Flexible electronic assembly and method of manufacturing the same
    7.
    发明授权
    Flexible electronic assembly and method of manufacturing the same 有权
    灵活的电子组装及其制造方法

    公开(公告)号：US08998454B2

    公开(公告)日：2015-04-07

    申请号：US13835634

    申请日：2013-03-15

    申请人： Sumitomo Electric Printed Circuits, Inc. ,  Power Gold LLC

    发明人： James Jen-Ho Wang ,  Jin Joo Park

    IPC分类号： F21V29/00 ,  F21V19/00 ,  F21K99/00 ,  H05K1/02 ,  H05K3/30

    CPC分类号： F21V19/003 ,  F21K9/00 ,  F21K9/90 ,  F21S4/22 ,  F21S4/24 ,  H05K1/0206 ,  H05K1/028 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/306 ,  H05K2201/051 ,  H05K2201/10106 ,  Y10T29/49139

    摘要： A flexible circuit assembly for accommodating a plurality of power electronic devices, including an insulating cover layer having first openings for power electronic devices, a flexible conductive layer arranged under the insulating cover layer and attached with a first adhesive to the insulating cover layer, an intermediate insulating layer arranged under the flexible conductive layer and attached with a second adhesive to the flexible conductive layer, the intermediate insulating layer having second openings, a plurality of heat-conductive elements arranged inside the second openings, a first thin heat sink layer, the heat-conductive elements arranged to be in contact with an upper surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material; and a second thin heat sink layer, upper surfaces of the power electronic devices arranged to be in contact with a lower surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material.

    摘要翻译： 一种用于容纳多个功率电子器件的柔性电路组件，包括具有用于功率电子器件的第一开口的绝缘覆盖层，布置在绝缘覆盖层下方并且与第一粘合剂附着到绝缘覆盖层的柔性导电层，中间 绝缘层，布置在所述柔性导电层下方并且具有第二粘合剂附着到所述柔性导电层，所述中间绝缘层具有第二开口，布置在所述第二开口内部的多个导热元件，第一薄散热层，所述热 导电元件，其经由导热材料布置成与薄散热层的上表面和岛的下表面接触; 以及第二薄散热层，电力电子器件的上表面经由导热材料布置成与薄散热层的下表面和岛的下表面接触。

    Integrated nano-farad capacitors and method of formation
    8.
    发明授权
    Integrated nano-farad capacitors and method of formation 有权
    集成纳米法拉电容器及其形成方法

    公开(公告)号：US08890287B2

    公开(公告)日：2014-11-18

    申请号：US12802012

    申请日：2010-05-27

    申请人： James Jen-Ho Wang

    发明人： James Jen-Ho Wang

    IPC分类号： H01L29/92 ,  H01L21/02 ,  H01L23/522 ,  H01L49/02

    CPC分类号： H01L23/5223 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A high value capacitance per unit area capacitor is fabricated on a substrate 1 by converting a portion of a primary function anti-reflecting conducting layer 36 to a high value dielectric layer 37 by partially oxidizing the conducting layer to form the dielectric layer. The resultant combination is sandwiched between two metal layer electrodes 35 and 55 to complete the capacitor structure.

    摘要翻译： 通过将导电层部分氧化形成电介质层，将主功能抗反射导电层36的一部分转换成高价值的电介质层37，在基板1上制造高电容值的单位面积电容器。 所得到的组合夹在两个金属层电极35和55之间以完成电容器结构。

    Intelligent lighting system
    10.
    发明申请
    Intelligent lighting system 有权
    智能照明系统

    公开(公告)号：US20140167618A1

    公开(公告)日：2014-06-19

    申请号：US13694569

    申请日：2012-12-13

    申请人： James Jen-Ho Wang

    发明人： James Jen-Ho Wang

    IPC分类号： H05B37/02

    CPC分类号： H05B33/0803 ,  H05B33/0815 ,  H05B33/0857

    摘要： Intelligent lighting system 100 is configured to operate from an AC source 12. An array of visible light emitting diodes (LEDs) 124 responds to environmental room conditions monitored by a sensor circuit. A microcontroller 146 operates in response to sensor circuit communications to control the state of the visible light array. An internal low noise voltage source VL is derived from the waste heat product from a portion of the LED array. The low noise voltage source is used to power the sensor circuit and the microcontroller.

    摘要翻译： 智能照明系统100被配置为从AC源12操作。可见光发射二极管（LED）124的阵列响应于由传感器电路监测的环境房间状态。 微控制器146响应于传感器电路通信而操作以控制可见光阵列的状态。 来自LED阵列的一部分的废热产物导出内部低噪声电压源VL。 低噪声电压源用于为传感器电路和微控制器供电。