公开(公告)号：US07751690B2

公开(公告)日：2010-07-06

申请号：US11115211

申请日：2005-04-27

Applicant: Mitsuya Kawashita ,  Osamu Okada ,  Nobuyuki Batou ,  Taku Yokawa ,  Yoshikazu Ueta ,  Hidenori Mitsunaga ,  Takashi Kouno

Inventor： Mitsuya Kawashita ,  Osamu Okada ,  Nobuyuki Batou ,  Taku Yokawa ,  Yoshikazu Ueta ,  Hidenori Mitsunaga ,  Takashi Kouno

IPC: H04N7/26

CPC classification number: G11B20/00007 ,  G11B27/034 ,  G11B27/329 ,  G11B27/34 ,  G11B2020/10675 ,  G11B2220/2545 ,  G11B2220/2562

Abstract: A recording and reproducing apparatus for reproducing information recorded on a recording medium concurrently while recording the information, includes a compression section, a temporary storage section, a reproducing process section, and a storage section. The compression section reads the information recorded on the recording medium and compresses read information. The temporary storage section stores compressed information provided by the compression process. The reproducing process section decompresses the compressed information output thereto from the temporary storage section and reproduces decompressed information. The storage section stores the compressed information output thereto from the temporary storage section.

Abstract translation: 一种用于在记录信息的同时再现记录在记录介质上的信息的记录和再现装置，包括压缩部分，临时存储部分，再现处理部分和存储部分。 压缩部分读取记录在记录介质上的信息并压缩读取信息。 临时存储部存储由压缩处理提供的压缩信息。 再现处理部将从临时存储部输出的压缩信息解压缩，再现解压缩信息。 存储部存储从临时存储部输出的压缩信息。

公开(公告)号：US07690624B2

公开(公告)日：2010-04-06

申请号：US11816580

申请日：2005-06-06

Applicant: Haruo Ito ,  Susumu Watanabe ,  Osamu Okada

Inventor： Haruo Ito ,  Susumu Watanabe ,  Osamu Okada

IPC: F16K31/02

CPC classification number: F16K31/54 ,  F16B39/16 ,  F16K3/0254 ,  Y10T74/19702

Abstract: A valve drive device which can prevent a locknut fixing a stem nut to a drive sleeve from getting loosened. The valve drive device comprises: the stem nut for screwing a valve stem thereinto; the drive sleeve engaging with a male spline formed on a peripheral outer surface of said stem nut, said drive sleeve including a worm gear on a peripheral outer surface thereof; a worm in meshing engagement with said worm gear; and a housing that supports said drive sleeve by bearings. The valve drive device further comprises: a stem nut fastening member having a first male screw that engages with a female screw provided on a peripheral inner surface of said drive sleeve; and a locknut that engages with a second male screw provided on a reduced diameter portion of said stem nut fastening member, said second male screw having a reverse screw thread relative to said first male screw, so that no slack may arise between said stem nut fastening member and said drive sleeve.

Abstract translation: 一种能够防止将螺母固定在驱动套筒上的锁紧螺母的阀驱动装置被松动。 阀驱动装置包括：用于将阀杆旋入其中的杆螺母; 所述驱动套筒与形成在所述杆螺母的周边外表面上的外花键接合，所述驱动套筒在其周边外表面上包括蜗轮; 与所述蜗轮啮合的蜗杆; 以及通过轴承支撑所述驱动套筒的壳体。 阀驱动装置还包括：杆螺母紧固构件，其具有与设置在所述驱动套筒的周向内表面上的内螺纹接合的第一外螺纹螺钉; 以及与设置在所述杆螺母紧固构件的直径减小的部分上的第二外螺纹接合的锁紧螺母，所述第二外螺纹相对于所述第一外螺纹具有反螺纹，使得在所述杆螺母紧固件 会员和驱动套筒。

