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公开(公告)号：US20250157867A1
公开(公告)日：2025-05-15
申请号：US18883053
申请日：2024-09-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongkook KIM , Heungkyu KWON , Youngchul KIM , Choonheung LEE , Donghyun CHA , Junghwa KIM , Junso PAK , Kyounghoon LEE , Jaegwon JANG , Hangchul CHOI , Heejung CHOI , Kyojin HWANG
Abstract: A semiconductor package that includes an upper package including a first package substrate, a first semiconductor chip mounted on the first package substrate, and a first molding layer surrounding the first semiconductor chip; a printed circuit board (PCB) on which the upper package is mounted in a central region; and a stiffener positioned on a top surface of the PCB and including an opening. A top surface of the PCB contacts a bottom surface of the stiffener in at least part of edge regions of the PCB. In the central region of the PCB and in edge regions other than the at least part of edge regions of the PCB, a top surface of the PCB is apart from the bottom surface of the stiffener in a vertical direction, and the opening of the stiffener overlaps the upper package in the vertical direction.
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公开(公告)号：US20250157958A1
公开(公告)日：2025-05-15
申请号：US18947424
申请日：2024-11-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongkook KIM , Heungkyu KWON , Junghwan JANG , Youngcheol KIM , Daehyun KIM , Choonheung LEE , Kwangho LEE , Hangchul CHOI
IPC: H01L23/00 , H01L21/56 , H01L23/498 , H01L25/18 , H10B80/00
Abstract: A semiconductor package and a method of manufacturing the semiconductor package are provided. The semiconductor package includes an interposer, a semiconductor chip on the interposer, an under bump metal (UBM) pad between the interposer and the semiconductor chip and including an upper UBM pad and a lower UBM pad, and a connection member between the UBM pad and the semiconductor chip, wherein the connection member is in contact with one or more side surfaces of the UBM pad and is in contact with the interposer.
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