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    Projection exposure apparatus and method
    71.
    发明授权
    Projection exposure apparatus and method 失效

    公开(公告)号：US06639732B2

    公开(公告)日：2003-10-28

    申请号：US10310780

    申请日：2002-12-06

    Applicant: Yasuhiro Omura ,  Tetsuo Takahashi ,  Masatoshi Ikeda ,  Shiwen Li

    Inventor： Yasuhiro Omura ,  Tetsuo Takahashi ,  Masatoshi Ikeda ,  Shiwen Li

    IPC: G02B1700

    CPC classification number: G02B17/0892 ,  G02B13/143 ,  G02B17/08 ,  G03F7/70225 ,  G03F7/70275 ,  G03F7/70808 ,  G03F7/70825 ,  G03F7/70833

    Abstract: The present invention relates to a projection exposure apparatus (10) for and method of imaging a reticle (R) having patterned surface onto a substrate (W) in photolithographic processes for manufacturing a variety of devices. The invention further relates to an optical system (C) having a folding member (M1) suited to the projection exposure apparatus, and a method for manufacturing the optical system. The projection exposure apparatus comprises an illumination optical system (IS) and a reticle stage (RS) capable of holding the reticle so the normal line to its patterned surface is in the direction of gravity. The apparatus also includes a substrate stage (WS) capable of holding the substrate with its surface normal parallel to the direction of gravity. The optical system includes a first imaging optical system (A) comprising a concave reflecting mirror and a dioptric optical member arranged along a first optical axis. The first imaging optical system (A) forms an intermediate image of the patterned surface. The optical system also includes a second imaging optical system (B) having a second optical axis, and forms a reduced image of the intermediate image on the substrate. The first folding member is arranged in the optical path from the first imaging optical system to the second imaging optical system. The first and second imaging optical systems and the first and second folding members are positioned so that a reduced image of the pattered surface is formed parallel to the pattern surface of the reticle, and the first and second optical axes are positioned so that they are substantially parallel to the direction of gravity.

    Semiconductor device having a sense electrode
    72.
    发明授权
    Semiconductor device having a sense electrode 有权
    具有感测电极的半导体器件

    公开(公告)号：US06188109B1

    公开(公告)日：2001-02-13

    申请号：US09212263

    申请日：1998-12-16

    Applicant: Tetsuo Takahashi

    Inventor： Tetsuo Takahashi

    IPC: H01L2362

    CPC classification number: H01L29/66348 ,  H01L22/34 ,  H01L27/0248 ,  H01L27/0629 ,  H01L29/7397 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A buried sense electrode (8) having the same structure as that of a buried gate electrode (7) is provided in an n− layer (3) of an IGBT with a sense oxide film (10) interposed therebetween. The buried sense electrode (8) senses an electric potential of the n− layer (3). If an electric potential sensed by the buried sense electrode (8) is increased to exceed a gate threshold voltage of a MOSFET (21) having an n+ drain region (22), a p well region (23) and an n+ source region (24), the MOSFET (21) is turned ON. At this time, a gate voltage applied across a gate electrode (13) and an emitter electrode (11) of the IGBT is reduced to a value obtained by a sum of an ON-state voltage of the MOSFET (21), a breakdown voltage of a Zener diode (16) having an n+ cathode region (17) and a p+ anode region (18), and a forward voltage of a diode (19) having the p+ anode region (18) and an n+ cathode region (20). As a result, various abnormalities such as overvoltage abnormalities as well as overcurrent abnormalities are detected.

    Abstract translation: 具有与埋入栅电极（7）相同结构的掩埋感测电极（8）设置在IGBT的n层（3）中，其间插入有感应氧化膜（10）。 掩埋感测电极（8）感测n层（3）的电位。 如果掩埋感测电极（8）感测到的电位增加到超过具有n +漏极区域（22），p阱区域（23）和n +源极区域（24）的MOSFET（21）的栅极阈值电压， ，MOSFET（21）导通。 此时，施加在栅极电极（13）和IGBT的发射极（11）两端的栅极电压降低到通过MOSFET（21）的导通电压之和获得的值，击穿电压 具有n +阴极区域（17）和p +阳极区域（18）的齐纳二极管（16）和具有p +阳极区域（18）和n +阴极区域（20）的二极管（19）的正向电压， 。 结果，检测到过电压异常以及过电流异常等各种异常。

    Catadioptric optical system and adjusting method
    75.
    发明授权
    Catadioptric optical system and adjusting method 失效
    反射折射光学系统和调节方法

    公开(公告)号：US5835284A

    公开(公告)日：1998-11-10

    申请号：US882939

    申请日：1997-06-26

    Applicant: Tetsuo Takahashi ,  Yasuhiro Omura

    Inventor： Tetsuo Takahashi ,  Yasuhiro Omura

    IPC: G02B17/08 ,  G03F7/20 ,  H01L21/027

    CPC classification number: G02B17/0892 ,  G02B17/08 ,  G03F7/70225 ,  G03F7/70275

    Abstract: A catadioptric optical system in which a first imaging optical system is constructed of a unidirectional optical apparatus which transmits outgoing light from a first plane in one direction only and a bidirectional optical apparatus for transmitting the light that enters and reflecting the same to form an interim image of the first plane. A light guide guides the light from the interim image to a second imaging optical system through which the interim image is reimaged on a second plane. The unidirectional optical apparatus has an optical axis and at least one lens movable along the optical axis.