公开(公告)号：US20100019371A1

公开(公告)日：2010-01-28

申请号：US12507188

申请日：2009-07-22

Applicant: Junji SHIOTA ,  Talsuke Koroku ,  Nobumitsu Fujii ,  Osamu Kuwabara ,  Osamu Okada

Inventor： Junji SHIOTA ,  Talsuke Koroku ,  Nobumitsu Fujii ,  Osamu Kuwabara ,  Osamu Okada

IPC: H01L23/48 ,  H01L21/78

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/02331 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00014

Abstract: In this manufacturing method of a semiconductor device, after a sealing film is applied over an entire surface of a semiconductor wafer and hardened, a second groove for forming a side-section protective film is formed in the sealing film and on the top surface side of the semiconductor wafer. In other words, the sealing film is formed in a state where a groove that causes strength reduction has not been formed on the top surface side of the semiconductor wafer. Since the second groove is formed on the top surface side of the semiconductor wafer after the sealing film is formed, the semiconductor wafer is less likely to warp when the sealing film, made of liquid resin, is hardened.

Abstract translation: 在这种半导体装置的制造方法中，在半导体晶片的整个表面上施加了密封膜并硬化后，在密封膜中形成用于形成侧部保护膜的第二沟槽，并且在顶部表面侧 半导体晶片。 换句话说，密封膜形成为在半导体晶片的顶面侧未形成导致强度降低的槽的状态。 由于在形成密封膜之后在半导体晶片的顶表面侧形成第二凹槽，所以当由液体树脂制成的密封膜硬化时，半导体晶片不太可能翘曲。

公开(公告)号：US20070267743A1

公开(公告)日：2007-11-22

申请号：US11638717

申请日：2006-12-14

Applicant: Aiko Mizusawa ,  Osamu Okada ,  Takeshi Wakabayashi

Inventor： Aiko Mizusawa ,  Osamu Okada ,  Takeshi Wakabayashi

IPC: H01L23/48

CPC classification number: H01L23/525 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/5329 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/02331 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/18301 ,  H01L2924/30105

Abstract: A semiconductor device includes a semiconductor substrate and low dielectric film wiring line laminated structure portions which are provided in regions on the semiconductor substrate except a peripheral portion thereof. Each of the laminated structure portions has a laminated structure of low dielectric films and a plurality of wiring lines. An insulating film is provided on an upper side of the laminated structure portion. Connection pad portions for electrodes are arranged on the insulating film to be electrically connected to the connection pad portions of uppermost wiring lines of the laminated structure portion. Bump electrodes for external connection are provided on the connection pad portions for the electrodes. A sealing film is provided on the insulating film and on the peripheral portion of the semiconductor substrate. Side surfaces of the laminated structure portions are covered with the insulating film or the sealing film.

Abstract translation: 半导体器件包括半导体衬底和低电介质膜布线层叠结构部分，它们设置在除了其周边部分之外的半导体衬底上的区域中。 各层叠结构部分具有低电介质膜和多条布线的叠层结构。 绝缘膜设置在层叠结构部的上侧。 用于电极的连接焊盘部分布置在绝缘膜上以电连接到层叠结构部分的最上布线的连接焊盘部分。 用于外部连接的凸起电极设置在用于电极的连接焊盘部分上。 在绝缘膜上和半导体衬底的周边部分上设置密封膜。 层叠结构部分的侧表面被绝缘膜或密封膜覆盖。

公开(公告)号：US07256496B2

公开(公告)日：2007-08-14

申请号：US11143293

申请日：2005-06-01

Applicant: Osamu Okada ,  Hiroyasu Jobetto

Inventor： Osamu Okada ,  Hiroyasu Jobetto

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1147 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.

