公开(公告)号：US06333932B1

公开(公告)日：2001-12-25

申请号：US08518110

申请日：1995-08-21

申请人： Yasusi Kobayasi ,  Yoshihiro Watanabe ,  Hiroshi Nishida ,  Masami Murayama ,  Naoyuki Izawa ,  Yasuhiro Aso ,  Yoshihiro Uchida ,  Hiromi Yamanaka ,  Jin Abe ,  Yoshihisa Tsuruta ,  Yoshiharu Kato ,  Satoshi Kakuma ,  Shiro Uriu ,  Noriko Samejima ,  Eiji Ishioka ,  Shigeru Sekine ,  Yoshiyuki Karakawa ,  Atsushi Kagawa ,  Mikio Nakayama ,  Miyuki Kawataka ,  Satoshi Esaka ,  Nobuyuki Tsutsui ,  Fumio Hirase ,  Atsuko Suzuki ,  Shouji Kohira ,  Kenichi Okabe ,  Takashi Hatano ,  Yasuhiro Nishikawa ,  Jun Itoh ,  Shinichi Araya

发明人： Yasusi Kobayasi ,  Yoshihiro Watanabe ,  Hiroshi Nishida ,  Masami Murayama ,  Naoyuki Izawa ,  Yasuhiro Aso ,  Yoshihiro Uchida ,  Hiromi Yamanaka ,  Jin Abe ,  Yoshihisa Tsuruta ,  Yoshiharu Kato ,  Satoshi Kakuma ,  Shiro Uriu ,  Noriko Samejima ,  Eiji Ishioka ,  Shigeru Sekine ,  Yoshiyuki Karakawa ,  Atsushi Kagawa ,  Mikio Nakayama ,  Miyuki Kawataka ,  Satoshi Esaka ,  Nobuyuki Tsutsui ,  Fumio Hirase ,  Atsuko Suzuki ,  Shouji Kohira ,  Kenichi Okabe ,  Takashi Hatano ,  Yasuhiro Nishikawa ,  Jun Itoh ,  Shinichi Araya

IPC分类号： H04Q1104

CPC分类号： H04L5/16 ,  H04L2012/5628 ,  H04L2012/5645 ,  H04L2012/5652 ,  H04Q11/0478

摘要： The quality and performance of the connectionless communications system are improved. When a BOM is received, the destination address DA of the L3-PDU stored in the payload of the BOM is retrieved, and the tag information is obtained from the DA (S11). The output message identifier MID is reserved (S12), and the tag information and output MID are assigned to the BOM (S13). Then, the tag information and output MID are written to the table. When a COM is received, the tag information and output MID are retrieved using the MID of the COM as a key, and the information is provided for the COM (S31 and S32). When an EOM is received, the tag information and output MID are retrieved using the MID of the EOM as a key, and the information is provided for the EOM (S41 and S42). Then, the output MID is released (S43).

摘要翻译： 无连接通信系统的质量和性能得到提高。 当接收到BOM时，检索存储在BOM的有效载荷中的L3-PDU的目的地地址DA，并从DA获得标签信息（S11）。 输出消息标识符MID被保留（S12），标签信息和输出MID被分配给BOM（S13）。 然后，将标签信息和输出MID写入表中。 当接收到COM时，使用COM的MID作为密钥检索标签信息和输出MID，并为COM提供信息（S31和S32）。 当接收到EOM时，使用EOM的MID作为密钥检索标签信息和输出MID，并且为EOM提供信息（S41和S42）。 然后，释放输出MID（S43）。

公开(公告)号：US4805110A

公开(公告)日：1989-02-14

申请号：US944251

申请日：1986-12-19

申请人： Tetsuo Takahashi ,  Shinichi Araya

发明人： Tetsuo Takahashi ,  Shinichi Araya

IPC分类号： H05K13/00 ,  H05K3/30 ,  H05K13/04 ,  H05K13/08 ,  G06F15/46 ,  B23P19/04

CPC分类号： H05K13/08 ,  H05K13/04 ,  Y10T29/53013 ,  Y10T29/53039 ,  Y10T29/53183

摘要： A circuit element mounting system and method capable of utilizing data from a CAD device for mounting a circuit element on a printed circuit board to permit mounting in high density or concentration. The system and method include a mounting head for holding a circuit element thereon and mounting it on a printed circuit board. Also, the system and method include controlling moving of the mounting head to a predetermined position on the printed circuit board, depending upon circuit element mounting data input thereto, to thereby cause the mounting head to mount the circuit element on the printed circuit board in a correct manner.

