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    Intelligent lighting system
    2.
    发明授权
    Intelligent lighting system 有权
    智能照明系统

    公开(公告)号：US09282596B2

    公开(公告)日：2016-03-08

    申请号：US13694569

    申请日：2012-12-13

    申请人： Power Gold LLC

    发明人： James Jen-Ho Wang

    IPC分类号： H05B37/02 ,  H05B33/08

    CPC分类号： H05B33/0803 ,  H05B33/0815 ,  H05B33/0857

    摘要： Intelligent lighting system 100 is configured to operate from an AC source 12. An array of visible light emitting diodes (LEDs) 124 responds to environmental room conditions monitored by a sensor circuit. A microcontroller 146 operates in response to sensor circuit communications to control the state of the visible light array. An internal low noise voltage source VL is derived from the waste heat product from a portion of the LED array. The low noise voltage source is used to power the sensor circuit and the microcontroller.

    摘要翻译： 智能照明系统100被配置为从AC源12操作。可见光发射二极管（LED）124的阵列响应于由传感器电路监测的环境房间状态。 微控制器146响应于传感器电路通信而操作以控制可见光阵列的状态。 来自LED阵列的一部分的废热产物导出内部低噪声电压源VL。 低噪声电压源用于为传感器电路和微控制器供电。

    METHOD OF EMBEDDING A PRE-ASSEMBLED UNIT INCLUDING A DEVICE INTO A FLEXIBLE PRINTED CIRCUIT AND CORRESPONDING ASSEMBLY
    3.
    发明申请
    METHOD OF EMBEDDING A PRE-ASSEMBLED UNIT INCLUDING A DEVICE INTO A FLEXIBLE PRINTED CIRCUIT AND CORRESPONDING ASSEMBLY 有权
    将包括设备的预组装单元嵌入柔性印刷电路和对应组件的方法

    公开(公告)号：US20140268594A1

    公开(公告)日：2014-09-18

    申请号：US13835845

    申请日：2013-03-15

    申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  Power Gold LLC

    发明人： James Jen-Ho WANG ,  Jin Joo PARK ,  Masahiko KOUCHI

    IPC分类号： H05K1/02 ,  H05K13/04

    CPC分类号： H05K1/189 ,  H01L2224/83192 ,  H05K1/0207 ,  H05K1/183 ,  H05K2201/09781 ,  H05K2201/10681 ,  Y10T29/49146

    摘要： A flexible printed circuit assembly, having a first flexible printed circuit having a first conductive layer and a device that is connected the first conductive layer; and a second flexible printed circuit having a second conductive layer, an insulating center layer, and a third conductive layer, the insulating center layer arranged in-between the second and the third conductive layers, the second conductive layer and the insulating center layer being removed to form an opening to expose an upper surface of the third conductive layer, wherein the first flexible printed circuit is arranged such that the device is accommodated inside the opening, a lower surface of the device being in thermal connection with the third conductive layer, and the first conductive layer is arranged to be in electrical connection with the second conductive layer.

    摘要翻译： 一种柔性印刷电路组件，具有具有第一导电层的第一柔性印刷电路和连接第一导电层的器件; 以及第二柔性印刷电路，其具有第二导电层，绝缘中心层和第三导电层，所述绝缘中心层布置在所述第二和第三导电层之间，所述第二导电层和所述绝缘中心层被去除 以形成用于暴露第三导电层的上表面的开口，其中第一柔性印刷电路被布置成使得该装置容纳在开口内部，该装置的下表面与第三导电层热连接，以及 第一导电层被布置成与第二导电层电连接。

    Flexible electronic assembly and method of manufacturing the same
    4.
    发明授权
    Flexible electronic assembly and method of manufacturing the same 有权
    灵活的电子组装及其制造方法

