知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.053 秒)

    Printed circuit board, antenna, and wireless charging device
    5.
    发明授权
    Printed circuit board, antenna, and wireless charging device 有权

    公开(公告)号：US10373757B2

    公开(公告)日：2019-08-06

    申请号：US15318472

    申请日：2015-07-01

    申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

    发明人： Masahiko Kouchi ,  Tetsuya Shimomura

    IPC分类号： H02J7/00 ,  H01F38/14 ,  H02J7/02 ,  H05K1/11 ,  H05K1/14 ,  H01F27/28 ,  H05K1/16 ,  H02J50/12 ,  H01F27/36 ,  H05K3/46

    摘要： A printed circuit board according to an embodiment of the present invention includes, alternately, at least one insulating layer containing a synthetic resin as a main component; and a plurality of conductive layers including circuit patterns, wherein the plurality of circuit patterns of the plurality of conductive layers form a spiral pattern in plan view, and the plurality of circuit patterns are connected together via a plurality of through-holes so as to form a single closed loop in which a current flows counterclockwise or clockwise in an entirety of the spiral pattern. The conductive layers are preferably formed on both surfaces of the at least one insulating layer so as to form a pair. The spiral pattern includes a plurality of multi-row circuits arranged to form multi-rows, and a bridging circuit that connects an end portion of one multi-row circuit of one of the conductive layers to an end portion of another multi-row circuit of the other conductive layer, the other multi-row circuit being adjacent to the one multi-row circuit.

    Radio-frequency printed circuit board and wiring material
    7.
    发明授权
    Radio-frequency printed circuit board and wiring material 有权

    公开(公告)号：US10383215B2

    公开(公告)日：2019-08-13

    申请号：US14890497

    申请日：2014-01-16

    申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

    发明人： Masahiko Kouchi ,  Kazuo Murata ,  Makoto Nakabayashi

    IPC分类号： H01K1/02 ,  H05K1/02 ,  B32B15/08 ,  H05K1/03 ,  H05K1/05 ,  B32B7/10

    摘要： (1) A conductor layer is disposed on at least one surface of a dielectric layer, the dielectric layer including an intermediate layer and a pair or more of fluororesin layers disposed on both surfaces of the intermediate layer, in which the ratio of the total average thickness of the intermediate layer to the total average thickness of the fluororesin layers is 0.001 to 30, the relative dielectric constant of the intermediate layer is 1.2 to 10, the coefficient of linear expansion of the intermediate layer is −1×10−4/° C. to 5×10−5/° C., and the adhesive strength between the fluororesin layer and the conductor layer is 300 g/cm or more. (2) Conductor layers are disposed on both surfaces of a dielectric layer made of a fluororesin, in which at least one of the conductor layers constitutes a wiring pattern, the average trace width of the wiring pattern is 25 to 300 μm, the average thickness of the dielectric layer in the region where traces of the wiring pattern are disposed is 5 to 125 μm, and the ratio of the average trace width to the average thickness of the dielectric layer is 2.4 to 30. (3) A multilayer structure includes conductor layers and dielectric layers made of a fluororesin alternately disposed, in which the fluororesin of the dielectric layers is crosslinked and chemically bonded to the conductor layers, the average thickness of the multilayer structure is 30 to 2,000 μm, and the crush resistance of the multilayer structure measured by a loop stiffness test is 0.1 to 20,000 N/cm.