摘要翻译： 一种电路元件安装系统和方法，其能够利用来自CAD装置的数据将电路元件安装在印刷电路板上以允许以高密度或集中的方式安装。 该系统和方法包括用于在其上保持电路元件并将其安装在印刷电路板上的安装头。 此外，该系统和方法包括根据输入到其上的电路元件安装数据来控制安装头移动到印刷电路板上的预定位置，从而使安装头将电路元件安装在印刷电路板上 正确的方式。

公开(公告)号：US07551612B2

公开(公告)日：2009-06-23

申请号：US09277213

申请日：1999-03-26

申请人： Yasusi Kobayashi ,  Yoshihiro Watanabe ,  Hiroshi Nishida ,  Masami Murayama ,  Naoyuki Izawa ,  Yasuhiro Aso ,  Yoshihiro Uchida ,  Hiromi Yamanaka ,  Jin Abe ,  Yoshihisa Tsuruta ,  Yoshiharu Kato ,  Satoshi Kakuma ,  Shiro Uriu ,  Noriko Samejima ,  Eiji Ishioka ,  Shigeru Sekine ,  Yoshiyuki Karakawa ,  Atsushi Kagawa ,  Mikio Nakayama ,  Miyuki Kawataka ,  Satoshi Esaka ,  Nobuyuki Tsutsui ,  Fumio Hirase ,  Atsuko Suzuki ,  Shouji Kohira ,  Kenichi Okabe ,  Takashi Hatano ,  Yasuhiro Nishikawa ,  Jun Itoh ,  Shinichi Araya

发明人： Yasusi Kobayashi ,  Yoshihiro Watanabe ,  Hiroshi Nishida ,  Masami Murayama ,  Naoyuki Izawa ,  Yasuhiro Aso ,  Yoshihiro Uchida ,  Hiromi Yamanaka ,  Jin Abe ,  Yoshihisa Tsuruta ,  Yoshiharu Kato ,  Satoshi Kakuma ,  Shiro Uriu ,  Noriko Samejima ,  Eiji Ishioka ,  Shigeru Sekine ,  Yoshiyuki Karakawa ,  Atsushi Kagawa ,  Mikio Nakayama ,  Miyuki Kawataka ,  Satoshi Esaka ,  Nobuyuki Tsutsui ,  Fumio Hirase ,  Atsuko Suzuki ,  Shouji Kohira ,  Kenichi Okabe ,  Takashi Hatano ,  Yasuhiro Nishikawa ,  Jun Itoh ,  Shinichi Araya

IPC分类号： H04L12/66

CPC分类号： H04L5/16 ,  H04L2012/5628 ,  H04L2012/5645 ,  H04L2012/5652 ,  H04Q11/0478

摘要： A switch station including an ATM switch; a memory storing control data for operations of the switch station; an intra-station device, accommodating a subscriber line, performing communication operation on subscriber ATM cell; a control processor generating control information in link access protocol (LAP) format; and an interface unit converting LAP control information into ATM cell to the intra-station device through the ATM switch, wherein the control information is communicated according to LAP, the intra-station device receives the control information and transmits a direct memory access request to obtain control data stored in the memory, the interface unit obtains and converts the data format of the control data into ATM cell to transmit to the intra-station device through the switch, and the intra-station device performs the communication operation on the subscriber ATM cell based on the control data received through the switch.