    公开(公告)号：US08998454B2

    公开(公告)日：2015-04-07

    申请号：US13835634

    申请日：2013-03-15

    申请人： Sumitomo Electric Printed Circuits, Inc. ,  Power Gold LLC

    发明人： James Jen-Ho Wang ,  Jin Joo Park

    IPC分类号： F21V29/00 ,  F21V19/00 ,  F21K99/00 ,  H05K1/02 ,  H05K3/30

    CPC分类号： F21V19/003 ,  F21K9/00 ,  F21K9/90 ,  F21S4/22 ,  F21S4/24 ,  H05K1/0206 ,  H05K1/028 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/306 ,  H05K2201/051 ,  H05K2201/10106 ,  Y10T29/49139

    摘要： A flexible circuit assembly for accommodating a plurality of power electronic devices, including an insulating cover layer having first openings for power electronic devices, a flexible conductive layer arranged under the insulating cover layer and attached with a first adhesive to the insulating cover layer, an intermediate insulating layer arranged under the flexible conductive layer and attached with a second adhesive to the flexible conductive layer, the intermediate insulating layer having second openings, a plurality of heat-conductive elements arranged inside the second openings, a first thin heat sink layer, the heat-conductive elements arranged to be in contact with an upper surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material; and a second thin heat sink layer, upper surfaces of the power electronic devices arranged to be in contact with a lower surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material.

    摘要翻译： 一种用于容纳多个功率电子器件的柔性电路组件，包括具有用于功率电子器件的第一开口的绝缘覆盖层，布置在绝缘覆盖层下方并且与第一粘合剂附着到绝缘覆盖层的柔性导电层，中间 绝缘层，布置在所述柔性导电层下方并且具有第二粘合剂附着到所述柔性导电层，所述中间绝缘层具有第二开口，布置在所述第二开口内部的多个导热元件，第一薄散热层，所述热 导电元件，其经由导热材料布置成与薄散热层的上表面和岛的下表面接触; 以及第二薄散热层，电力电子器件的上表面经由导热材料布置成与薄散热层的下表面和岛的下表面接触。

    FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING THE SAME 有权
    柔性电子组件及其制造方法

    公开(公告)号：US20140268780A1

    公开(公告)日：2014-09-18

    申请号：US13835634

    申请日：2013-03-15

    申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. ,  POWER GOLD LLC

    发明人： James Jen-Ho WANG ,  Jin Joo PARK

    IPC分类号： F21V19/00 ,  F21K99/00 ,  H05K3/30 ,  H05K1/02

    CPC分类号： F21V19/003 ,  F21K9/00 ,  F21K9/90 ,  F21S4/22 ,  F21S4/24 ,  H05K1/0206 ,  H05K1/028 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/306 ,  H05K2201/051 ,  H05K2201/10106 ,  Y10T29/49139

    摘要： A flexible circuit assembly for accommodating a plurality of power electronic devices, including an insulating cover layer having first openings for power electronic devices, a flexible conductive layer arranged under the insulating cover layer and attached with a first adhesive to the insulating cover layer, an intermediate insulating layer arranged under the flexible conductive layer and attached with a second adhesive to the flexible conductive layer, the intermediate insulating layer having second openings, a plurality of heat-conductive elements arranged inside the second openings, a first thin heat sink layer, the heat-conductive elements arranged to be in contact with an upper surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material; and a second thin heat sink layer, upper surfaces of the power electronic devices arranged to be in contact with a lower surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material.

    摘要翻译： 一种用于容纳多个功率电子器件的柔性电路组件，包括具有用于功率电子器件的第一开口的绝缘覆盖层，布置在绝缘覆盖层下方并且与第一粘合剂附着到绝缘覆盖层的柔性导电层，中间层 绝缘层，布置在所述柔性导电层下方并且具有第二粘合剂附着到所述柔性导电层，所述中间绝缘层具有第二开口，布置在所述第二开口内部的多个导热元件，第一薄散热层，所述热 导电元件，其经由导热材料布置成与薄散热层的上表面和岛的下表面接触; 以及第二薄散热层，电力电子器件的上表面经由导热材料布置成与薄散热层的下表面和岛的下表面接触。