-
公开(公告)号：US5364219A
公开(公告)日：1994-11-15
申请号：US902720
申请日：1992-06-23
IPC分类号： B25J19/00 , B65D85/86 , B65G47/52 , B65G49/00 , B65G49/07 , F24F7/06 , H01L21/673 , H01L21/677 , B65G65/00
CPC分类号： H01L21/67724 , H01L21/67736 , H01L21/67772 , H01L21/67775 , Y10S414/139
摘要： A clean transfer system having a first vacuum chamber with a first transfer port, a first shutter for opening and closing the first transfer port and a first connecting member surrounding the first transfer port. The first connecting member is provided with at least an exterior portion. A second vaccum chamber includes a second transfer port, a second shutter for opening and closing the second transfer port, and a second connecting member surrounding the second transfer port. The second connecting member has at least an exterior portion. A closed space is formed between the first and second connecting members, so that the first and second shutters are movable within the closed space.
摘要翻译： 一种清洁的传送系统，具有具有第一传送口的第一真空室，用于打开和关闭第一传送口的第一快门以及围绕第一传送口的第一连接部件。 第一连接构件设置有至少外部部分。 第二真空室包括第二输送口，用于打开和关闭第二输送口的第二闸门以及围绕第二输送口的第二连接构件。 第二连接构件至少具有外部部分。 在第一和第二连接构件之间形成封闭空间，使得第一和第二快门在封闭空间内是可移动的。
-
公开(公告)号：US5139459A
公开(公告)日：1992-08-18
申请号：US662556
申请日：1991-02-28
CPC分类号： H01L21/67748 , H01L21/67126 , H01L21/67772 , H01L21/67775 , Y10S414/139
摘要： A clean transfer method capable of safely transferring a semiconductor or the like to various apparatus for treating the semiconductor while keeping the environment clean. In the method, the semiconductor is transferred between a vacuum clean box arranged in a clean room and kept at the degree of vacuum of 1 Torr or less and a vacuum chamber arranged in a maintenance room while transfer ports of the vacuum clean box and vacuum chamber are kept air-tightly connected to each other. The vacuum clean box is movably arranged.
摘要翻译： 一种清洁的转印方法，其能够将半导体等安全地转印到各种用于处理半导体的设备，同时保持环境清洁。 在该方法中，半导体在布置在洁净室中的真空清洁箱之间转移并保持在1Torr以下的真空度，在真空室和真空室的输送口配置在维护室内的真空室 保持彼此气密连接。 真空清洁箱可移动地布置。
-
公开(公告)号：US5730573A
公开(公告)日：1998-03-24
申请号：US391609
申请日：1995-02-21
IPC分类号： B65G49/00 , B65G49/07 , F24F3/16 , G11B7/26 , H01L21/02 , H01L21/673 , H01L21/677
CPC分类号： H01L21/67772 , Y10S414/139 , Y10S414/14
摘要： A clean transfer method and an apparatus therefor capable of facilitating storage and transfer of transferred objects by a vacuum clean box and realizing transfer of the objects to various processing units other than a vacuum unit. A vacuum clean box and a clean unit are airtightly connected to each other. The vacuum clean box includes a first shutter acting also as a lid and arranged so as to airtightly close a first opening of the box. The clean unit is provided with a second opening selectively closed by a second shutter. Airtight connection between the vacuum clean box and the clean unit is carried out while keeping the first and second openings closed by the first and second shutters, respectively, to thereby form a closed space therebetween which the first and second shutters face. Then, the closed space is evacuated to a vacuum, followed by opening of only the first shutter. Subsequently, a clean atmosphere which is substantially identical with a clean atmosphere in the clean unit is formed in the closed space and the second shutter is opened to introduce the first and second shutters into the clean unit.
摘要翻译： 一种清洁的转印方法及其装置，其能够通过真空清洁箱促进转印物体的存储和转印，并实现物体转移到除真空单元之外的各种处理单元。 真空清洁箱和清洁单元彼此气密连接。 真空清洁箱包括也用作盖子的第一快门并且被布置成气密地关闭箱子的第一开口。 清洁单元设置有由第二闸门选择性地闭合的第二开口。 在将第一和第二开口分别封闭的第一和第二开口分别保持在真空清洁箱和清洁单元之间进行密封连接，从而在第一和第二百叶窗之间形成封闭空间。 然后，将封闭的空间抽真空，然后仅打开第一挡板。 随后，在封闭空间中形成与清洁单元中的清洁气氛基本相同的清洁气氛，并打开第二挡板以将第一和第二快门引入清洁单元。
-
公开(公告)号：US6136168A
公开(公告)日：2000-10-24
申请号：US135614
申请日：1998-08-18
IPC分类号： B65G49/07 , C23C14/56 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67772 , C23C14/564 , H01L21/67126 , H01L21/67167 , H01L21/6719 , H01L21/67196 , H01L21/67745 , H01L21/67748
摘要： A clean transfer method and an apparatus therefor capable of receiving, storing and transferring a transferred object by means of a vacuum clean box while eliminating arrangement of any vacuum evacuation means and transfer means in the vacuum clean box, as well as facilitating connection of the vacuum clean box to various processing units. The vacuum clean box is free of any vacuum evacuation means and transfer means and is provided with a first opening selectively closed with a first shutter and kept airtight when the first opening is closed with the first shutter. The vacuum clean box is airtightly connected to a sputter unit which is provided with a second opening selectively closed with a second shutter, when the first and second openings are closed with the first and second shutters, respectively, resulting in forming a closed space therebetween through which the first and second shutters are opposite to each other. Then, the first and second openings are released from the first and second shutters to permit the vacuum clean box and sputter unit to communicate with each other.