摘要翻译： 包括ATM交换机的交换台; 存储用于所述开关站的操作的控制数据的存储器; 站内设备，容纳用户线路，对用户ATM信元进行通信操作; 控制处理器生成链路接入协议（LAP）格式的控制信息; 以及接口单元，其通过ATM交换机将LAP控制信息转换为ATM信元到站内设备，其中根据LAP传送控制信息，站内设备接收控制信息并发送直接存储器访问请求以获得 存储在存储器中的控制数据，接口单元获取控制数据的数据格式并将其转换成ATM信元，通过交换机发送到站内设备，并且站内设备对用户ATM信元进行通信操作 基于通过交换机接收的控制数据。

公开(公告)号：US6098539A

公开(公告)日：2000-08-08

申请号：US076406

申请日：1998-05-12

申请人： Hiroyuki Ohira ,  Shinichi Araya ,  Koji Kudo

发明人： Hiroyuki Ohira ,  Shinichi Araya ,  Koji Kudo

IPC分类号： B41F15/08 ,  B41F15/10 ,  B41F15/36 ,  H05K3/12 ,  B05C17/06

CPC分类号： B41F15/10 ,  H05K3/1216

摘要： Methods and apparatus for adjusting the position of a printing screen having a center of rotation mounted on a screen frame for use in screen printing processes are disclosed. The apparatus includes a screen frame with a printing screen mounted thereon, a screen frame holder, a plurality of first arcuate guides mounted on the screen frame defining an arc with a predetermined circumference defined by a predetermined radius, a plurality of guide rollers mounted on the screen frame holder and corresponding to the plurality of first arcuate guides whereby the plurality of guide rollers movably supports the plurality of first arcuate guides and an adjustment mechanism adapted to urge the screen frame around the center of rotation of the printing screen.

摘要翻译： 公开了用于调整安装在屏幕框架上的旋转中心的打印屏幕的位置用于丝网印刷处理的方法和装置。 该装置包括安装有印刷屏幕的屏幕框架，屏幕框架保持器，安装在屏幕框架上的多个第一弧形引导件，其限定具有由预定半径限定的预定周长的圆弧;多个安装在 并且对应于所述多个第一弓形导向件，由此所述多个导辊可移动地支撑所述多个第一弓形引导件，以及调节机构，其适于围绕所述印刷丝网的旋转中心推动所述筛网框架。

公开(公告)号：US5878484A

公开(公告)日：1999-03-09

申请号：US631827

申请日：1995-12-28

申请人： Shinichi Araya ,  Kouji Kudou ,  Akihiro Katou ,  Hitoshi Nakayama ,  Masakazu Toki ,  Kazuya Abe

发明人： Shinichi Araya ,  Kouji Kudou ,  Akihiro Katou ,  Hitoshi Nakayama ,  Masakazu Toki ,  Kazuya Abe

IPC分类号： H05K13/04 ,  H05K3/30

CPC分类号： H05K13/0413 ,  Y10T29/49131 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A chip mounting apparatus capable of permitting a chip mounting operation to be executed at an increased speed and ensuring continuous running of the apparatus over a long period of time. The apparatus includes a chip observing camera mounted on the side of a chip mounting head, a lighting unit mounted on the side of the chip mounting head to light a background of a chip held on a chip suction nozzle of the head, a reflection unit mounted on the side of the chip mounting head to input an image of the chip to the chip observing camera, feeder and stocker sections each adapted to replaceably held a chip storage package therein, and a package replacement mechanism for carrying out replacement of the chip storage package between both sections.

摘要翻译： 一种芯片安装装置，其能够以更高的速度进行芯片安装操作，并且确保设备在长时间内的连续运行。 该装置包括安装在芯片安装头侧的芯片观察摄像机，安装在芯片安装头侧的照明单元，以照亮保持在头部的芯片吸嘴上的芯片的背景;安装 在芯片安装头的侧面，将芯片的图像输入到芯片观察摄像机，馈送器和储片器部分，每个适配器可更换地保持其中的芯片存储包装;以及封装更换机构，用于执行芯片存储封装 两部分之间。

公开(公告)号：US5549716A

公开(公告)日：1996-08-27

申请号：US46151

申请日：1993-04-13

申请人： Tetsuo Takahashi ,  Eisaku Miyauchi ,  Kunio Mogi ,  Shinichi Araya

发明人： Tetsuo Takahashi ,  Eisaku Miyauchi ,  Kunio Mogi ,  Shinichi Araya

IPC分类号： H01L21/50 ,  H01L21/58 ,  H01L23/495 ,  H01L21/60 ,  H01L21/71

CPC分类号： H01L24/83 ,  H01L24/75 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L23/49513 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1433 ,  Y10T29/41 ,  Y10T29/49004 ,  Y10T29/49121 ,  Y10T29/53178

