公开(公告)号：US20080112147A1

公开(公告)日：2008-05-15

申请号：US11929968

申请日：2007-10-30

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC: H05K7/06 ,  H05K1/02 ,  G01R31/26

CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US20080112146A1

公开(公告)日：2008-05-15

申请号：US11929962

申请日：2007-10-30

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC: H05K7/06 ,  G01R31/26 ,  H05K1/02

CPC classification number: G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US20080090439A1

公开(公告)日：2008-04-17

申请号：US11548797

申请日：2006-10-12

Applicant: Brian Samuel Beaman ,  Joseph Kuczynski ,  Theron Lee Lewis ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

Inventor： Brian Samuel Beaman ,  Joseph Kuczynski ,  Theron Lee Lewis ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC: H01R13/15

CPC classification number: H01R12/7052 ,  H01R12/714 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49208 ,  Y10T29/53174 ,  Y10T29/53265

Abstract: The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for differing coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises at least two members that are coupled together and disposed to form an aperture in between the at least two members, wherein the surface mounted contacts extend from the aperture, and wherein at least one dimension of the at least two members is selected to compensate for a difference between the coefficients of thermal expansion between the socket and a printed circuit board.

Abstract translation: 说明性实施例提供插座，用于制造插座的方法，装置和用于补偿插座和印刷电路板之间的不同热膨胀系数的方法。 插座包括表面安装的触点和细长的外壳。 所述细长壳体包括至少两个联接在一起并设置成在所述至少两个构件之间形成孔的构件，其中所述表面安装的触点从所述孔延伸，并且其中所述至少两个构件的至少一个尺寸被选择 以补偿插座和印刷电路板之间的热膨胀系数之间的差异。

公开(公告)号：US06722032B2

公开(公告)日：2004-04-20

申请号：US09928285

申请日：2001-08-10

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

IPC: H01R4300

CPC classification number: H05K3/326 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06755 ,  G01R1/07307 ,  G01R3/00 ,  H01L2224/1134 ,  H01L2924/00013 ,  H05K3/4015 ,  Y10T29/49004 ,  Y10T29/49124 ,  Y10T29/49169 ,  Y10T29/49815 ,  H01L2224/13099

Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

Abstract translation: 描述电子设备探头。 探针通过将多根线球焊接到扇形基板表面上的接触位置而形成。 电线被切断留下残留物。 其中具有电导体图案的图案化聚合物片材设置在延伸穿过片材中的孔的短截线上。 电线的端部被压扁以将聚合物片材放置在适当位置。 导线连接到聚合物片上的电导体，该电导体转换成聚合物片上的接触垫。 将第二根线球焊接到聚合物片上的垫上并切割以留下第二个短截线。 聚合物片材被激光切割，使得每个第二短截线自由地独立于其它第二螺柱移动。 第二短截线的端部设置在诸如FC芯片的电子设备的接触位置，以测试电子设备。

公开(公告)号：US06708403B2

公开(公告)日：2004-03-23

申请号：US10342167

申请日：2003-01-14

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC: H01R900

CPC classification number: B23K20/007 ,  B23K20/004 ,  B23K2101/40 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07371 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4896 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49194 ,  Y10T29/4921 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/00012

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract translation: 描述了一种方法，其具有提供具有多个可焊接位置的表面的步骤; 使用电线毛细管工具将导线接合到每个可焊接位置; 控制毛细管工具相对于基底的位置; 在将导线形成线接合位置之后，当毛细管工具远离表面移动毛细管工具相对于表面移动时，形成具有预定形状的导线。

公开(公告)号：US06334247B1

公开(公告)日：2002-01-01

申请号：US08872519

申请日：1997-06-11

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC: H01R4300

CPC classification number: G01R1/07371 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10S29/029 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49192 ,  Y10T29/53174 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

Abstract translation: 本发明涉及一种高密度测试探针，其提供用于测试晶片形式的高密度和高性能集成电路或作为离散芯片的装置。 测试探针由嵌入柔性或高模量弹性体材料的细长电导体的密集阵列形成。 使用陶瓷集成电路芯片封装基板等标准封装基板来提供空间变压器。 电线被连接到空间变压器表面上的接触焊盘阵列。 空间变压器由多层集成电路芯片封装基板形成。 电线与接触位置阵列一样密集。 围绕着向外突出的线的阵列设置模具。 液体弹性体设置在模具中以填充电线之间的空间。 弹性体被固化并且模具被去除，留下布置在弹性体中并且与空间变压器电接触的线阵列。空间变压器可以具有一组引脚，这些引脚位于空间变压器的相反表面上， 其中细长导体被接合。 这些销插入第二空间变压器（例如印刷电路板）上的插座中以形成探针组件。 或者，插入器电连接器可以设置在第一和第二空间变压器之间。

公开(公告)号：US6078500A

公开(公告)日：2000-06-20

申请号：US76267

申请日：1998-05-12

Applicant: Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

Inventor： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC: H01L23/31 ,  H01L23/32 ,  H01L23/48 ,  H05K3/32 ,  H05K3/34 ,  H05K7/20

CPC classification number: H01L24/72 ,  H01L23/3107 ,  H01L23/32 ,  H05K3/325 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H05K2201/10393 ,  H05K3/3436 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49162

Abstract: A structure for packaging an electronic device. The package has: an electronic device having a first surface and an opposite second surface, the first surface having a plurality of first electrical contact locations; a substrate having a surface having a plurality of substrate electrical contact locations; a flexible interposer comprising a flexible material and a plurality of elongated electrical conductors disposed therein and extending from the first side to the second side, each of the elongated electrical conductors has a first end at the first side of the flexible interposer and a second end at the second side of the flexible interposer; the flexible interposer is disposed between the electronic device and the substrate; means for pushing the electronic device towards the substrate so that the flexible interposer is disposed between the first surface of the electronic device and the surface of the substrate so that the first ends of the elongated electrical conductors of the flexible interposer contact the first electrical contact locations at the first surface of the electronic device and so that the second ends of the elongated electrical conductors of the flexible interposer contact the substrate electrical contact locations; and, means for aligning the electronic device to the substrate so that the first and the second ends of the elongated electrical conductors of the flexible interposer align to the first electrical contact pads on the electronic device and to the substrate contact locations, respectively.

Abstract translation: 一种用于封装电子设备的结构。 所述封装具有：具有第一表面和相对的第二表面的电子器件，所述第一表面具有多个第一电接触位置; 具有表面的基板，所述表面具有多个基板电接触位置; 柔性插入件，其包括柔性材料和布置在其中并从第一侧延伸到第二侧的多个细长电导体，每个细长电导体在柔性插入件的第一侧具有第一端，第二端在 柔性插入片的第二面; 柔性插入件设置在电子器件和基板之间; 用于将电子装置推向基板的装置，使得柔性插入件设置在电子装置的第一表面和基板的表面之间，使得柔性插入件的细长电导体的第一端接触第一电接触位置 在电子设备的第一表面处，并且使得柔性插入件的细长电导体的第二端接触基板电接触位置; 以及用于将电子器件对准到衬底的装置，使得柔性插入器的细长电导体的第一和第二端分别与电子器件上的第一电接触焊盘和衬底接触位置对准。