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公开(公告)号：US20250158285A1
公开(公告)日：2025-05-15
申请号：US19027620
申请日：2025-01-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Anton Sergeevich LUKYANOV , Alexander Gennadievich CHERNOKALOV , Youngho RYU , Chongmin LEE
Abstract: Provided is a system for contactless signal transmission through a rotary joint including a transmitter on a first part of the rotary joint and a receiver on a second part of the rotary joint, the first and second parts being opposite and separated by an air gap, surfaces of the first and second parts facing each other being perpendicular to a rotation axis of the rotary joint, and a choke in the air gap contacting one of the first and second parts, the choke including a printed circuit board having a through hole coaxial with the rotation axis, and an electromagnetic chip, each of the transmitter and the receiver includes a hollow waveguide, at least the transmitter includes in a waveguide polarizer, a diameter of the waveguide polarizer being smaller than a diameter of the round hollow waveguide, and two longitudinal diametrically opposite grooves in walls of the waveguide polarizer.
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公开(公告)号：US20250158002A1
公开(公告)日：2025-05-15
申请号：US18939655
申请日：2024-11-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： AE-NEE JANG , Haseob SEONG
Abstract: A semiconductor package may include a first semiconductor chip and a second semiconductor chip on the first semiconductor chip. The first semiconductor chip may include upper bonding pads in an upper portion thereof, and the second semiconductor chip may include lower bonding pads in a lower portion thereof. The first semiconductor chip and the second semiconductor chip may be connected to each other by the upper bonding pads and the lower bonding pads, which are in direct contact with each other. The upper bonding pads may include a first pad, a dummy pad, and a second pad, which are arranged to be adjacent to each other in a first direction, and the first pads and the second pads are configured to be applied with voltages of different levels from each other.
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公开(公告)号：US20250157967A1
公开(公告)日：2025-05-15
申请号：US18941796
申请日：2024-11-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ae-Nee JANG , Haseob SEONG
Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip thereon. The first semiconductor chip includes upper bonding pads at an upper portion thereof. The second semiconductor chip includes lower bonding pads at a lower portion thereof. The first semiconductor chip and the second semiconductor chip are connected through direct contact between the upper bonding pads and lower bonding pads. The upper bonding pads include edge bonding pads on an edge region of the first semiconductor chip and arranged in a first direction parallel to an edge of the first semiconductor chip. The edge bonding pads include a first edge pad and a second edge pad disposed adjacent to each other. The each of the first and second edge pads is one of a power pad, a ground pad, and a dummy pad, and the first and second edge pads are of the same type.
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公开(公告)号：US20250157925A1
公开(公告)日：2025-05-15
申请号：US18675252
申请日：2024-05-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyungeun Choi , Jinwoo Han , Seokhan Park
IPC: H01L23/528 , H10B12/00
Abstract: A semiconductor device includes: a substrate including a memory cell region and a contact region; active layers extending in a first horizontal direction and stacked to be spaced apart from each other in a vertical direction on the memory cell region; gate electrodes disposed between the active layers, extending in a second horizontal direction, and stacked to be spaced apart from each other in the vertical direction; connecting conductive lines extending in the first horizontal direction and stacked to be spaced apart from each other in the vertical direction, on the contact region; and vertical conductive patterns extending in the vertical direction and in contact with the active layers, on the memory cell region. Each of the connecting conductive lines are disposed on the same level, among the gate electrodes, and are in contact with the gate electrodes spaced apart from each other in the first horizontal direction.
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公开(公告)号：US20250157879A1
公开(公告)日：2025-05-15
申请号：US18746857
申请日：2024-06-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dongkyun KIM , Sungchan KANG , Daehyuk SON , Hotaik LEE , Seogwoo HONG
IPC: H01L23/427
Abstract: A semiconductor apparatus includes a semiconductor chip including a semiconductor integrated circuit, a cooling channel at least partially in the semiconductor chip and including a fine pattern on at least a portion of a wall surface of the cooling channel, the fine pattern configured to generate a capillary pressure that induces a flow of a liquid coolant, and a temperature controller configured to control a supply temperature of the liquid coolant supplied to the cooling channel.
