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公开(公告)号：US20240006455A1
公开(公告)日：2024-01-04
申请号：US17822654
申请日：2022-08-26
发明人： Liqun DONG , Haibo XIAO , Shuaibing LIN , Xinzhi DAI
IPC分类号： H01L27/146
CPC分类号： H01L27/14643 , H01L27/1463 , H01L27/14689
摘要： The present invention provides an image sensor and a method for fabricating the image sensor. The image sensor includes a semiconductor substrate, photodiodes (PD), deep isolation trenches, first deep P-well blocks and second deep P-wells. The isolation trenches surrounds the PDs, and each of the isolation trenches is separated from any adjacent isolation trenches at a crossing where they would have crossed each other if they further extended. The first deep P-wells blocks have projections on the semiconductor substrate, which encompass projections of said separated portions of the isolation trenches on the semiconductor substrate. The first P-well blocks can be formed using only one photomask, resulting in a reduction in cost.
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公开(公告)号：US11418734B1
公开(公告)日：2022-08-16
申请号：US17408926
申请日：2021-08-23
发明人： Yunyi Wang , Zejian Wang , Yusheng Yang
摘要： The present invention provides a dual conversion gain image sensor comprising: a pixel circuit, through which pixel power supply voltage noise is transferred to a bit line; a power supply noise cancellation circuit with an input to which the pixel power supply voltage is applied, the power supply noise cancellation circuit mimicly producing a first transfer function with the aid of a low conversion gain path, the power supply noise cancellation circuit mimicly producing a second transfer function with the aid of a high conversion gain path; and a comparator. According to the present invention, the low and high conversion gain paths are two independent power supply noise cancellation paths that result in different transfer functions capable of tracking the variation of the pixel power supply voltage in low and high conversion gain modes.
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3.发明授权公开(公告)号：US09326000B2
公开(公告)日：2016-04-26
申请号：US14322835
申请日：2014-07-02
发明人： Yihong Zhao , Jizhang Shan
IPC分类号： G06K9/36 , H04N19/44 , H04N19/40 , H04N19/93 , H04N19/18 , H04N19/176 , H04N19/91 , H04N19/124 , G06T9/00 , H04N19/14
CPC分类号： H04N19/45 , G06T9/007 , H04N19/124 , H04N19/14 , H04N19/17 , H04N19/176 , H04N19/18 , H04N19/40 , H04N19/436 , H04N19/625 , H04N19/70 , H04N19/91 , H04N19/93
摘要： Methods and systems for JPEG encoding and decoding are disclosed. In the encoding method, an image is split into 8×8 pixel blocks and the 8×8 pixel blocks are grouped into a number of minimum coded units (MCU's), such that each MCU consists of a constant number of 8×8 pixel blocks. The MCU's are then scanned to forward discrete cosine transform, quantization, zigzag scanning and entropy encoding processes and are subsequently converted into bitstreams according to entropy encoding coding tables. In the entropy encoding process, AC coefficients are run-length encoded, while DC coefficients are not subjected to differential pulse-code modulation. The bitstreams are byte-aligned by stuffing zeroes and compression data for a special JPEG file are generated from the byte-aligned bitstreams. A position table is established, recording positions of the bitstreams in the compression data. The method enables fast positioning of bitstreams corresponding to an image region of interest.
摘要翻译： 公开了用于JPEG编码和解码的方法和系统。 在编码方法中，将图像分割为8×8像素块，将8×8像素块分组为多个最小编码单位（MCU），使得每个MCU由恒定数量的8×8像素块组成 。 然后扫描MCU以进行离散余弦变换，量化，曲折扫描和熵编码处理，并且随后根据熵编码表转换成比特流。 在熵编码过程中，对AC系数进行游程长度编码，而DC系数不经受差分脉冲编码调制。 比特流通过填充零字节对齐，并且从字节对齐的比特流生成用于特殊JPEG文件的压缩数据。 建立位置表，记录压缩数据中位流的位置。 该方法能够对应于感兴趣的图像区域的比特流进行快速定位。
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公开(公告)号：US09229280B2
公开(公告)日：2016-01-05
申请号：US13865835
申请日：2013-04-18
发明人： Regis Fan
IPC分类号： G02F1/1339 , G02F1/1333 , G02F1/1362 , G02F1/1341 , G02F1/1337 , G02F1/1345
CPC分类号： G02F1/1339 , G02F1/1333 , G02F1/133351 , G02F1/1337 , G02F1/1341 , G02F1/1345 , G02F1/136277 , G02F2201/121
摘要： A method of manufacturing LCOS panel is disclosed. The method includes: providing a silicon substrate on which at least one conductive pad is formed and a transparent substrate on which a transparent electrode layer is formed; dispensing or coating a sealing material on a predetermined area of the silicon substrate or the transparent substrate; bonding the silicon substrate with the transparent substrate; singulating the bonded silicon substrate and transparent substrate such that at least one space is provided between the silicon substrate and the transparent substrate on an outer side of the sealing material and a part of the transparent electrode layer is exposed in the space; and dispensing a conductive adhesive into the space to connect the transparent electrode layer to the conductive pad. The method is able to achieve a smaller-size of the LCOS panels, a higher production yield and a lower process requirement.
