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    Multi-layer conductive backplane for LED light sheet segments
    4.
    发明授权
    Multi-layer conductive backplane for LED light sheet segments 有权
    用于LED灯片段的多层导电背板

    公开(公告)号：US09508694B2

    公开(公告)日：2016-11-29

    申请号：US14559609

    申请日：2014-12-03

    申请人： Nthdegree Technologies Worldwide Inc.

    发明人： Bradley Steven Oraw ,  Bemly Sujeewa Randeniya

    IPC分类号： H01L33/62 ,  H01L25/075 ,  H05K1/00 ,  H01L33/42

    CPC分类号： H01L25/0753 ,  H01L33/42 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/00 ,  H01L2924/00

    摘要： Relatively small, electrically isolated segments of LED light sheets are fabricated having an anode terminal and a cathode terminal. The segments contain microscopic printed LEDs that are connected in parallel by two conductive layers sandwiching the LEDs. The top conductive layer is transparent. Separately formed from the light sheet segments is a flexible, large area conductor backplane having a single layer or multiple layers of solid metal strips (traces). The segments are laminated over the backplane's metal pattern to supply power to the segment terminals. An adhesive layer secures the segments to the backplane. The metal pattern may connect the segments in series, or parallel, or form an addressable circuit for a display. The segments may be on a common substrate or physically separated from each other prior to the lamination.

    摘要翻译： 制造具有阳极端子和阴极端子的相对小的电隔​​离的LED光片段。 这些段包含通过夹持LED的两个导电层并联连接的微观印刷的LED。 顶层导电层是透明的。 与光片段分开形成的是具有单层或多层固体金属条（迹线）的柔性大面积导体背板。 片段层叠在背板的金属图案上以向片段端子供电。 粘合剂层将片段固定到背板。 金属图案可以将片段串联或并联连接，或形成用于显示器的可寻址电路。 片段可以在共同的衬底上，或在层压之前彼此物理分离。

    Security label using printed LEDs
    5.
    发明授权
    Security label using printed LEDs 有权
    使用打印的LED的安全标签

    公开(公告)号：US09443180B2

    公开(公告)日：2016-09-13

    申请号：US14546846

    申请日：2014-11-18

    申请人： Nthdegree Technologies Worldwide Inc.

    发明人： Mark David Lowenthal

    IPC分类号： G06F17/00 ,  G06K19/06 ,  G06K7/10 ,  G06K19/08

    CPC分类号： G06K19/06112 ,  G06K7/10821 ,  G06K19/06037 ,  G06K19/086

    摘要： In one embodiment, a security label comprises a random arrangement of printed LEDs. During fabrication of the label, the LEDs are energized, and the resulting dot pattern is converted into a unique digital first code and stored in a database. The label is then attached to an object to be later authenticated, or the LEDs are printed directly on the object, such as a passport, license, bank note, certificate, etc. For authenticating the object, the LEDs are energized and the dot pattern is converted into a code. The code is compared to the first code stored in the database. If there is a match, the object is authenticated. The label may also have a printed second code associated with the first code, and both codes must match codes stored in the database for authentication. The general shape of the printed pattern may convey the proper orientation of the pattern.

    摘要翻译： 在一个实施例中，安全标签包括印刷的LED的随机排列。 在制造标签期间，LED被激励，并且所得到的点图案被转换成唯一的数字第一代码并存储在数据库中。 然后将标签附着到待认证的对象上，或者将LED直接打印在对象上，例如护照，许可证，纸币，证书等。为了认证对象，LED被激活，点图案 被转换成代码。 将代码与存储在数据库中的第一个代码进行比较。 如果有匹配，则对象进行身份验证。 标签还可以具有与第一代码相关联的打印的第二代码，并且两个代码必须匹配存储在数据库中的代码以进行认证。 印刷图案的一般形状可以传达图案的正确取向。

    Bonding transistor wafer to LED wafer to form active LED modules
    9.
    发明授权
    Bonding transistor wafer to LED wafer to form active LED modules 有权
    将晶体管晶圆连接到LED晶圆上，形成有源LED模块

    公开(公告)号：US09196606B2

    公开(公告)日：2015-11-24

    申请号：US14207047

    申请日：2014-03-12

    申请人： Nthdegree Technologies Worldwide Inc.