摘要： A process for manufacturing an electronic component and an apparatus therefor capable of permitting die-bonding, wire-bonding and molding to be successively executed on a through-line. Die-bonding for adhesively mounting IC chips on a lead frame, wire-bonding for connecting bonding pads of the IC chips and the lead frame to each other through lead wires, and molding for forming a resin material into an outer package for covering each of the IC chips are successively executed on a through-line while transferring the lead frame by means of a conveyor.

摘要翻译： 一种用于制造电子部件的方法及其装置，其能够允许在直线上连续执行芯片焊接，引线接合和模制。 用于将IC芯片粘合地安装在引线框架上的芯片接合，用于通过引线将IC芯片和引线框架的接合焊盘彼此连接的引线接合，以及用于将树脂材料形成为外包装的成型 在通过输送机传送引线框的同时，通过直线连续执行IC芯片。

公开(公告)号：US5319846A

公开(公告)日：1994-06-14

申请号：US909311

申请日：1992-07-06

申请人： Tetsuo Takahashi ,  Shinichi Araya ,  Kunio Mogi ,  Kuniaki Takahashi ,  Kouji Kudou ,  Takeshi Itou

发明人： Tetsuo Takahashi ,  Shinichi Araya ,  Kunio Mogi ,  Kuniaki Takahashi ,  Kouji Kudou ,  Takeshi Itou

IPC分类号： H05K13/02 ,  H05K13/04 ,  B23P19/00

CPC分类号： H05K13/0452 ,  H05K13/0084 ,  H05K13/02 ,  Y10T29/53178

摘要： An electronic component feed system capable of feeding an electronic component mounting apparatus with a variety of electronic components such as chips, lead-type electronic components and the like in various forms. A plurality of feeder modules corresponding to sorts of electronic components to be mounted on printed circuit boards are stored in a storage kit and transferred through the storage kit to an electronic component feed section of the mounting apparatus on which a printed circuit board is held. Then, the electronic components are mounted on the printed circuit board by means of a mounting head.

摘要翻译： 一种电子部件供给系统，其能够以各种形式向电子部件安装装置供给各种电子部件，例如芯片，引线型电子部件等。 对应于要安装在印刷电路板上的各种电子元件的多个馈线模块被存储在存储套件中并通过存储套件传送到安装设备的电子元件供给部分，在其上保持印刷电路板。 然后，电子部件通过安装头安装在印刷电路板上。

公开(公告)号：US6152679A

公开(公告)日：2000-11-28

申请号：US264996

申请日：1999-03-09

申请人： Shinichi Araya ,  Kouji Kudou ,  Akihiro Katou ,  Hitoshi Nakayama ,  Masakazu Toki ,  Kazuya Abe

发明人： Shinichi Araya ,  Kouji Kudou ,  Akihiro Katou ,  Hitoshi Nakayama ,  Masakazu Toki ,  Kazuya Abe

IPC分类号： H05K13/04 ,  H01R43/00

CPC分类号： H05K13/0413 ,  Y10T29/49131 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A chip mounting apparatus capable of permitting a chip mounting operation to be executed at an increased speed and ensuring continuous running of the apparatus over a long period of time. The apparatus includes a chip observing camera mounted on the side of a chip mounting head, a lighting unit mounted on the side of the chip mounting head to light a background of a chip held on a chip suction nozzle of the head, a reflection unit mounted on the side of the chip mounting head to input an image of the chip to the chip observing camera, feeder and stocker sections each adapted to replaceably hold a chip storage package therein, and a package replacement mechanism for carrying out replacement of the chip storage package between both sections.