摘要翻译： 公开了制造LCOS面板的方法。 该方法包括：提供其上形成有至少一个导电焊盘的硅衬底和形成有透明电极层的透明衬底; 在硅衬底或透明衬底的预定区域上分配或涂覆密封材料; 将硅衬底与透明衬底接合; 分离粘合硅衬底和透明衬底，使得在密封材料的外侧上的硅衬底和透明衬底之间提供至少一个空间，并且透明电极层的一部分暴露在该空间中; 并且将导电粘合剂分配到所述空间中以将所述透明电极层连接到所述导电垫。 该方法能够实现更小尺寸的LCOS面板，更高的产量和更低的工艺要求。
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公开(公告)号：US08798210B2
公开(公告)日：2014-08-05
申请号：US13597204
申请日：2012-08-28
申请人： Yun Zhang
发明人： Yun Zhang
CPC分类号： H04L27/2657 , H04L27/2613 , H04L27/2671 , H04L27/2675
摘要： Methods, system and apparatuses for carrier frequency offset estimation are disclosed. The method includes: receiving a preamble sequence rn with a correlator and correlating the preamble sequence with a locally stored Barker code bn to obtain a correlation result cn; extracting peak values from every L points in cn to form a peak value sequence xn, L being a length of a Barker code that corresponds to the sampling rate; performing frequency offset estimation to xn by using at least two frequency offset estimation apparatuses, the at least two frequency offset estimation apparatuses adopting different delay parameters D; and inputting the results output from the at least two frequency offset estimation apparatuses into a frequency offset combination module to calculate a final carrier frequency offset estimate, whereby accurate frequency estimation can be achieved and an appropriate acquisition range of frequency offset can be ensured.
摘要翻译： 公开了用于载波频率偏移估计的方法，系统和装置。 该方法包括：用相关器接收前同步码序列rn，并将前同步码序列与本地存储的巴克码bn进行相关，以获得相关结果cn; 从cn中的每个L点提取峰值以形成峰值序列xn，L是对应于采样率的Barker码的长度; 通过使用至少两个频率偏移估计装置对xn进行频率偏移估计，所述至少两个频率偏移估计装置采用不同的延迟参数D; 以及将从所述至少两个频率偏移估计装置输出的结果输入到频率偏移组合模块中以计算最终载波频率偏移估计，由此可以实现精确的频率估计，并且可以确保频率偏移的适当的采集范围。
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公开(公告)号：US08750436B2
公开(公告)日：2014-06-10
申请号：US13597202
申请日：2012-08-28
申请人： Yun Zhang
发明人： Yun Zhang
IPC分类号： H03D1/00
CPC分类号： H04L25/0212 , H04L25/0226 , H04L27/2071
摘要： Methods and apparatuses for channel estimation are disclosed. The method includes: converting −1's in a local Barker code to 0's; receiving a first preamble symbol output from a first Barker correlator and a second preamble symbol output from a second Barker correlator with a symbol determination module, the first preamble symbol being adjacent to the second preamble symbol; multiplying a result output from the symbol determination module with a correlation result output from the cyclic Barker correlator by using a multiplication module so as to obtain a channel estimation response; and receiving channel estimation responses with a time-domain channel data storage unit, and averaging them to obtain a noise-reduced channel estimation response. The channel estimation method and apparatus of the present invention can be achieved based on few hardware resources and low computation complexity.
摘要翻译： 公开了用于信道估计的方法和装置。 该方法包括：将本地Barker代码中的-1转换为0; 从第一巴克相关器输出的第一前导码符号和从第二巴克相关器输出的与码元确定模块输出的第二前导码符号，所述第一前导码符号与所述第二前导符号相邻; 通过使用乘法模块将来自符号确定模块的结果输出与从循环巴克相关器输出的相关结果相乘，以获得信道估计响应; 以及用时域信道数据存储单元接收信道估计响应，并对它们进行平均以获得噪声降低的信道估计响应。 本发明的信道估计方法和装置可以基于少量硬件资源和低计算复杂度来实现。
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公开(公告)号：US20140085579A1
公开(公告)日：2014-03-27
申请号：US13865835
申请日：2013-04-18
发明人： Regis Fan
IPC分类号： G02F1/1339 , G02F1/1337
CPC分类号： G02F1/1339 , G02F1/1333 , G02F1/133351 , G02F1/1337 , G02F1/1341 , G02F1/1345 , G02F1/136277 , G02F2201/121
摘要： A method of manufacturing LCOS panel is disclosed. The method includes: providing a silicon substrate on which at least one conductive pad is formed and a transparent substrate on which a transparent electrode layer is formed; dispensing or coating a sealing material on a predetermined area of the silicon substrate or the transparent substrate; bonding the silicon substrate with the transparent substrate; singulating the bonded silicon substrate and transparent substrate such that at least one space is provided between the silicon substrate and the transparent substrate on an outer side of the sealing material and a part of the transparent electrode layer is exposed in the space; and dispensing a conductive adhesive into the space to connect the transparent electrode layer to the conductive pad. The method is able to achieve a smaller-size of the LCOS panels, a higher production yield and a lower process requirement.
