公开(公告)号：US20240113727A1

公开(公告)日：2024-04-04

申请号：US18324035

申请日：2023-05-25

申请人： MediaTek Inc.

发明人： Nathan Egan

IPC分类号： H03M1/80 ,  H03M1/74

CPC分类号： H03M1/808 ,  H03M1/745

摘要： Current steering digital-to-analog converters (DACs) are described. These DACs are suitable for high speed operation. Weight transistors conventionally used in DACs are replaced with resistors, resulting in a lower RC constant. Further, the resistors cause a smaller voltage drop, thus improving the voltage headroom of the DAC. Additionally, the current steering switches are biased in the triode region, as opposed to the saturation region as in conventional designs. Biasing the switches in the triode region results in a smaller drain-source voltage, which further improves the voltage headroom of the DAC. The triode operation further results in a substantially smaller output impedance, which leads to the output voltage being dictated primarily by the output transistor of the current path. Lastly, reset switches are added which reduce data-dependent memory effects that can otherwise produce distortion.

公开(公告)号：US20240112963A1

公开(公告)日：2024-04-04

申请号：US18366914

申请日：2023-08-08

申请人： MEDIATEK INC.

发明人： Yu-Tung CHEN ,  Pei-Haw TSAO ,  Kuo-Lung FAN ,  Yuan-Fu CHUNG

IPC分类号： H01L21/66

CPC分类号： H01L22/32

摘要： A semiconductor structure is provided. The semiconductor structure includes a semiconductor wafer and a test structure. The semiconductor wafer has a substrate having a scribe line area, a first die area and a second die area. The first die area and the second die area are separated by the scribe line area extending along a first direction. The test structure is disposed in the scribe line area. The test structure includes a test device and a first test pad. The test device has a physical characteristic similar to a semiconductor device fabricated in the first die area or the second die area. The first test pad is electrically connected to the test device. A first distance between the first test pad and the first die area gradually increases from a center region to a peripheral region of the first test pad in the first direction.

公开(公告)号：US11949920B2

公开(公告)日：2024-04-02

申请号：US17871976

申请日：2022-07-24

申请人： MEDIATEK INC.

发明人： Ming-Hsien Lai ,  Min-Hao Chiu ,  Chia-Yun Cheng

IPC分类号： H04N19/89 ,  H04N19/176 ,  H04N19/60 ,  H04N19/70

CPC分类号： H04N19/89 ,  H04N19/176 ,  H04N19/60 ,  H04N19/70

摘要： A video decoding method includes: before residual decoding of a coding unit is completed, referring to available information to determine whether to decode information that an inverse transform (IT) circuit needs for applying inverse transform to transform blocks of the coding unit, and generating a determination result; and controlling coefficient transmission of the coding unit to the IT circuit according to the determination result.

公开(公告)号：US11948895B2

公开(公告)日：2024-04-02

申请号：US17810625

申请日：2022-07-04

申请人： MEDIATEK INC.

发明人： Tzu-Hung Lin ,  Chia-Cheng Chang ,  I-Hsuan Peng ,  Nai-Wei Liu

IPC分类号： H01L23/00 ,  H01L23/043 ,  H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065

CPC分类号： H01L23/562 ,  H01L23/043 ,  H01L23/13 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5383 ,  H01L24/16 ,  H01L25/0655 ,  H01L23/5385 ,  H01L2224/16227

摘要： A semiconductor package structure includes a substrate having a wiring structure. A first semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure. A second semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure, wherein the first semiconductor die and the second semiconductor die are arranged side-by-side. Holes are formed on a surface of the substrate, wherein the holes are located within a projection of the first semiconductor die or the second semiconductor die on the substrate. Further, a molding material surrounds the first semiconductor die and the second semiconductor die, and surfaces of the first semiconductor die and the second semiconductor die facing away from the substrate are exposed by the molding material.

公开(公告)号：US20240107599A1

公开(公告)日：2024-03-28

申请号：US18532333

申请日：2023-12-07

申请人： MEDIATEK INC.

发明人： Yuan-Chieh Lin ,  Chien-Chun Huang Fu

IPC分类号： H04W76/10 ,  H04W28/10 ,  H04W60/04

CPC分类号： H04W76/10 ,  H04W28/10 ,  H04W60/04 ,  H04W84/042

摘要： A method to establish and activate an MA PDU session for data transmission over a selected access is proposed. UE initiates a UE-requested PDU session establishment procedure. Once the UE receives a PDU SESSION ESTABLISHMENT ACCEPT message with ATSSS container IE, the UE can consider the MA PDU session has been activated and user plane resources are successfully established on the selected access. A method to convert an SA PDU session to an MA PDU session for data transmission over a selected access is proposed. UE initiates a UE-requested PDU session modification procedure. Once the UE receives a PDU SESSION MODIFICATION COMMAND message with ATSSS container IE, the UE can consider the MA PDU session has been converted from the SA PDU session and user plane resources are successfully established on the selected access.