    Abstract translation: 一种反折射光学系统，其中第一成像光学系统由仅在一个方向上传输来自第一平面的出射光的单向光学装置和用于透射进入并反射其的光的双向光学装置形成临时图像 的第一架飞机。 光引导件将来自中间图像的光引导到第二成像光学系统，通过该第二成像光学系统在第二平面上再次成像临时图像。 单向光学装置具有光轴和至少一个可沿光轴移动的透镜。

    Apparatus for clean transfer of objects
    76.
    发明授权
    Apparatus for clean transfer of objects 失效
    用于清洁物体传送的装置

    公开(公告)号：US5364219A

    公开(公告)日：1994-11-15

    申请号：US902720

    申请日：1992-06-23

    Applicant: Tetsuo Takahashi ,  Eisaku Miyauchi ,  Toshihiko Miyajima ,  Hideaki Watanabe

    Inventor： Tetsuo Takahashi ,  Eisaku Miyauchi ,  Toshihiko Miyajima ,  Hideaki Watanabe

    IPC: B25J19/00 ,  B65D85/86 ,  B65G47/52 ,  B65G49/00 ,  B65G49/07 ,  F24F7/06 ,  H01L21/673 ,  H01L21/677 ,  B65G65/00

    CPC classification number: H01L21/67724 ,  H01L21/67736 ,  H01L21/67772 ,  H01L21/67775 ,  Y10S414/139

    Abstract: A clean transfer system having a first vacuum chamber with a first transfer port, a first shutter for opening and closing the first transfer port and a first connecting member surrounding the first transfer port. The first connecting member is provided with at least an exterior portion. A second vaccum chamber includes a second transfer port, a second shutter for opening and closing the second transfer port, and a second connecting member surrounding the second transfer port. The second connecting member has at least an exterior portion. A closed space is formed between the first and second connecting members, so that the first and second shutters are movable within the closed space.

    Abstract translation: 一种清洁的传送系统，具有具有第一传送口的第一真空室，用于打开和关闭第一传送口的第一快门以及围绕第一传送口的第一连接部件。 第一连接构件设置有至少外部部分。 第二真空室包括第二输送口，用于打开和关闭第二输送口的第二闸门以及围绕第二输送口的第二连接构件。 第二连接构件至少具有外部部分。 在第一和第二连接构件之间形成封闭空间，使得第一和第二快门在封闭空间内是可移动的。

    Chip packaging means and supply mechanism for supplying chips by using the chip packaging means
    77.
    发明授权
    Chip packaging means and supply mechanism for supplying chips by using the chip packaging means 失效
    用于通过使用芯片封装装置供应芯片的芯片封装装置和供电机构

    公开(公告)号：US5143253A

    公开(公告)日：1992-09-01

    申请号：US402041

    申请日：1989-09-01

    Applicant: Kuniaki Takahashi ,  Koji Kudo ,  Tetsuo Takahashi

    Inventor： Kuniaki Takahashi ,  Koji Kudo ,  Tetsuo Takahashi

    IPC: B65G51/03 ,  H05K13/02

    CPC classification number: H05K13/027 ,  B65G51/03

    Abstract: A chip packaging casing for packing chips and also serving as a chip supply source comprises a substantially plate-like body having a spiral passageway formed in its interior, and a plurality of chips received in a row in the spiral passageway of the body. The plate-like body further has a chip-outlet formed therein as a continuation of the spiral passageway to communicate with the exterior of the body and at least one air-intake formed therein to communicate between the passageway and the exterior of the body. The air-intake is adapted to be connected to an air supply source and serves to facilitate the forwarding of the chips along the passageway toward the outlet to discharge the chips form the outlet. A chip supply mechanism is provided for supplying chips to a mounting head of an automatic chip mounting apparatus by using the chip packaging casing.

    Abstract translation: 用于包装芯片并且还用作芯片供应源的芯片封装壳体包括在其内部形成有螺旋形通道的基本上板状的主体，以及在主体的螺旋通道中并排接收的多个芯片。 板状体还具有形成在其中作为螺旋通道的延续部分的芯片出口，其与主体的外部连通并且形成在其中的至少一个进气口在主体的通道和外部之间连通。 进气口适于连接到空气供应源，并且用于促进沿着通道朝向出口排出切屑以从出口排出芯片。 提供了一种芯片供给机构，用于通过使用芯片封装壳体将芯片供应到自动芯片安装装置的安装头。

    Clean transfer method and system therefor
    78.
    发明授权
    Clean transfer method and system therefor 失效
    清洁方法及其系统

    公开(公告)号：US5139459A

    公开(公告)日：1992-08-18

    申请号：US662556

    申请日：1991-02-28

    Applicant: Tetsuo Takahashi ,  Eisaku Miyauchi ,  Toshihiko Miyajima

    Inventor： Tetsuo Takahashi ,  Eisaku Miyauchi ,  Toshihiko Miyajima

    IPC: B65D6/40 ,  B65G49/00 ,  B65G49/07 ,  C23C14/56 ,  H01L21/00 ,  H01L21/677

    CPC classification number: H01L21/67748 ,  H01L21/67126 ,  H01L21/67772 ,  H01L21/67775 ,  Y10S414/139

    Abstract: A clean transfer method capable of safely transferring a semiconductor or the like to various apparatus for treating the semiconductor while keeping the environment clean. In the method, the semiconductor is transferred between a vacuum clean box arranged in a clean room and kept at the degree of vacuum of 1 Torr or less and a vacuum chamber arranged in a maintenance room while transfer ports of the vacuum clean box and vacuum chamber are kept air-tightly connected to each other. The vacuum clean box is movably arranged.

    Abstract translation: 一种清洁的转印方法，其能够将半导体等安全地转印到各种用于处理半导体的设备，同时保持环境清洁。 在该方法中，半导体在布置在洁净室中的真空清洁箱之间转移并保持在1Torr以下的真空度，在真空室和真空室的输送口配置在维护室内的真空室 保持彼此气密连接。 真空清洁箱可移动地布置。

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