公开(公告)号：US11942439B2

公开(公告)日：2024-03-26

申请号：US17744297

申请日：2022-05-13

Applicant: MediaTek Inc.

Inventor： Tzu-Hung Lin ,  Yung-Chang Lien

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/562 ,  H01L23/16 ,  H01L23/3185 ,  H01L23/3675 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16235 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3511 ,  H01L2924/3512

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring structure and is surrounded by a molding material. The frame is disposed in the molding material and surrounds the substrate. The redistribution layer is disposed over the substrate and electrically coupled to the wiring structure. The first semiconductor die is disposed over the redistribution layer.

公开(公告)号：US20220278055A1

公开(公告)日：2022-09-01

申请号：US17744297

申请日：2022-05-13

Applicant: MediaTek Inc.

Inventor： Tzu-Hung Lin ,  Yung-Chang Lien

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/16 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring structure and is surrounded by a molding material. The frame is disposed in the molding material and surrounds the substrate. The redistribution layer is disposed over the substrate and electrically coupled to the wiring structure. The first semiconductor die is disposed over the redistribution layer.

公开(公告)号：US11362044B2

公开(公告)日：2022-06-14

申请号：US15930645

申请日：2020-05-13

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung Lin ,  Yung-Chang Lien

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/16 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring structure and is surrounded by a molding material. The frame is disposed in the molding material and surrounds the substrate. The redistribution layer is disposed over the substrate and electrically coupled to the wiring structure. The first semiconductor die is disposed over the redistribution layer.