公开(公告)号：US20250157958A1

公开(公告)日：2025-05-15

申请号：US18947424

申请日：2024-11-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongkook KIM ,  Heungkyu KWON ,  Junghwan JANG ,  Youngcheol KIM ,  Daehyun KIM ,  Choonheung LEE ,  Kwangho LEE ,  Hangchul CHOI

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L25/18 ,  H10B80/00

Abstract: A semiconductor package and a method of manufacturing the semiconductor package are provided. The semiconductor package includes an interposer, a semiconductor chip on the interposer, an under bump metal (UBM) pad between the interposer and the semiconductor chip and including an upper UBM pad and a lower UBM pad, and a connection member between the UBM pad and the semiconductor chip, wherein the connection member is in contact with one or more side surfaces of the UBM pad and is in contact with the interposer.