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Patent Agency Ranking
公开(公告)号：US20250157867A1
公开(公告)日：2025-05-15
申请号：US18883053
申请日：2024-09-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongkook KIM , Heungkyu KWON , Youngchul KIM , Choonheung LEE , Donghyun CHA , Junghwa KIM , Junso PAK , Kyounghoon LEE , Jaegwon JANG , Hangchul CHOI , Heejung CHOI , Kyojin HWANG
Abstract: A semiconductor package that includes an upper package including a first package substrate, a first semiconductor chip mounted on the first package substrate, and a first molding layer surrounding the first semiconductor chip; a printed circuit board (PCB) on which the upper package is mounted in a central region; and a stiffener positioned on a top surface of the PCB and including an opening. A top surface of the PCB contacts a bottom surface of the stiffener in at least part of edge regions of the PCB. In the central region of the PCB and in edge regions other than the at least part of edge regions of the PCB, a top surface of the PCB is apart from the bottom surface of the stiffener in a vertical direction, and the opening of the stiffener overlaps the upper package in the vertical direction.
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公开(公告)号：US20250157386A1
公开(公告)日：2025-05-15
申请号：US19025291
申请日：2025-01-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunho KIM , Taekgyu LEE
IPC: G09G3/20
Abstract: Disclosed is a display device including a display module, a scaler that outputs image data in a pre-defined format by processing an image signal input through an input source, and a timing controller that controls an operation of the display module based on the image data output from the scaler. The pre-defined format includes an image frame period in which the image data is included and a blank period in which the image data is not included. The scaler outputs a panel on signal for turning-on the display module by using the blank period, and the timing controller turns on the display module based on the panel on signal included in the blank period being identified.
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公开(公告)号：US20250157135A1
公开(公告)日：2025-05-15
申请号：US19025567
申请日：2025-01-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungsoo CHOI , Beomsu Kim , Sungoh Kim , Donghyun Yeom , Jihyun Kim , Hyungsok Yeo , Boyoung Lee , Sanghun Lee
Abstract: A wearable electronic device includes a camera; a display; a sensor; memory; and a processor configured to cause the device to obtain an image via the camera; perform pre-processing that calibrates a distortion area, of the image, generated from the camera; input, into a deep learning model, a default matrix related to a distance of an object in an image, first information input by a user, second information, obtained via the sensor, related to the user, or third information, obtained via the sensor, related to a surrounding environment; obtain, from the model, a matrix for adjusting the distance of the object; adjust the distance of the object based on the matrix; and display the image, wherein the model is trained based on user information or surrounding environment information, and at least one matrix for adjusting a distance of an object based on the user information or the surrounding environment information.
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公开(公告)号：US20250157055A1
公开(公告)日：2025-05-15
申请号：US18944556
申请日：2024-11-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Xiongfeng PENG , Zhihua LIU , Qiang WANG , Soon-Yong CHO
IPC: G06T7/246 , G06T7/215 , G06V10/74 , G06V10/764 , G06V10/77 , G06V10/776 , G06V10/82 , G06V20/70
Abstract: A scene flow estimation method includes: inputting a frame pair into an artificial intelligence (AI) network, and obtaining therefrom a motion embedding feature and a non-occluded-category label embedding feature corresponding to a target pixel in the frame pair; and estimating a scene flow corresponding to the frame pair based on the motion embedding feature and the non-occluded-category label embedding feature, the frame pair includes a first frame and a second frame, the first frame including a first color image and a first depth image and the second frame including a second color image and a second depth image, the non-occluded-category label embedding feature includes category information of an object corresponding to a pixel pair in the frame pair, the pixel pair includes a first pixel of the first frame and a second pixel of the second frame, and the second pixel corresponds to the first pixel.
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公开(公告)号：US20250157009A1
公开(公告)日：2025-05-15
申请号：US18824405
申请日：2024-09-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Shinhaeng KIM , Woonsung PARK , Wonseok SONG
Abstract: An electronic apparatus including memory storing one or more instructions and at least one processor that is connected with the memory and controls the electronic apparatus, wherein the at least one processor is configured to, by executing the one or more instructions, identify an area where a motion is maintained in an input image, identify motion information of the identified area and representative motion information of the identified area, identify a motion correction value based on the identified motion information and the identified representative motion information, perform motion compensation for an input frame included in the input image by applying the identified motion correction value to the identified area, obtain an interpolation frame by applying the identified motion correction value to the identified area, and obtain an output image based on the input frame for which the motion compensation was performed and the obtained interpolation frame.
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