摘要翻译： 一种芯片安装装置，其能够以更高的速度进行芯片安装操作，并且确保设备在长时间内的连续运行。 该装置包括安装在芯片安装头侧的芯片观察摄像机，安装在芯片安装头侧的照明单元，以照亮保持在头部的芯片吸嘴上的芯片的背景;安装 在芯片安装头的一侧，将芯片的图像输入到芯片观察摄像机，馈送器和储片器部分，每个适配器可更换地保持其中的芯片存储包装;以及封装更换机构，用于执行芯片存储封装 两部分之间。

公开(公告)号：US5368193A

公开(公告)日：1994-11-29

申请号：US993734

申请日：1992-12-17

申请人： Tetsuo Takahashi ,  Shinichi Araya ,  Kuniaki Takahashi ,  Kunio Mogi ,  Koji Kudo ,  Takeshi Ito ,  Hiroshi Ikeda

发明人： Tetsuo Takahashi ,  Shinichi Araya ,  Kuniaki Takahashi ,  Kunio Mogi ,  Koji Kudo ,  Takeshi Ito ,  Hiroshi Ikeda

IPC分类号： H05K13/00 ,  H05K13/04 ,  B65G59/00

CPC分类号： H05K13/0434 ,  H05K13/0084 ,  Y10T29/53261

摘要： Electronic component packaging case comprising a substantially plate-like body having a substantially spiral passageway formed in its interior, a linear passageway formed therein as a continuation of an outermost circular portion of the sapiral passageway, an outlet formed therein as a continuation of the linear passageway to communicate with the exterior of the body, a plurality of electronic components received in a row in the spiral passageway, and a plurality of air-intakes for facilitating forwarding of the electronic components along the spiral passageway to the outlet, the air-intakes being formed in the casing body in a manner to communicate between respective circular portions of the spiral passageway and the exterior of the casing body, the case being adapted to be supported on a base of an electronic component supply mechanism with the body standing on the base when the case is used as an electronic component supply source, the outlet being formed at a portion of the casing body which is located at an upper position when the case is supported on the base, the outlet being faced upward, above which outlet the mounting head is adapted to wait. Also, an electronic component supply mechanism for and a method of supplying electronic components to the mounting head by using the packaging case are disclosed.

摘要翻译： 电子部件包装盒包括基本上为板状的主体，该主体具有形成在其内部的基本螺旋形通道，形成在其中的线性通道，作为所述黑色通道的最外圆形部分的延续部，其中形成为所述直线通道 与身体的外部连通，在螺旋通道中一排地容纳的多个电子部件，以及用于促进电子部件沿着螺旋通道转移到出口的多个进气口，进气口为 在壳体内以螺旋形通道的各圆形部分和壳体外部连通的方式形成在壳体内，该壳体适于支撑在电子部件供应机构的基座上，其身体站在基座上， 该壳体用作电子部件供应源，该出口形成在壳体的一部分 当壳体被支撑在基座上时位于上部位置的主体，出口面向上方，安装头的出口适于在其上方等待。 此外，公开了一种电子部件供给机构，以及通过使用包装盒向安装头供给电子部件的方法。

公开(公告)号：US5084962A

公开(公告)日：1992-02-04

申请号：US398514

申请日：1989-08-24

申请人： Kuniaki Takahashi ,  Koji Kudo ,  Shinichi Araya ,  Hitoshi Nakayama

发明人： Kuniaki Takahashi ,  Koji Kudo ,  Shinichi Araya ,  Hitoshi Nakayama

IPC分类号： H05K13/08

CPC分类号： H05K13/08 ,  Y10S269/903 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/53178

摘要： An automatic electronic component mounting apparatus for automatically mounting electronic components on the printed circuit board includes an electronic component supply mechanism for supplying an electronic component to a predetermined position, at least one mounting head movable in a Y direction, a first controlling mechanism for moving the mounting head in the Y direction, a movable frame movable in an X direction, a second controlling mechanism for moving the movable frame in the X direction and controlling the position of the movable frame in the X direction, a support base supported to the movable frame, and a table carrying a printed circuit board and turnable in a .theta. direction. The table is rotatably supported on the support base so that when the X directional position of the movable frame is controlled by the second controlling mechanism, the X directional position of the table is also controlled. A third controlling mechanism is provided for controlling a .theta. directional position of the table. The mounting head holding an electronic component is fed to the predetermined position by the mechanism to mount the electronic component on the printed circuit board.