摘要翻译： 一种清洁的转移方法及其装置，其能够通过真空清洁箱接收，存储和转移被转移的物体，同时消除真空清洁箱中的任何真空排出装置和转印装置的布置，并且便于连接真空 清洁箱到各种处理单元。 真空清洁箱没有任何真空排气装置和传送装置，并且设置有第一开口，第一开口用第一闸门选择性地关闭，并且当第一开口用第一闸门关闭时保持气密。 当第一和第二开口分别用第一和第二快门关闭时，真空清洁箱气密地连接到溅射单元，所述溅射单元设置有选择性地用第二闸门选择性地闭合的第二开口，导致在它们之间形成封闭空间 第一和第二百叶窗彼此相对。 然后，第一和第二开口从第一和第二快门释放以允许真空清洁箱和溅射单元彼此连通。
-
公开(公告)号：US6062808A
公开(公告)日：2000-05-16
申请号：US47283
申请日：1998-03-24
IPC分类号： B65G49/00 , B65G49/07 , F24F3/16 , G11B7/26 , H01L21/02 , H01L21/673 , H01L21/677
CPC分类号： H01L21/67772 , Y10S414/139 , Y10S414/14
摘要： A clean transfer method and an apparatus therefor capable of facilitating storage and transfer of transferred objects by a vacuum clean box and realizing transfer of the objects to various processing units other than a vacuum unit. A vacuum clean box and a clean unit are airtightly connected to each other. The vacuum clean box includes a first shutter acting also as a lid and arranged so as to airtightly close a first opening of the box. The clean unit is provided with a second opening selectively closed by a second shutter. Airtight connection between the vacuum clean box and the clean unit is carried out while keeping the first and second openings closed by the first and second shutters, respectively, to thereby form a closed space therebetween which the first and second shutters face. Then, the closed space is evacuated to a vacuum, followed by opening of only the first shutter. Subsequently, a clean atmosphere which is substantially identical with a clean atmosphere in the clean unit is formed in the closed space and the second shutter is opened to introduce the first and second shutters into the clean unit.
摘要翻译： 一种清洁的转印方法及其装置，其能够通过真空清洁箱促进转印物体的存储和转印，并实现物体转移到除真空单元之外的各种处理单元。 真空清洁箱和清洁单元彼此气密连接。 真空清洁箱包括也用作盖子的第一快门并且被布置成气密地关闭箱子的第一开口。 清洁单元设置有由第二闸门选择性地闭合的第二开口。 在将第一和第二开口分别封闭的第一和第二开口分别保持在真空清洁箱和清洁单元之间进行密封连接，从而在第一和第二百叶窗之间形成封闭空间。 然后，将封闭的空间抽真空，然后仅打开第一挡板。 随后，在封闭空间中形成与清洁单元中的清洁气氛基本相同的清洁气氛，并打开第二挡板以将第一和第二快门引入清洁单元。
-
6.发明授权
公开(公告)号：US5549716A
公开(公告)日：1996-08-27
申请号：US46151
申请日：1993-04-13
申请人： Tetsuo Takahashi , Eisaku Miyauchi , Kunio Mogi , Shinichi Araya
发明人： Tetsuo Takahashi , Eisaku Miyauchi , Kunio Mogi , Shinichi Araya
IPC分类号： H01L21/50 , H01L21/58 , H01L23/495 , H01L21/60 , H01L21/71
CPC分类号： H01L24/83 , H01L24/75 , H01L2224/8319 , H01L2224/8385 , H01L23/49513 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/1433 , Y10T29/41 , Y10T29/49004 , Y10T29/49121 , Y10T29/53178
摘要： A process for manufacturing an electronic component and an apparatus therefor capable of permitting die-bonding, wire-bonding and molding to be successively executed on a through-line. Die-bonding for adhesively mounting IC chips on a lead frame, wire-bonding for connecting bonding pads of the IC chips and the lead frame to each other through lead wires, and molding for forming a resin material into an outer package for covering each of the IC chips are successively executed on a through-line while transferring the lead frame by means of a conveyor.
摘要翻译： 一种用于制造电子部件的方法及其装置，其能够允许在直线上连续执行芯片焊接，引线接合和模制。 用于将IC芯片粘合地安装在引线框架上的芯片接合，用于通过引线将IC芯片和引线框架的接合焊盘彼此连接的引线接合，以及用于将树脂材料形成为外包装的成型 在通过输送机传送引线框的同时，通过直线连续执行IC芯片。
-
公开(公告)号：US4792781A
公开(公告)日：1988-12-20
申请号：US015282
申请日：1987-02-17
CPC分类号： H01C17/006 , H01C17/288 , Y10T29/49082 , Y10T29/49101 , Y10T29/49224
摘要： A chip resistor having configuration and dimensions of high precision and capable of operating with high reliability. The chip resistor includes end electrodes deposited on both side end surfaces of an insulating substrate according to a thin film deposition technique and integrally formed into a substantially C-shape so as to continuously and thoroughly cover the side end surfaces of the substrate. A resistance element may be formed according to either a thick film deposition technique or a thin film deposition technique. Also, a method for manufacturing such a chip resistor is provided.
摘要翻译： 片式电阻器，其结构尺寸精度高，能够高可靠性地工作。 芯片电阻器包括根据薄膜沉积技术沉积在绝缘基板的两个侧端表面上的一体形成为大致C形的端电极，以连续且彻底地覆盖基板的侧端面。 可以根据厚膜沉积技术或薄膜沉积技术形成电阻元件。 此外，提供了一种制造这种片式电阻器的方法。
-
-
-
-
-
-
搜索结果
7 条记录 (耗时 0.025 秒)