公开(公告)号：US20240107597A1

公开(公告)日：2024-03-28

申请号：US18469492

申请日：2023-09-18

申请人： MEDIATEK INC.

发明人： Abhishek Roy ,  Hao Bi ,  CHIA-CHUN HSU

IPC分类号： H04W76/10 ,  H04W76/20

CPC分类号： H04W76/10 ,  H04W76/20

摘要： This invention presents methods leveraging artificial intelligence and machine learning (AI/ML) models to enhance wireless communications efficiency in 5G/6G networks. The processes involve storing, configuring, and transferring AI/ML models within base stations and user equipment devices (UE), allowing for localized decision-making and improved network performance. Features include dynamic model activation/deactivation, model compression/decompression, and encoding/decoding method negotiation. Periodic or condition-driven model updates ensure responsiveness to network changes, while model replacements enable upgrades and iterations. The system facilitates seamless handovers between base stations, with information sharing about model capabilities and UE specifics. Model storage and configuration can also occur in the UE, empowering it for local decision-making in variable or challenging network conditions. The techniques contribute to significant performance, efficiency, and reliability improvements in 5G/6G wireless networks.

公开(公告)号：US20240107381A1

公开(公告)日：2024-03-28

申请号：US18371657

申请日：2023-09-22

申请人： MediaTek Inc.

发明人： Shengquan Hu ,  Jianhan Liu ,  Thomas Edward Pare, JR.

IPC分类号： H04W28/20 ,  H04L5/00 ,  H04W28/08

CPC分类号： H04W28/20 ,  H04L5/0041 ,  H04L5/0048 ,  H04W28/0983

摘要： Various schemes pertaining to distributed-tone resource unit (dRU) operation for wide bandwidths next-generation wireless local area network (WLAN) systems are described. A communication entity generates at least one dRU or both the at least one dRU and at least one regular resource unit (rRU). The communication entity then communicates wirelessly using the at least one dRU or using the at least one dRU and the at least one rRU in a 160 MHz, 240 MHz, 320 MHz, 480 MHz or 640 MHz bandwidth.

公开(公告)号：US20240106615A1

公开(公告)日：2024-03-28

申请号：US18371168

申请日：2023-09-21

申请人： MediaTek Inc.

发明人： Shengquan Hu ,  Jianhan Liu ,  Thomas Edward Pare, JR.

IPC分类号： H04L5/00

CPC分类号： H04L5/0094 ,  H04L5/0046

摘要： Techniques pertaining to distributed-tone resource unit (RU) designs for wide distribution bandwidth 160 MHz in wireless communications are described. An apparatus (e.g., station (STA)) generates a distributed-tone resource unit (dRU) of 52 tones or more using a 26-tone dRU as a building block. The apparatus then performs a wireless communication in a 160 MHz distribution bandwidth with the dRU.

公开(公告)号：US20240106510A1

公开(公告)日：2024-03-28

申请号：US18369488

申请日：2023-09-18

申请人： MEDIATEK INC.

发明人： Abhishek Roy ,  Vaibhav Pradeep Bhosale ,  Gyu Bum Kyung ,  Chia-Chun Hsu

IPC分类号： H04B7/06

CPC分类号： H04B7/0639 ,  H04B7/06958

摘要： In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be wireless equipment. The wireless equipment selects a first subset of beams to be utilized for beam management. The beams are from a set of first type of beams used for communication with a base station or a UE. The wireless equipment measures signals transmitted on a second subset of beams. The beams are from the set of first type of beams or from a set of second type of beams. The wireless equipment measures the signals over a time window. The wireless equipment inputs the measurements to a computational model. The wireless equipment receives predictions of channel measurements on the first subset of beams from the computational model.

公开(公告)号：US11942439B2

公开(公告)日：2024-03-26

申请号：US17744297

申请日：2022-05-13

申请人： MediaTek Inc.

发明人： Tzu-Hung Lin ,  Yung-Chang Lien

IPC分类号： H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538 ,  H01L25/065

CPC分类号： H01L23/562 ,  H01L23/16 ,  H01L23/3185 ,  H01L23/3675 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16235 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3511 ,  H01L2924/3512

摘要： A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring structure and is surrounded by a molding material. The frame is disposed in the molding material and surrounds the substrate. The redistribution layer is disposed over the substrate and electrically coupled to the wiring structure. The first semiconductor die is disposed over the redistribution layer.