Abstract:
N-channel power semiconductor devices in which an insulated field plate is coupled to the drift region, and immobile electrostatic charge is also present at the interface between the drift region and the insulation around the field plate. The electrostatic charge permits OFF-state voltage drop to occur near the source region, in addition to the voltage drop which occurs near the drain region (due to the presence of the field plate).
Abstract:
A method separates a print job into a print product and a sequence of tasks. The method estimates a time to setup a machine before executing a task and a time for the machine to execute the task. Machines are identified that have a potential bottleneck due to multiple concurrent printing requests being made to a machine. A workflow sequence is generated to complete the print job.
Abstract:
MOS-gated devices, related methods, and systems for vertical power and RF devices including an insulated trench and a gate electrode. A body region is positioned so that a voltage bias on the gate electrode will cause an inversion layer in the body region. Permanent electrostatic charges are included in said insulation material. A conductive shield layer is positioned above the insulated trench, to reduce parasitic capacitances.
Abstract:
A print head (20, 220) includes a diaphragm (26) opposite a fluid chamber (21) having a side opening, a first end and a second end. The print head (20, 220) further includes a support (30, 32, 300, 302, 310, 312, 320, 322) extending from a floor (52) of the fluid chamber (21) to the diaphragm (26).
Abstract:
Power devices using refilled trenches with permanent charge at or near their sidewalls. These trenches extend vertically into a drift region.
Abstract:
A vertical device structure includes a volume of semiconductor material, laterally adjoining a trench having insulating material on sidewalls thereof. A gate electrode within the trench is capacitively coupled through the insulating material to a first portion of the semiconducting material. Some portions of the insulating material contain fixed electrostatic charge in a density high enough to invert a second portion of the semiconductor material when no voltage is applied. The inverted portions can be used as induced source or drain extensions, to assure that parasitic are reduced without increasing on-resistance.
Abstract:
Vertical power devices which include an insulated trench containing insulating material and a gate electrode, and related methods. A body region is positioned so that a voltage bias on the gate electrode will cause an inversion layer in the body region. A layer of permanent charge, at or near the sidewall of the trench, provides charge balancing for the space charge in the depleted semiconductor material during the OFF state. A conductive shield layer is positioned below the gate electrode in the insulating material, and reduces capacitive coupling between the gate and the lower part of the trench. This reduces switching losses. In other embodiments, a planar gate electrode controls horizontal carrier injection into the vertical conduction pathway along the trench, while a shield plate lies over the trench itself to reduce capacitive coupling.
Abstract:
The present disclosure relates to a compound comprising at least one of a carbon or an oxygen isotope and a process for preparing the compound. The process comprises irradiating a compound comprising at least one of a carbon or an oxygen atom using photons or particles having an energy in the range of 20 MeV-430 MeV. The carbon and/or the oxygen atom is then allowed to be converted into a carbon and/or an oxygen positron nuclide through a photonuclear reaction. Provided that the molecular structure of the compound is not disrupted, the compound comprising the carbon and/or the oxygen isotope is prepared. The compound may be used in positron and/or other nuclide imaging to obtain a distribution and/or metabolic image of the compound in a human and/or animal body.
Abstract:
Controlled job release in print manufacturing is disclosed. An exemplary method includes stochastically receiving a plurality of print jobs in a job buffer. The method also includes analyzing factory management parameters. The method also includes generating automated control parameters based on the print jobs in the job buffer and the analyzed factory management parameters. The method also includes releasing the print jobs from the job buffer in a controlled manner using the automated control parameters.
Abstract:
Improved highly reliable power RFP structures and fabrication and operation processes. The structure includes plurality of localized dopant concentrated zones beneath the trenches of RFPs, either floating or extending and merging with the body layer of the MOSFET or connecting with the source layer through a region of vertical doped region. This local dopant zone decreases the minority carrier injection efficiency of the body diode of the device and alters the electric field distribution during the body diode reverse recovery.