Abstract translation: 一种半导体器件包括至少一个半导体构造体，其设置在基底构件的一侧，并且具有半导体衬底和设置在半导体衬底上的多个外部连接电极。 绝缘层设置在半导体构造体周围的基底构件的一侧。 在绝缘层和半导体构造体周围的半导体构造体和基体构件中的至少一个之间形成粘合增加膜，用于防止绝缘层与半导体构造体和基底构件中的至少一个之间的剥离 。

公开(公告)号：US20050269698A1

公开(公告)日：2005-12-08

申请号：US11143293

申请日：2005-06-01

Applicant: Osamu Okada ,  Hiroyasu Jobetto

Inventor： Osamu Okada ,  Hiroyasu Jobetto

IPC: H01L23/12 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1147 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.

Abstract translation: 一种半导体器件包括至少一个半导体构造体，其设置在基底构件的一侧，并且具有半导体衬底和设置在半导体衬底上的多个外部连接电极。 绝缘层设置在半导体构造体周围的基底构件的一侧。 在绝缘层和半导体构造体周围的半导体构造体和基体构件中的至少一个之间形成粘合增加膜，用于防止绝缘层与半导体构造体和基底构件中的至少一个之间的剥离 。

公开(公告)号：US20050259535A1

公开(公告)日：2005-11-24

申请号：US11136177

申请日：2005-05-23

Applicant: Hidenori Mitsunaga ,  Takashi Kouno ,  Osamu Okada ,  Mitsuya Kawashita

Inventor： Hidenori Mitsunaga ,  Takashi Kouno ,  Osamu Okada ,  Mitsuya Kawashita

IPC: G11B5/09 ,  G11B5/86 ,  G11B20/10

CPC classification number: G11B20/10 ,  G11B5/86

Abstract: An information reproduction and recording apparatus able to prevent invalid data not required for recording from being recorded on a recording medium when transferring reproduced information by a small number of signal lines such as a three-line serial peripheral interface, wherein a music data reproducing unit outputs a data signal DATA and clock signals LRCK and BCK to a valid recording period control unit and outputs a SPACE signal to the valid recording period control unit while outputting music data containing track interval data, the signals are transferred to a high speed encoder and the data signal DATA is encoded and recorded on a hard disk by an HDD based on the clock signals LRCK and BCK while the SPACE signal is being output, and the valid recording period control unit suspends transfer of the clock signal LRCK and prevents recording of invalid data on the hard disk while the SPACE signal is not being output.

Abstract translation: 一种信息再现和记录装置，当通过少量的诸如三线串行外围接口的信号线传送再现信息时，能够防止无需记录的无效数据被记录在记录介质上，其中音乐数据再现单元输出 数据信号DATA和时钟信号LRCK和BCK输出到有效的记录周期控制单元，并在输出包含轨道间隔数据的音乐数据的同时向有效记录周期控制单元输出空间信号，该信号被传送到高速编码器，数据 当输出SPACE信号时，信号DATA由HDD根据时钟信号LRCK和BCK被编码并记录在硬盘上，并且有效的记录周期控制单元暂停时钟信号LRCK的传送并防止无效数据的记录 在SPACE信号未被输出时硬盘。

公开(公告)号：US06913738B1

公开(公告)日：2005-07-05

申请号：US09914994

申请日：1999-03-05

Applicant: Mitsuaki Echigo ,  Minoru Suzuki ,  Osamu Okada

Inventor： Mitsuaki Echigo ,  Minoru Suzuki ,  Osamu Okada

IPC: B01J23/40 ,  B01J23/755 ,  C01B3/38 ,  C01B3/58 ,  C10K3/04 ,  H01M8/04 ,  H01M8/06

CPC classification number: H01M8/0662 ,  B01D2257/502 ,  C01B3/583 ,  C01B3/586 ,  C01B2203/044 ,  C01B2203/0445 ,  C01B2203/047 ,  C10K3/04