摘要翻译： 公开了制造LCOS面板的方法。 该方法包括：提供其上形成有至少一个导电焊盘的硅衬底和形成有透明电极层的透明衬底; 在硅衬底或透明衬底的预定区域上分配或涂覆密封材料; 将硅衬底与透明衬底接合; 分离粘合硅衬底和透明衬底，使得在密封材料的外侧上的硅衬底和透明衬底之间提供至少一个空间，并且透明电极层的一部分暴露在该空间中; 并且将导电粘合剂分配到所述空间中以将所述透明电极层连接到所述导电垫。 该方法能够实现更小尺寸的LCOS面板，更高的产量和更低的工艺要求。
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公开(公告)号：US20210167104A1
公开(公告)日：2021-06-03
申请号：US16983422
申请日：2020-08-03
发明人： Jinhua RAO , Haibo XIAO
IPC分类号： H01L27/146
摘要： An image sensor and an electronic device are disclosed. At least one pixel in the image sensor includes a photodiode, a floating diffusion region and a transfer transistor located between the photodiode and the floating diffusion region. The photodiode includes a carrier-accumulation region, and a gate of the transfer transistor extends up to the carrier-accumulation region. The gate extends away from the floating diffusion region and overlaps over half of a width of the carrier-accumulation region. Since carriers move at a higher speed in a fast transfer channel in the semiconductor substrate around such a gate, increasing the length of the transfer transistor's gate extending away from the floating diffusion region and overlapping range with the carrier-accumulation region can facilitate fast movement of carriers from the carrier-accumulation region through such fast transfer channels to the floating diffusion region, thereby improving overall carrier transfer efficiency and optimizing performance thereof.
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公开(公告)号：US09202841B1
公开(公告)日：2015-12-01
申请号：US14490645
申请日：2014-09-18
发明人： Jiaming Xing , Jing Ye , Xifeng Gao , Zhetian Shi
IPC分类号： H01L27/146 , H01L21/768 , H01L21/28 , H01L23/48 , H01L23/00
CPC分类号： H01L27/14685 , H01L21/28132 , H01L21/743 , H01L21/76877 , H01L23/481 , H01L23/485 , H01L24/83 , H01L27/14621 , H01L27/14623 , H01L27/14625 , H01L27/14627 , H01L27/14636 , H01L27/14643 , H01L27/14687
摘要： A method of fabricating a semiconductor structure is disclosed, in which a pad above a connecting section and metal structures above a functional section are formed from the same metal layer. This design enables the simultaneous formation of the pad and the metal structures by forming a single metal layer and performing thereon a selective etching process, thereby leading to the advantages of process simplification, throughput improvement and cost reduction.
摘要翻译： 公开了一种制造半导体结构的方法，其中连接部分上方的焊盘和功能部分上方的金属结构由相同的金属层形成。 该设计使得能够通过形成单个金属层并在其上执行选择性蚀刻工艺来同时形成焊盘和金属结构，从而导致工艺简化，生产率提高和成本降低的优点。
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公开(公告)号：US09030604B2
公开(公告)日：2015-05-12
申请号：US14024513
申请日：2013-09-11
CPC分类号： H04N5/2253 , H04N5/2252 , H04N5/2257 , H05K1/111 , H05K3/301 , H05K3/3436 , H05K2201/10121 , H05K2201/10151 , H05K2201/10969 , Y02P70/611 , Y02P70/613
摘要： A housing for protecting a wafer-level camera module and fixing the wafer-level camera module to a printed circuit board (PCB) includes: four side plates, defining a quadrilateral frame; four supporting plates each fixed to a lower portion of an inner face of a corresponding one of the four side plates, each supporting plate having a top face supporting a portion of the camera module; and four bottom plates each fixed to a lower portion of an outer face of a corresponding one of the four side plates, each bottom plate having a bottom face fixed to the PCB. The housing is capable of addressing the issues of poor housing-PCB soldering, paint falling off and surface scratching and improving the efficiency in UV lamp-utilized UV adhesive curing.
摘要翻译： 用于保护晶片级相机模块并将晶片级相机模块固定到印刷电路板（PCB）的外壳包括：限定四边形框架的四个侧板; 四个支撑板各自固定到四个侧板中的相应一个的内表面的下部，每个支撑板具有支撑相机模块的一部分的顶面; 以及四个底板，每个底板固定到四个侧板中的相应一个的外表面的下部，每个底板具有固定到PCB的底面。 房屋能够解决住房不良PCB焊接，油漆脱落和表面划伤问题，提高紫外线灯使用的紫外线固化的效率。
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