Abstract:
An electronic device may be provided with shared antenna structures that can be used to form both a near-field-communications antenna such as a loop antenna and a non-near-field communications antenna such as an inverted-F antenna. The antenna structures may include conductive structures such as metal traces on printed circuits or other dielectric substrates, internal metal housing structures, or other conductive electronic device housing structures. A main resonating element arm may be separated from an antenna ground by an opening. A non-near-field communications antenna return path and antenna feed path may span the opening. A balun may have first and second electromagnetically coupled inductors. The second inductor may have terminals coupled across differential signal terminals in a near-field communications transceiver. The first inductor may form part of the near-field communications loop antenna.
Abstract:
An electronic device has antennas formed from cavity antenna structures. The electronic device may have a metal housing. The metal housing may have an upper housing in which a component such as a display is mounted and a lower housing in which a component such as a keyboard is mounted. Hinges may be used to mount the upper housing to the lower housing for rotation about a rotational axis. Cavity antennas may be formed in a clutch barrel region located between the hinges and running along the rotational axis. A flexible printed circuit may be formed between the cavity antennas. Each cavity antenna may have a first end that is adjacent to one of the hinges and a second end that is adjacent to the flexible printed circuit. Cavity walls for the cavity antennas may be formed from metal housing structures such as metal portions of the lower housing.
Abstract:
An electronic device may be provided with an antenna. The antenna may have an antenna resonating element and an antenna ground. The antenna resonating element may be formed from peripheral conductive housing structures. An audio jack or other connector may be mounted in an opening in the peripheral conductive housing structures. The audio jack may overlap the antenna ground. Contacts in the audio jack may be coupled to an interference mitigation circuit. The interference mitigation circuit may include capacitors coupled to the ground and inductors coupled between the contacts and the capacitors. Radio-frequency signal blocking inductors may be coupled between the interference mitigation circuit and respective ports in an audio circuit.
Abstract:
An electronic device may have wireless circuitry and components such as sensors. The electronic device may have a metal housing having first and second planar rear wall portions separated by a gap. Conductive structures may bridge the gap to electrically couple the first and second rear wall portions. The wireless circuitry may include a hybrid slot inverted-F antenna. The antenna may have an inverted-F antenna resonating element formed from peripheral housing structures that are separated from the second rear wall portion by an opening. The opening may form a C-shaped slot antenna resonating element for the antenna. The sensors may include a fingerprint sensor. The fingerprint sensor may be coupled to a button member in a button. The fingerprint sensor and other portions of the button may overlap the second planar rear wall portion to minimize interference with antenna operation.
Abstract:
An electronic device may be provided with a housing. The housing may have a periphery that is surrounded by peripheral conductive structures such as a segmented peripheral metal member. A segment of the peripheral metal member may be separated from a ground by a slot. An antenna feed may have a positive antenna terminal coupled to the peripheral metal member and a ground terminal coupled to the ground and may feed both an inverted-F antenna structure that is formed from the peripheral metal member and the ground and a slot antenna structure that is formed from the slot. Control circuitry may tune the antenna by controlling adjustable components that are coupled to the peripheral metal member. The adjustable components may include adjustable inductors and adjustable capacitors.
Abstract:
Electronic devices may include antenna structures. The antenna structures may form an antenna having first and second feeds at different locations. A first transceiver may be coupled to the first feed using a first circuit. A second transceiver may be coupled to the second feed using a second circuit. The first and second feeds may be isolated from each other using the first and second circuits. The second circuit may have a notch filter that isolates the second feed from the first feed at operating frequencies associated with the first transceiver. The first circuit may include an adjustable component such as an adjustable capacitor. The adjustable component may be placed in different states depending on the mode of operation of the second transceiver to ensure that the first feed is isolated from the second feed.
Abstract:
A manufacturing system for assembling wireless electronic devices is provided. The manufacturing system may include test stations for testing the radio-frequency performance of components that are to be assembled within the electronic devices. A reference test station may be calibrated using calibration coupons having known radio-frequency characteristics. The calibration coupons may include transmission line structures. The reference test station may measure verification standards to establish baseline measurement data. The verification standards may include circuitry having electrical components with given impedance values. Many verification coupons may be measured to enable testing for a wide range of impedance values. Test stations in the manufacturing system may subsequently measure the verification standards to generate test measurement data. The test measurement data may be compared to the baseline measurement data to characterize the performance of the test stations to ensure consistent test measurements across the test stations.
Abstract:
A test station may include a test host, testing devices, and a test enclosure. A device under test (DUT) having a near-field communications (NFC) antenna may be placed in the test enclosure during production testing. The testing devices may have test antennas that may convey NFC test signals to the DUT in the test enclosure. Distances between test antennas and the DUT may be monitored by measuring path loss from the test antennas throughout testing. The testing station may also include a test unit and an RF test antenna. The test unit may use the RF test antenna to convey RF test signals to the DUT in the test enclosure. The DUT is marked as a passing DUT if gathered test data is satisfactory for each testing device in the test station and distance measurements between the test antennas and the DUT throughout testing are consistent with calibration measurements.
Abstract:
Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and first and second antennas. An electronic device may include a housing. The first antenna may be located at an upper end of the housing and the second antenna may be located at a lower end of the housing. A peripheral conductive member may run around the edges of the housing and may be used in forming the first and second antennas. The radio-frequency transceiver circuitry may have a transmit-receive port and a receive port. Switching circuitry may connect the first antenna to the transmit-receive port and the second antenna to the receiver port or may connect the first antenna to the receive port and the second antenna to the transmit-receive port.
Abstract:
An electronic device may include a ring-shaped housing member defining an interior volume. The ring-shaped housing member may be configured to receive electronic device components. The ring-shaped housing member may include a first element comprising an angled region, and a second element comprising an angled region. A first intermediate element may be placed between the first and second elements, where the intermediate element is secured to internal surfaces of each of the first and second elements such that the first and second elements do not overlap. The first intermediate element may fasten the first and second elements to one another, and electrically isolate the first and second elements from one another.