Abstract:
Bilayer platelet fillers are employed to compensate for a positive coefficient of thermal expansion (CTE) of an embedding polymeric material, or even to provide a composite structure having a negative CTE to eliminate or alleviate thermomechanical stress and/or delamination during thermal cycling. A bilayer platelet includes two joined layers having different CTEs. The CTE mismatch induces bending of the bilayer platelets, thereby causing cavities at temperatures lower than the joining temperature at which the bilayers are joined. The decrease in the volume of the polymeric material and the bilayer platelets at low temperatures is compensated by an accompanying increase in the volume of the cavities so that the composite structure has a temperature independent volume, a low net CTE, or even a negative CTE.
Abstract:
Disclosed is a resin material for optical purposes, which has high light permeability and high refractive index stability against temperature variation. Also disclosed is an optical element utilizing the resin material. The resin material for optical purposes comprises a curable resin and an inorganic microparticle comprising two or more metal oxides having different refractive indexes and dispersed in the curable resin, wherein the inorganic microparticle has a refractive index distribution, has the surface treated with a surface-treating agent, and is at least partially modified with a surface-modifying agent having a polymerizable functional group, and wherein the refractive index of the curable resin after being cured (nh) and the refractive index of the inorganic microparticle (ng) meet the requirement represented by the formula (1).
Abstract:
Nanoparticle assemblies comprising a plurality of nanoparticles and an amphiphilic polymer, and methods for making and using the nanoparticle assemblies.
Abstract:
A cured, shaped dielectric component, including a crosslinked product of a composite comprising a thermoplastic polymer, an optional crosslinking co-agent, an optional cure initiator, an optional additive composition, and a ceramic filler composition; wherein the cured, shaped dielectric component has a permittivity of 1.1 to 20 at 10 GHz; and wherein the cured, shaped dielectric component has no melt flow index when tested at 190° C., 2.16 kg, in accordance with ASTM D1238-20.
Abstract:
In one aspect of the present disclosure, there is provided a low-density curable composition precursor, comprising (a) a first part (A) comprising: (i) at least one polymeric diamine; (b) a second part (B) comprising: (i) at least one epoxy resin; (ii) at least one reactive diluent; (iii) at least one amide selected from polyamide waxes; wherein part (A) and/or part (B) comprise a low density filler material having a density of less than 0.3 g/cc; and wherein the curable composition obtained by combining part (A) and part (B) has a cured density according to DIN 53479A of less than 0.5 g/cc.
Abstract:
A resin composition including: 100 parts by mass of a thermoplastic resin (A) having a density, a MFR, and durometer A hardness falling within certain ranges; 10 to 100 parts by mass of a heat storage compound (B) having a flash point of 200° C. or higher; and 1.5 to 20 parts by mass of a porous inorganic compound (C) having an oil absorption of 4.0 g/g or more, in which the content of the heat storage compound (B) is less than 700 parts by mass based on the content of the porous inorganic compound (C) of 100 parts by mass.
Abstract:
The present invention is applicable to a field of a substrate for a high-frequency circuit, and relates, for example, to a composite polyimide film, a producing method thereof, and a printed circuit board using the same. More specifically, the composite polyimide film includes a film matrix including polyimide; and a plurality of filler particles dispersed in the film matrix, wherein each of the filler particles includes an inorganic particle, and a fluorine polymer coating formed on the inorganic particle.
Abstract:
A composite structure comprising a resinous component that is adhered to a surface of a metal component is provided. The resinous component is formed from a polymer composition that comprises a polyarylene sulfide, inorganic fibers, and an impact modifier. The inorganic fibers have an aspect ratio of from about 1.5 to about 10.
Abstract:
An earth plant-based compostable biodegradable composition for the formation of a bioplastic and method of producing said resin, the composition comprising: about 17.5 to 45% ethanol-based green polyethylene by weight, about 20 to 25% calcium carbonate by weight, about 2 to 12% hemp hurd or soy protein by weight, about 32 to 45% starch by weight, and about 0.5 to 1% biodegradation additive by weight to enable biodegradation and composting of the bioplastic; wherein the composition is produced by first mill grinding the ethanol-based green polyethylene, calcium carbonate, hemp hurd or soy protein, starch and the biodegradation additive into fine powders, then mechanically mixing the fine powders one by one into a final mixture for about 5-25 minutes at a time, dry and without heat, and then heating the final mixture to about 220 to 430 degrees Fahrenheit.
Abstract:
The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition:
from 1 to 10 wt. %, of a) at least one oxetane compound according to Formula (I) below:
wherein: R1, R2, R3, R5 and R6 are independently selected from H and C1-C6 alkyl;
R4 is —(CH2)mX; m is 0 or 1; X is C1-C6 alkyl, C1-C6 alkoxy, C1-C6 hydroxyalkyl, C6-C18 aryl, C6-C18 aryloxy, C7-C18 aralkyl, C7-C18 aralkoxy or is represented by the formula:
each R7 is independently a C1-C12 alkylene group, C2-C12 alkenylene group, C6-C18 arylene, C7-C18 alkarylene, C7-C18 aralkylene or a poly(C1-C6alkyleneoxy) group; R8 is H, C1-C6 alkyl, C1-C6 hydroxyalkyl, C6-C18 aryl or C7-C18 aralkyl; and, n is an integer of from 1 to 3;
from 5 to 20 wt. % of b) at least one epoxide compound, wherein part b) is characterized in that at least 50 wt. % of the total weight of epoxide compounds is constituted by b1) at one cycloaliphatic epoxide; from 0.1 to 5 wt. % of c) at least one ionic photoacid generator; from 0.1 to 5 wt. % of d) at least one free radical photoinitiator; and, from 50 to 90 wt. % of e) particulate filler.