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126 条记录 (耗时 0.046 秒)

    Organic polymers, electronic devices, and methods
    75.
    发明授权
    Organic polymers, electronic devices, and methods 失效
    有机聚合物，电子器件和方法

    公开(公告)号：US07098525B2

    公开(公告)日：2006-08-29

    申请号：US10434377

    申请日：2003-05-08

    申请人： Feng Bai ,  Todd D. Jones ,  Kevin M. Lewandowski ,  Tzu-Chen Lee ,  Dawn V. Muyres ,  Tommie W. Kelley

    发明人： Feng Bai ,  Todd D. Jones ,  Kevin M. Lewandowski ,  Tzu-Chen Lee ,  Dawn V. Muyres ,  Tommie W. Kelley

    IPC分类号： H01L23/58

    CPC分类号： H01L21/02118 ,  H01G4/18 ,  H01L21/02282 ,  H01L21/02348 ,  H01L21/312 ,  H01L51/0052 ,  H01L51/052 ,  H01L51/0529 ,  H01L51/0537 ,  H05K1/162 ,  Y10T428/31692

    摘要： Organic polymers for use in electronic devices, wherein the polymer includes repeat units of the formula: wherein: each R1 is independently H, an aryl group, Cl, Br, I, or an organic group that includes a crosslinkable group; each R2 is independently H, an aryl group or R4; each R3 is independently H or methyl; each R5 is independently an alkyl group, a halogen, or R4; each R4 is independently an organic group that includes at least one CN group and has a molecular weight of about 30 to about 200 per CN group; and n=0–3; with the proviso that at least one repeat unit in the polymer includes an R4. These polymers are useful in electronic devices such as organic thin film transistors.

    摘要翻译： 用于电子器件的有机聚合物，其中所述聚合物包括下式的重复单元：其中：每个R 1独立地为H，芳基，Cl，Br，I或包括 可交联基团; 每个R 2独立地为H，芳基或R 4; 每个R 3独立地为H或甲基; 每个R 5独立地是烷基，卤素或R 4; 每个R 4独立地是包含至少一个CN基团并且具有每个CN基团约30至约200的分子量的有机基团; 并且n = 0-3; 条件是聚合物中至少一个重复单元包括R 4。 这些聚合物可用于诸如有机薄膜晶体管的电子器件中。

    CURABLE AND CURED COMPOSITIONS
    79.
    发明申请
    CURABLE AND CURED COMPOSITIONS 有权
    可固化和固化的组合物

    公开(公告)号：US20130217804A1

    公开(公告)日：2013-08-22

    申请号：US13881429

    申请日：2011-11-08

    申请人： Christopher J. Campbell ,  Kevin M. Lewandowski ,  Kwame Owusu-Adom

    发明人： Christopher J. Campbell ,  Kevin M. Lewandowski ,  Kwame Owusu-Adom

    IPC分类号： C09J163/00

    CPC分类号： C09J163/00 ,  C08G59/4007 ,  C08G59/50 ,  C08G59/56 ,  C08L63/00

    摘要： Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The reactive liquid modifier is an acetoacetate ester of a polyol that is a vegetable oil, that is prepared from a vegetable oil, or that is a mixture thereof. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings.

    摘要翻译： 描述了包含固化组合物的可固化组合物，固化组合物和制品。 可固化组合物包含a）环氧树脂，b）固化剂，c）反应性液体改性剂，和d）增韧剂。 反应性液体改性剂是作为植物油的多元醇的乙酰乙酸酯，其由植物油制备，或者是其混合物。 固化的组合物可以用作粘合剂如结构粘合剂或聚合物涂层。