Abstract: The object of the present invention is to obtain a carbon-monoxide removing technique capable of very effectively reducing/removing carbon monoxide present at one thousand of ppm to several % in a hydrogen-rich treatment-object gas such as a reformed gas obtained by reforming of a fuel such as natural gas, methanol, etc. to a concentration of several tens of ppm (preferably 10 ppm) or lower without excessive loss of hydrogen, even when carbon dioxide, methane are co-existent For accomplishing this object, there are provided two stages of CO removers for removing carbon monoxide from a hydrogen-containing treatment-object gas, the first-stage CO remover removing a portion of the carbon monoxide by methanation thereof through a catalyst reaction, the second-stage CO remover removing the remaining portion of the carbon monoxide mainly by oxidation thereof through a further catalyst reaction involving addition of an oxidizing agent.

Abstract translation: 本发明的目的是获得一种一氧化碳去除技术，其能够非常有效地减少/除去在富含氢气的处理对象气体中以一千ppm至几％存在的一氧化碳，例如通过重整获得的重整气体 的燃料如天然气，甲醇等至几十ppm（优选10ppm）或更低的浓度，即使在二氧化碳，甲烷共存的情况下，也不会过多地损失氢气。为了实现该目的， 提供了两个阶段的CO去除剂，用于从含氢处理对象气体中除去一氧化碳，第一阶段CO去除剂通过催化剂反应除甲烷化除去一部分一氧化碳，第二阶段CO去除剂除去剩余的 一氧化碳的一部分主要是通过进一步的催化剂反应而氧化，包括加入氧化剂。

公开(公告)号：US06219511B1

公开(公告)日：2001-04-17

申请号：US08998535

申请日：1997-12-26

Applicant: Osamu Okada

Inventor： Osamu Okada

IPC: G03G1530

CPC classification number: G03G15/605 ,  G03G15/60 ,  H04N1/0057 ,  H04N1/00588 ,  H04N1/00602 ,  H04N1/121

Abstract: An image reading apparatus has a reader to read document images and has a stationary image reading position. A transporter transports a document at constant speed onto the image reading position. The transporter includes a guide member and a transport member. The guide member guides document transport and is provided adjacent to the upstream side of the document reading position in the direction of document transport by the transporter. The transport member transports a document with gripping between the guide member and itself. The transport member is provided above the guide member.

Abstract translation: 图像读取装置具有读取文件图像并具有静止图像读取位置的读取器。 运输机将文件以恒定速度运送到图像读取位置。 运送器包括导向件和运送件。 引导构件引导文件传送，并且在传送器的文件传送方向上靠近文档读取位置的上游侧设置。 运输构件在引导构件和其本身之间传送具有夹持物的文件。 传送构件设置在引导构件的上方。

公开(公告)号：US5993679A

公开(公告)日：1999-11-30

申请号：US72559

申请日：1998-05-05

Applicant: Tomoaki Koide ,  Akiko Kobayashi ,  Ko Sang Tae ,  Atsushi Sekiguchi ,  Osamu Okada

Inventor： Tomoaki Koide ,  Akiko Kobayashi ,  Ko Sang Tae ,  Atsushi Sekiguchi ,  Osamu Okada

IPC: C23C16/44 ,  C23C16/455 ,  C23G5/00 ,  C23F1/02

CPC classification number: C23C16/45572 ,  C23C16/4405 ,  C23C16/4557 ,  C23G5/00

Abstract: A method of cleaning metallic films built up within a thin film deposition apparatus is disclosed. The method includes an oxidation step to oxidize the metallic film and produce a film of the oxide thereof, a complexing step to complex the oxide film and produce a complex thereof, and a sublimation step to sublimate the complex. The conditions of these cleaning steps are set so that the oxidation step is the rate-determining step.

Abstract translation: 公开了一种清洗在薄膜沉积设备内构建的金属膜的方法。 该方法包括氧化步骤以氧化金属膜并产生其氧化物的膜，使复合氧化膜并产生其复合物的络合步骤和升华步骤使复合物升华。 这些清洗步骤的条件被设定为氧化步骤是速率确定步骤。