SELF-CHARGING SENSOR MODULE AND ELECTRONIC DEVICE COMPRISING SAME

    公开(公告)号:US20230246520A1

    公开(公告)日:2023-08-03

    申请号:US18295473

    申请日:2023-04-04

    CPC classification number: H02K7/1807 H02J50/001 G01D21/00

    Abstract: A sensor module may be mounted in an electronic device including a rotating body rotatably arranged inside a housing. The sensor module may include a stator fixed in the housing; an energy harvester including a rotor mounted in the rotating body, at a position to at least partially face the stator; and a sensor arranged inside the rotating body together with the rotor, wherein, as the rotating body rotates, the rotor may be configured to rotate about the stator and generate an induced current and supply same to the sensor. The sensor may be configured to detect, using power based on the induced current, environmental information of the inside of the rotating body or operating state information of the rotating body.

    WIRELESS POWER TRANSMITTING DEVICE INCLUDING IMPEDANCE MATCHING CIRCUIT AND WIRELESS POWER TRANSMISSION METHOD

    公开(公告)号:US20230101152A1

    公开(公告)日:2023-03-30

    申请号:US17954825

    申请日:2022-09-28

    Abstract: A wireless power transmitting device includes: a transistor configured to output a signal corresponding to a set operating frequency, based on an input signal and a driving voltage; a matching circuit connected with the transistor; a transmission coil connected with the matching circuit; an LC resonance circuit connected in parallel between the transistor and the matching circuit and configured to transfer a signal corresponding to at least one harmonic frequency of the operating frequency; and an impedance sensing circuit connected with the LC resonance circuit and configured to sense a load impedance of the wireless power transmitting device based on the signal corresponding to the at least one harmonic frequency transferred through the LC resonance circuit. The matching circuit is configured to provide impedance matching with the sensed load impedance by adjusting an impedance of the matching circuit or an impedance of the transmission coil.

    PERFORMING A COMPUTER VISION TASK

    公开(公告)号:US20250078495A1

    公开(公告)日:2025-03-06

    申请号:US18933406

    申请日:2024-10-31

    Abstract: The present disclosure relates to a computer-implemented method of performing a computer vision task. The computer-implemented method comprises: receiving a corrupted image from a camera; estimating a corruption type of the corrupted image using a corruption identification module; obtaining normalisation parameters associated with the estimated corruption type; updating a computer vision model, trained to perform the task, by replacing normalisation parameters of the computer vision model with the obtained normalisation parameters; and performing the task using the updated computer vision model.

    SEMICONDUCTOR PACKAGE INCLUDING PROTECTIVE LAYER WITH FILLERS

    公开(公告)号:US20250069969A1

    公开(公告)日:2025-02-27

    申请号:US18627071

    申请日:2024-04-04

    Inventor: Daehyun KIM

    Abstract: A semiconductor package includes a substrate including an interconnection, a chip stack including a plurality of semiconductor chips stacked on the substrate, bonding wires electrically coupling the plurality of semiconductor chips to the interconnection, a protective layer on the chip stack and including a first insulating resin and first fillers dispersed in the first insulating resin, a mold at least partially covering the chip stack and the protective layer, the mold including a second insulating resin and second fillers dispersed in the second insulating resin, and connection bumps electrically coupled to the interconnection below the substrate. A first average diameter of the first fillers is smaller than a second average diameter of the second fillers. A first concentration of the first fillers in the first insulating resin is lower than a second concentration of the second fillers in the second insulating resin.

    ELECTRONIC APPARATUS AND SENSOR BALL REGISTRATION METHOD OF ELECTRONIC APPARATUS

    公开(公告)号:US20230313433A1

    公开(公告)日:2023-10-05

    申请号:US18311559

    申请日:2023-05-03

    CPC classification number: D06F34/28 D06F34/05 D06F34/26

    Abstract: Provided are an electronic apparatus and a sensor ball registration method of the electronic apparatus. The electronic apparatus according to examples of the present disclosure comprises: a communication circuit; a display; an actuator; a speaker; and a controller electrically connected to the communication circuit, the display, the actuator, and the speaker. The controller may be configured to: control so that a first guidance message is output through the display or the speaker in accordance with a sensor ball registration mode selection input; check sensor ball identification information included in a sensor ball-related message received through the communication circuit during a set period of time; control so that a second guidance message is output through the display or the speaker based on the set period of time expiring; and control so that, after the set period of time has expired, the sensor ball corresponding to the sensor ball-related message received during the set period of time is registered based on at least one sensor ball-related message received from the sensor ball.

    SEMICONDUCTOR DEVICES
    8.
    发明申请

    公开(公告)号:US20220181457A1

    公开(公告)日:2022-06-09

    申请号:US17340667

    申请日:2021-06-07

    Abstract: A semiconductor device may include a substrate including a recess, a gate insulation layer on a surface of the recess, an impurity barrier layer on a surface of the gate insulation layer to cover the surface of the gate insulation layer, a first gate pattern on impurity barrier layer to fill a lower portion of the recess, a second gate pattern on the first gate pattern in the recess, a capping insulation pattern on the second gate pattern to fill the recess, and impurity regions at the substrate adjacent to an upper sidewall of the recess. The impurity barrier layer may have a concentration of nitrogen higher than a concentration of nitrogen included in the gate insulation layer. The second gate pattern may include a material different from a material of the first gate pattern. A lower surface of the impurity regions may be higher than an upper surface of the first gate pattern. Thus, the semiconductor device may have good characteristics.

    ELECTRONIC DEVICE INCLUDING DIELECTRIC HEATING DEVICE

    公开(公告)号:US20240397660A1

    公开(公告)日:2024-11-28

    申请号:US18798207

    申请日:2024-08-08

    Abstract: An electronic device is provided. The electronic device includes a power source, memory storing one or more computer programs, a dielectric heating device, and one or more processors communicatively coupled to the power source, the memory, and the dielectric heating device, wherein the dielectric heating device includes a first electrode connected to the power source, and a second electrode connected to the power source and arranged to be apart from the first electrode in a direction away from one surface of the first electrode, wherein the second electrode includes a plurality of second unit electrodes arranged at intervals in a longitudinal direction and a width direction, wherein the dielectric heating device heats an object to be heated arranged between the first electrode and the second electrode, and wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to determine an electrode distance, which is a linear distance between the first electrode and the second unit electrodes, based on an estimated moisture content value of a partial region of the object being heated arranged on each of the second unit electrodes.

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