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公开(公告)号：US20230352842A1
公开(公告)日：2023-11-02
申请号：US18141657
申请日：2023-05-01
申请人： Swisscom AG
发明人： Nima Jamaly
摘要： Methods and systems are provided for implementing and utilizing dual-polarized planar ultra-wideband antennas. A planar antenna may include a substrate, a monopole conductor, a first ground conductor, and a second ground conductor. The monopole conductor is connected to a first signal feeding line. The first ground conductor is connected to ground potential. The first ground conductor is further connected to a second signal feeding line. The second ground conductor is connected to ground potential. The second ground conductor is located on a side of the substrate.
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公开(公告)号：US20230352837A1
公开(公告)日：2023-11-02
申请号：US17731478
申请日：2022-04-28
发明人： Kwai Man LUK , Jie SUN
CPC分类号： H01Q9/0407 , H01Q1/48
摘要： A patch antenna includes: a patch arrangement; a ground plane; a dielectric substrate disposed between the patch arrangement and the ground plane; and a feed mechanism for feeding the patch antenna. The patch arrangement comprises a substantially-transparent dielectric layer and a substantially-transparent electrically-conductive layer that at least partly overlap in plan view.
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公开(公告)号：US11799190B2
公开(公告)日：2023-10-24
申请号：US17673352
申请日：2022-02-16
发明人： Meysam Moallem , Ross Allan Kulak
CPC分类号： H01Q1/2283 , H01L23/3128 , H01L23/5383 , H01L23/5386 , H01L23/5389 , H01L23/66 , H01P3/08 , H01Q1/48 , H01L2223/6627 , H01L2223/6677 , H01L2223/6683
摘要： An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.
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公开(公告)号：US11791558B2
公开(公告)日：2023-10-17
申请号：US17409543
申请日：2021-08-23
发明人： Uriel Zvi Odes
摘要： An ultra wide band antenna includes a ground plane and an antenna body. The antenna body includes a planar portion arranged above and parallel to the ground plane. A first tapered portion extends in a perpendicular direction from a first edge of the planar portion towards the ground plane. A lower edge of the first tapered portion is spaced from the ground plane by a predetermined gap. A second tapered portion extends in a perpendicular direction from a second edge of the planar portion towards the ground plane and includes a first portion that is connected to the ground plane.
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公开(公告)号：US20230327338A1
公开(公告)日：2023-10-12
申请号：US18335181
申请日：2023-06-15
发明人： Natsumi MINAMITANI
CPC分类号： H01Q9/0407 , H01Q9/065 , H01Q1/48 , H01Q21/24
摘要： An antenna module includes a dielectric substrate, radiating elements disposed in or on the dielectric substrate, and a dielectric layer. The radiating element is disposed next to the radiating element in a plan view seen from the direction normal to the dielectric substrate. The dielectric layer is disposed to cover the radiating element. The radiating element is a linear antenna. The dielectric constant of the dielectric layer is higher than the dielectric constant of the dielectric substrate. The thickness of the dielectric layer is smaller than the thickness of the dielectric substrate.
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公开(公告)号：US20230327333A1
公开(公告)日：2023-10-12
申请号：US18206580
申请日：2023-06-06
发明人： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
CPC分类号： H01Q1/523 , H01Q1/243 , H01Q5/378 , H01Q1/2283 , H01Q21/061 , H01Q1/48
摘要： A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.
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公开(公告)号：US11784396B2
公开(公告)日：2023-10-10
申请号：US17043219
申请日：2019-11-22
发明人： Kenichiro Kodama
摘要： An antenna and a wireless earbud are provided. The antenna includes: a metal plate; a first dielectric layer and a second dielectric layer disposed on different areas of the metal plate; a first antenna element isolated from the metal plate and configured to be electrically coupled with a ground terminal; and a second antenna element isolated from the metal plate and configured to be electrically coupled with a feeding terminal. The wireless earbud includes a housing, and at least a part of the housing is a metal plate.
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公开(公告)号：US20230299819A1
公开(公告)日：2023-09-21
申请号：US18302205
申请日：2023-04-18
IPC分类号： H04B7/0456 , H01Q1/48 , H01Q21/00 , H01Q9/04 , H01Q21/26
CPC分类号： H04B7/0456 , H01Q1/48 , H01Q9/045 , H01Q21/00 , H01Q21/26
摘要： An antenna includes: a dielectric plate provided with a first surface and a second surface; a ground plane located on the first surface; and an antenna unit. A size of the antenna unit is a preset length, the antenna unit includes at least three antenna elements in a ring arrangement, and each antenna element includes a first patch, a second patch, and a third patch that are located on the second surface, and three conductive portions that penetrate through the first surface and the second surface. A first conductive portion is electrically connected between a feeding portion and the first patch to form a monopole, a second conductive portion is electrically connected between the ground plane and the second patch to form a first parasitic body, a third conductive portion is electrically connected between the ground plane and the third patch to form a second parasitic body, and the first parasitic body and the second parasitic body are located on both sides of the monopole and are configured to isolate adjacent antenna elements in the ring arrangement.
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公开(公告)号：US11764475B2
公开(公告)日：2023-09-19
申请号：US17411038
申请日：2021-08-24
申请人： MEDIATEK INC.
发明人： Debapratim Dhara , Shih-Chia Chiu , Yen-Ju Lu , Sheng-Mou Lin
摘要： An antenna structure includes a radiative antenna element disposed in a first conductive layer and a reference ground plane, disposed in a second conductive layer under the first conductive layer. The radiative antenna element is loaded with a plurality of slots and is electrically connected to the reference ground plane through a plurality of vias, and the vias are placed along a first line of the radiative antenna element and the slots are placed along a second line perpendicular to the first line.
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公开(公告)号：US20230291116A1
公开(公告)日：2023-09-14
申请号：US18118838
申请日：2023-03-08
申请人： FCNT LIMITED
发明人： Yohei Koga
CPC分类号： H01Q13/106 , H01Q1/48 , H01Q1/243
摘要： An antenna device includes a metal layer for forming an antenna element in a predetermined planar shape and a ground arranged on a lower side of the metal layer. The metal layer forms a first metal forming the planar shape, a notch portion formed at the first metal, and cutting out a part of an edge of the planar shape, a second metal being an electromagnetic field coupling element arranged with a predetermined distance spaced from the first metal inside the notch portion, and a feeder line formed outside the planar shape, and to be connected with the second metal via an opening portion of the notch portion. For the second metal, a width at the opening portion is smaller than a maximum width at a portion more inside the notch portion than the opening portion.
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