    发明人： Bradley S. Oraw

    IPC分类号： H01L29/15 ,  H01L21/00 ,  H01L25/16 ,  H01L33/00

    CPC分类号： H01L25/167 ,  H01L33/0079 ,  H01L2924/0002 ,  H01L2924/00

    摘要： LED modules are disclosed having a control MOSFET, or other transistor, in series with an LED. In one embodiment, a MOSFET wafer, containing an array of vertical MOSFETS, is aligned and bonded to an LED wafer, containing a corresponding array of vertical LEDs, and singulated to form thousands of active 3-terminal LED modules with the same footprint as a single LED. Despite the different forward voltages of red, green, and blue LEDs, RGB modules may be connected in parallel and their control voltages staggered at 60 Hz or greater to generate a single perceived color, such as white. The RGB modules may be connected in a panel for general illumination or for a color display.

    摘要翻译： 公开了具有与LED串联的控制MOSFET或其它晶体管的LED模块。 在一个实施例中，包含垂直MOSFETS阵列的MOSFET晶片被对准并结合到包含相应阵列的垂直LED的LED晶片上，并被单个化以形成数千个具有相同占空比的有源3端子LED模块 单个LED。 尽管红色，绿色和蓝色LED的正向电压不同，但是RGB模块可能并联连接，并且其控制电压以60Hz或更大的方式交错，以产生单个感知颜色，例如白色。 RGB模块可以连接在用于一般照明或彩色显示的面板中。

    Vertically printing LEDs in series
    10.
    发明授权
    Vertically printing LEDs in series 有权
    垂直打印LED串联

    公开(公告)号：US09142535B2

    公开(公告)日：2015-09-22

    申请号：US14150199

    申请日：2014-01-08

    申请人： Nthdegree Technologies Worldwide Inc.

    发明人： Bradley Steven Oraw

    IPC分类号： H01L33/00 ,  H01L25/075 ,  H01L33/38 ,  H01L33/42 ,  H01L33/44

    CPC分类号： H01L25/0756 ,  H01L21/568 ,  H01L33/387 ,  H01L33/42 ,  H01L33/44 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00

    摘要： A first layer of first vertical light emitting diodes (VLEDs) is printed on a conductor surface. A first transparent conductor layer is deposited over the first VLEDs to electrically contact top electrodes of the first VLEDs. A second layer of second VLEDs is printed on the first transparent conductor layer. Since the VLEDs are printed as an ink, the second VLEDs are not vertically aligned with the first VLEDs, so light from the first VLEDs is not substantially blocked by the second VLEDs when the VLEDs are turned on. A second transparent conductor layer is deposited over the second VLEDs to electrically contact top electrodes of the second VLEDs. By this structure, the first VLEDs are connected in parallel, the second VLEDs are connected in parallel, and the first layer of first VLEDs and the second layer of second VLEDs are connected in series by the first transparent conductor layer.

    摘要翻译： 第一层第一垂直发光二极管（VLED）印在导体表面上。 在第一VLED上沉积第一透明导体层以电接触第一VLED的顶部电极。 在第一透明导体层上印刷第二层第二VLED。 由于VLED被印刷为墨水，所以第二VLED不与第一VLED垂直对准，因此当VLED被打开时，来自第一VLED的光基本上被第二VLED阻挡。 在第二VLED上沉积第二透明导体层以电接触第二VLED的顶部电极。 通过这种结构，第一VLED并联连接，第二VLED并联连接，第一VLED的第一层和第二VLED的第二层通过第一透明导体层串联连接。